Chadwick; Jon
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chadwick; Jon.The latest application filed is for "wafer-level fan-out package with enhanced performance".
- Chadwick; Jon - Greensboro NC
- - Greensboro NC US
| Patent | Date |
|---|---|
| Wafer-level fan-out package with enhanced performance Grant 11,069,590 - Hammond , et al. July 20, 2 | 2021-07-20 |
| Microelectronics package with vertically stacked dies Grant 11,063,021 - Costa , et al. July 13, 2 | 2021-07-13 |
| Microelectronics package with vertically stacked dies Grant 11,011,498 - Costa , et al. May 18, 2 | 2021-05-18 |
| Microelectronics package with vertically stacked dies Grant 10,964,672 - Costa , et al. March 30, 2 | 2021-03-30 |
| Wafer-level fan-out package with enhanced performance Grant 10,950,518 - Hammond , et al. March 16, 2 | 2021-03-16 |
| Wafer-level fan-out package with enhanced performance Grant 10,903,132 - Hammond , et al. January 26, 2 | 2021-01-26 |
| Wafer-level package with enhanced performance and manufacturing method thereof Grant 10,882,740 - Costa , et al. January 5, 2 | 2021-01-05 |
| Microelectronics package with vertically stacked dies Grant 10,804,246 - Costa , et al. October 13, 2 | 2020-10-13 |
| Wafer-level package with enhanced performance Grant 10,804,179 - Costa , et al. October 13, 2 | 2020-10-13 |
| Wafer-level package with enhanced performance Grant 10,773,952 - Costa , et al. Sept | 2020-09-15 |
| Wafer-level packaging for enhanced performance Grant 10,755,992 - Costa , et al. A | 2020-08-25 |
| Wafer-level package with enhanced performance Grant 10676348 - | 2020-06-09 |
| Wafer-level Fan-out Package With Enhanced Performance App 20200115220 - Hammond; Jonathan Hale ; et al. | 2020-04-16 |
| Wafer-level Package With Enhanced Performance App 20200102217 - Costa; Julio C. ; et al. | 2020-04-02 |
| Wafer-level package with enhanced performance Grant 10589993 - | 2020-03-17 |
| Wafer-level package with enhanced performance Grant 10549988 - | 2020-02-04 |
| Microelectronics Package With Vertically Stacked Dies App 20190378819 - Costa; Julio C. ; et al. | 2019-12-12 |
| Microelectronics Package With Vertically Stacked Dies App 20190378821 - Costa; Julio C. ; et al. | 2019-12-12 |
| Wafer-level packaging for enhanced performance Grant 10,490,471 - Costa , et al. Nov | 2019-11-26 |
| Wafer-level package with enhanced performance Grant 10,486,963 - Hatcher, Jr. , et al. Nov | 2019-11-26 |
| Wafer-level package with enhanced performance Grant 10442684 - | 2019-10-15 |
| Wafer-level package with enhanced performance Grant 10377627 - | 2019-08-13 |
| Wafer-level package with enhanced performance Grant 10227231 - | 2019-03-12 |
| Wafer-level Package With Enhanced Performance App 20190057922 - Costa; Julio C. ; et al. | 2019-02-21 |
| Wafer-level package with enhanced performance Grant 10196260 - | 2019-02-05 |
| Wafer-level Packaging For Enhanced Performance App 20190013254 - Costa; Julio C. ; et al. | 2019-01-10 |
| Wafer-level Packaging For Enhanced Performance App 20190013255 - Costa; Julio C. ; et al. | 2019-01-10 |
| Wafer-level package with enhanced performance Grant 10,109,550 - Costa , et al. October 23, 2 | 2018-10-23 |
| Encapsulated dies with enhanced thermal performance Grant 10,020,206 - Morris , et al. July 10, 2 | 2018-07-10 |
| Flip chip module with enhanced properties Grant 9,960,145 - Costa , et al. May 1, 2 | 2018-05-01 |
| Wafer-level Package With Enhanced Performance App 20180047653 - Costa; Julio C. ; et al. | 2018-02-15 |
| Wafer-level Package With Enhanced Performance App 20180044169 - Hatcher, JR.; Merrill Albert ; et al. | 2018-02-15 |
| Wafer-level Package With Enhanced Performance App 20170334710 - Costa; Julio C. ; et al. | 2017-11-23 |
| Encapsulated dies with enhanced thermal performance Grant 9,613,831 - Morris , et al. April 4, 2 | 2017-04-04 |
| Flip Chip Module With Enhanced Properties App 20160343592 - Costa; Julio C. ; et al. | 2016-11-24 |
| Encapsulated Dies With Enhanced Thermal Performance App 20160284570 - Morris; Thomas Scott ; et al. | 2016-09-29 |
| Encapsulated Dies With Enhanced Thermal Performance App 20160284568 - Morris; Thomas Scott ; et al. | 2016-09-29 |
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