Chandran; Biju

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chandran; Biju.The latest application filed is for "modified chip attach process".

Company Profile

0.19.18

Chandran; Biju - Chandler AZ
Chandran; Biju - Vienna VA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Modified chip attach process Grant 8,324,737 - Chandran , et al. December 4, 2	2012-12-04
Modified Chip Attach Process App 20110156254 - Sane; Sandeep B. ; et al.	2011-06-30
Modified chip attach process Grant 7,901,982 - Sane , et al. March 8, 2	2011-03-08
Compliant integrated circuit package substrate Grant 7,745,917 - Chandran , et al. June 29, 2	2010-06-29
Compliant Integrated Circuit Package Substrate App 20100133679 - Chandran; Biju ; et al.	2010-06-03
Compliant integrated circuit package substrate Grant 7,691,667 - Chandran , et al. April 6, 2	2010-04-06
Modified Chip Attach Process App 20090275175 - Sane; Sandeep B. ; et al.	2009-11-05
Modified chip attach process Grant 7,579,213 - Sane , et al. August 25, 2	2009-08-25
Modified Chip Attach Process App 20080057628 - Sane; Sandeep B. ; et al.	2008-03-06
Microelectronic device interconnects Grant 7,314,817 - Dias , et al. January 1, 2	2008-01-01
Compliant integrated circuit package substrate App 20070296072 - Chandran; Biju ; et al.	2007-12-27
Modified chip attach process and apparatus Grant 7,304,391 - Sane , et al. December 4, 2	2007-12-04
Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby Grant 7,235,886 - Chandran , et al. June 26, 2	2007-06-26
Method of interconnecting die and substrate Grant 7,122,403 - Chandran , et al. October 17, 2	2006-10-17
Microelectronic device interconnects Grant 7,078,822 - Dias , et al. July 18, 2	2006-07-18
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices Grant 7,064,014 - Dias , et al. June 20, 2	2006-06-20
Modified chip attach process and apparatus App 20060003496 - Sane; Sandeep B. ; et al.	2006-01-05
Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices Grant 6,955,947 - Dias , et al. October 18, 2	2005-10-18
Microelectronic device interconnects App 20050208280 - Dias, Rajen ; et al.	2005-09-22
Modified chip attach process and apparatus Grant 6,919,224 - Sane , et al. July 19, 2	2005-07-19
Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses App 20050116329 - Chandran, Biju ; et al.	2005-06-02
Modified chip attach process and apparatus App 20050070044 - Sane, Sandeep B. ; et al.	2005-03-31
Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices App 20050040498 - Dias, Rajen ; et al.	2005-02-24
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices App 20050012205 - Dias, Rajen ; et al.	2005-01-20
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices Grant 6,812,548 - Dias , et al. November 2, 2	2004-11-02
Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices Grant 6,790,709 - Dias , et al. September 14, 2	2004-09-14
Contact array for semiconductor package Grant 6,752,634 - Gonzalez , et al. June 22, 2	2004-06-22
Package retention module coupled directly to a socket Grant 6,672,892 - Chandran , et al. January 6, 2	2004-01-06
Microelectronic device interconnects App 20030234277 - Dias, Rajen ; et al.	2003-12-25
Package retention module coupled directly to a socket Grant 6,600,652 - Chandran , et al. July 29, 2	2003-07-29
Semiconductor package with low resistance package-to-die interconnect scheme for reduced die stresses App 20030116860 - Chandran, Biju ; et al.	2003-06-26
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices App 20030102526 - Dias, Rajen ; et al.	2003-06-05
Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices App 20030104679 - Dias, Rajen ; et al.	2003-06-05
Package retention module coupled directly to a socket App 20030063440 - Chandran, Biju ; et al.	2003-04-03
Package retention module coupled directly to a socket App 20030064618 - Chandran, Biju ; et al.	2003-04-03
Contact array for semiconductor package App 20030060061 - Gonzalez, Carlos A. ; et al.	2003-03-27
Heat sink system Grant 6,310,773 - Yusuf , et al. October 30, 2	2001-10-30

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