Castro; Abram M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Castro; Abram M..The latest application filed is for "multi-lead adapter".

Company Profile

4.18.21

Castro; Abram M. - Carrollton TX
Castro; Abram M. - Fort Worth TX
CASTRO; Abram M. - Ft. Worth TX
Castro; Abram M - Fort Worth TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-lead Adapter App 20220077030 - Koduri; Sreenivasan K. ; et al.	2022-03-10
Integrated Circuit Package Electronic Device App 20210366811 - Castro; Abram M.	2021-11-25
Multi-lead adapter Grant 11,177,195 - Koduri , et al. November 16, 2	2021-11-16
Integrated circuit package electronic device including pillar contacts and electrical terminations Grant 11,088,052 - Castro August 10, 2	2021-08-10
Integrated Circuit Chip With A Vertical Connector App 20210028093 - Castro; Abram M. ; et al.	2021-01-28
Multi-lead Adapter App 20200343165 - KODURI; Sreenivasan K. ; et al.	2020-10-29
Integrated circuit chip with a vertical connector Grant 10,804,185 - Castro , et al. October 13, 2	2020-10-13
Integrated Circuit Package Electronic Device App 20200020615 - CASTRO; ABRAM M.	2020-01-16
Integrated Circuit Chip With A Vertical Connector App 20170194233 - Castro; Abram M. ; et al.	2017-07-06
Semiconductor Device Having Non-circular Connectors App 20150371963 - Castro; Abram M. ; et al.	2015-12-24
Semiconductor flip-chip system having oblong connectors and reduced trace pitches Grant 9,129,955 - Castro , et al. September 8, 2	2015-09-08
Method for low stress flip-chip assembly of fine-pitch semiconductor devices Grant 8,530,360 - Castro September 10, 2	2013-09-10
Packaged system of semiconductor chips having a semiconductor interposer Grant 8,133,761 - Gerber , et al. March 13, 2	2012-03-13
Method for Low Stress Flip-Chip Assembly of Fine-Pitch Semiconductor Devices App 20110143502 - CASTRO; Abram M.	2011-06-16
Method for low stress flip-chip assembly of fine-pitch semiconductor devices Grant 7,898,083 - Castro March 1, 2	2011-03-01
Semiconductor Flip-Chip System Having Oblong Connectors and Reduced Trace Pitches App 20100193944 - CASTRO; Abram M. ; et al.	2010-08-05
Method For Low Stress Flip-chip Assembly Of Fine-pitch Semiconductor Devices App 20100148374 - CASTRO; Abram M.	2010-06-17
Packaged System of Semiconductor Chips Having a Semiconductor Interposer App 20090258459 - GERBER; Mark A. ; et al.	2009-10-15
Packed system of semiconductor chips having a semiconductor interposer Grant 7,573,139 - Gerber , et al. August 11, 2	2009-08-11
Semiconductor package-on-package system including integrated passive components Grant 7,569,918 - Gerber , et al. August 4, 2	2009-08-04
Semiconductor Package-on-Package System Including Integrated Passive Components App 20080315387 - GERBER; Mark A. ; et al.	2008-12-25
High Input/Output, Low Profile Package-On-Package Semiconductor System App 20080258286 - Gerber; Mark A. ; et al.	2008-10-23
Packed System of Semiconductor Chips Having a Semiconductor Interposer App 20080246138 - GERBER; MARK A. ; et al.	2008-10-09
Packaged system of semiconductor chips having a semiconductor interposer Grant 7,390,700 - Gerber , et al. June 24, 2	2008-06-24
Semiconductor Package-on-Package System Including Integrated Passive Components App 20070254404 - Gerber; Mark A. ; et al.	2007-11-01
Packaged system of semiconductor chips having a semiconductor interposer App 20070235850 - Gerber; Mark A. ; et al.	2007-10-11
Low profile semiconductor system having a partial-cavity substrate App 20070170571 - Gerber; Mark A. ; et al.	2007-07-26
Electrical circuit and method of formation Grant 6,801,438 - Castro October 5, 2	2004-10-05
Electrical circuit and method of formation App 20030183418 - Castro, Abram M. ; et al.	2003-10-02
Ball grid substrate for lead-on-chip semiconductor package App 20030132518 - Castro, Abram M.	2003-07-17
Electrical circuit and method of formation App 20030066679 - Castro, Abram M. ; et al.	2003-04-10
Ball grid substrate for lead-on-chip semiconductor package Grant 6,534,861 - Castro March 18, 2	2003-03-18
Ball grid substrate for lead-on-chip semiconductor package Grant 6,300,165 - Castro October 9, 2	2001-10-09
Method for making a substrate for an integrated circuit package Grant 6,248,612 - Castro , et al. June 19, 2	2001-06-19
Ball grid substrate for lead-on-chip semiconductor package App 20010002321 - Castro, Abram M.	2001-05-31
Sequentially built integrated circuit package Grant 6,107,683 - Castro , et al. August 22, 2	2000-08-22
Thermally enhanced chip carrier package Grant 5,650,593 - McMillan , et al. July 22, 1	1997-07-22

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