loadpatents
Patent applications and USPTO patent grants for Chang; Fa-Yuan.The latest application filed is for "semiconductor fabrication method suitable for mems".
Patent | Date |
---|---|
Semiconductor fabrication method suitable for MEMS Grant 8,084,361 - Huang , et al. December 27, 2 | 2011-12-27 |
Process for wafer bonding Grant 7,732,299 - Chang , et al. June 8, 2 | 2010-06-08 |
Ultra-fine pitch probe card structure Grant 7,696,766 - Cheng , et al. April 13, 2 | 2010-04-13 |
Semiconductor Fabrication Method Suitable For Mems App 20080299769 - Huang; Tsung-Cheng ;   et al. | 2008-12-04 |
Process For Wafer Bonding App 20080194076 - Chang; Fa-Yuan ;   et al. | 2008-08-14 |
Ultra-fine pitch probe card structure App 20080180123 - Cheng; Hsu Ming ;   et al. | 2008-07-31 |
Three dimensional structure formed by using an adhesive silicon wafer process App 20060189023 - Chang; Fa-Yuan ;   et al. | 2006-08-24 |
Deep trench etching using HDP chamber App 20050029221 - Chang, Fa-Yuan ;   et al. | 2005-02-10 |
Wafer transfer system with temperature control apparatus Grant 6,679,064 - Chang , et al. January 20, 2 | 2004-01-20 |
Wafer Transfer System With Temperature Control Apparatus App 20030209014 - Chang, Chih-Wei ;   et al. | 2003-11-13 |
In-situ sequential silicon containing hard mask layer/silicon layer plasma etch method Grant 6,069,091 - Chang , et al. May 30, 2 | 2000-05-30 |
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