Cayabyab; Jerry Gomez
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cayabyab; Jerry Gomez.The latest application filed is for "dicing a wafer".
- Cayabyab; Jerry Gomez - Baguio PH
- Cayabyab; Jerry Gomez - Baguio City PH
| Patent | Date |
|---|---|
| Semiconductor device package with a cap to selectively exclude contact with mold compound Grant 11,276,615 - Clemente , et al. March 15, 2 | 2022-03-15 |
| Transport packaging and method for expanded wafers Grant 10,811,292 - Esteron , et al. October 20, 2 | 2020-10-20 |
| Dicing A Wafer App 20200203227 - Cayabyab; Jerry Gomez ; et al. | 2020-06-25 |
| Dicing a wafer Grant 10,615,075 - Cayabyab , et al. | 2020-04-07 |
| Transport Packaging And Method For Expanded Wafers App 20200083076 - Esteron; Connie Alagadan ; et al. | 2020-03-12 |
| Semiconductor Device Package With A Cap To Selectively Exclude Contact With Mold Compound App 20200013688 - Clemente; Laura May Antoinette Dela Paz ; et al. | 2020-01-09 |
| Dicing A Wafer App 20190385911 - CAYABYAB; JERRY GOMEZ ; et al. | 2019-12-19 |
| Semiconductor device package with a cap to selectively exclude contact with mold compound Grant 10,418,294 - Clemente , et al. Sept | 2019-09-17 |
| Window Clamp App 20180261568 - Merto; Ruby Ann Maya ; et al. | 2018-09-13 |
| Window Clamp App 20180261567 - Merto; Ruby Ann Maya ; et al. | 2018-09-13 |
| Window clamp Grant 9,997,490 - Merto , et al. June 12, 2 | 2018-06-12 |
| Structure and method for stabilizing leads in wire-bonded semiconductor devices Grant 9,824,959 - Milo , et al. November 21, 2 | 2017-11-21 |
| Structure And Method For Stabilizing Leads In Wire-bonded Semiconductor Devices App 20170278776 - Milo; Dolores Babaran ; et al. | 2017-09-28 |
| Window Clamp App 20160276305 - Merto; Ruby Ann Maya ; et al. | 2016-09-22 |
| Lead frame strip for reduced mold sticking during degating Grant 8,716,845 - Santos , et al. May 6, 2 | 2014-05-06 |
| Lead Frame Strip For Reduced Mold Sticking During Degating App 20120261806 - SANTOS; NORBERT JOSON ; et al. | 2012-10-18 |
| Forming Gas Kit Design For Copper Bonding App 20110017806 - Cayabyab; Jerry Gomez ; et al. | 2011-01-27 |
| Bond pad for ball grid array package Grant 7,358,617 - Cruz , et al. April 15, 2 | 2008-04-15 |
| Bond pad for ball grid array package App 20060113684 - Cruz; Mark Gerald Muyco ; et al. | 2006-06-01 |
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