CHAN; Yu-Chen

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHAN; Yu-Chen.The latest application filed is for "semiconductor device structure and methods of forming the same".

Company Profile

6.5.10

CHAN; Yu-Chen - Taichung TW
Chan; Yu-Chen - Taichung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Structure And Methods Of Forming The Same App 20220270970 - CHAN; Yu-Chen ; et al.	2022-08-25
Protection Liner On Interconnect Wire To Enlarge Processing Window For Overlying Interconnect Via App 20220238434 - Yang; Shin-Yi ; et al.	2022-07-28
Two 2d Capping Layers On Interconnect Conductive Structure To Increase Interconnect Structure Reliability App 20220157710 - Li; Shu-Wei ; et al.	2022-05-19
Protection liner on interconnect wire to enlarge processing window for overlying interconnect via Grant 11,309,241 - Yang , et al. April 19, 2	2022-04-19
Graphene-Assisted Low-Resistance Interconnect Structures and Methods of Formation Thereof App 20220020694 - Yang; Shin-Yi ; et al.	2022-01-20
Semiconductor Device Including Liner Structure App 20210407852 - Yeh; Ching-Fu ; et al.	2021-12-30
Protection Liner On Interconnect Wire To Enlarge Processing Window For Overlying Interconnect Via App 20210398898 - Yang; Shin-Yi ; et al.	2021-12-23
Graphene-assisted low-resistance interconnect structures and methods of formation thereof Grant 11,081,447 - Yang , et al. August 3, 2	2021-08-03
Method of forming interconnection structure Grant 11,011,467 - Chan , et al. May 18, 2	2021-05-18
Graphene-Assisted Low-Resistance Interconnect Structures and Methods of Formation Thereof App 20210082832 - Yang; Shin-Yi ; et al.	2021-03-18
Method Of Forming Interconnection Structure App 20200373239 - CHAN; Yu-Chen ; et al.	2020-11-26
Interconnection structure and method for forming the same Grant 10,741,493 - Chan , et al. A	2020-08-11
Interconnection Structure And Method For Forming The Same App 20190096806 - CHAN; Yu-Chen ; et al.	2019-03-28
Interconnection Structure And Method For Forming The Same App 20180342459 - CHAN; Yu-Chen ; et al.	2018-11-29
Interconnection structure and method for forming the same Grant 10,141,260 - Chan , et al. Nov	2018-11-27

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.