Cao; Haijing

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cao; Haijing.The latest application filed is for "semiconductor device and method of forming shielding layer over integrated passive device using conductive channels".

Company Profile

0.53.43

Cao; Haijing - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels Grant 10,211,183 - Lin , et al. Feb	2019-02-19
Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound Grant 10,192,801 - Lin , et al. Ja	2019-01-29
Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component Grant 9,865,482 - Lin , et al. January 9, 2	2018-01-09
Integrated passive devices Grant 9,449,925 - Lin , et al. September 20, 2	2016-09-20
Semiconductor Device and Method of Forming Shielding Layer over Integrated Passive Device Using Conductive Channels App 20160197059 - Lin; Yaojian ; et al.	2016-07-07
Semiconductor device and method of forming passive devices Grant 9,349,723 - Lin , et al. May 24, 2	2016-05-24
Method of forming an inductor on a semiconductor wafer Grant 9,337,141 - Lin , et al. May 10, 2	2016-05-10
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels Grant 9,324,700 - Lin , et al. April 26, 2	2016-04-26
Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit Grant 9,269,598 - Lin , et al. February 23, 2	2016-02-23
Semiconductor device with solder bump formed on high topography plated Cu pads Grant 9,240,384 - Lin , et al. January 19, 2	2016-01-19
Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars Grant 9,184,103 - Lin , et al. November 10, 2	2015-11-10
Wafer level die integration and method therefor Grant 8,975,111 - Lin , et al. March 10, 2	2015-03-10
Integrated passive device system Grant 8,669,637 - Lin , et al. March 11, 2	2014-03-11
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Grant 8,592,311 - Lin , et al. November 26, 2	2013-11-26
Semiconductor Device and Method of Making Integrated Passive Devices App 20130175668 - Lin; Yaojian ; et al.	2013-07-11
Semiconductor package with semiconductor core structure and method of forming same Grant 8,445,323 - Lin , et al. May 21, 2	2013-05-21
Semiconductor device and method of making integrated passive devices Grant 8,409,970 - Lin , et al. April 2, 2	2013-04-02
Circuit system with circuit element and reference plane Grant 8,395,053 - Lin , et al. March 12, 2	2013-03-12
Method for manufacture of integrated circuit package system with protected conductive layers for pads Grant 8,389,396 - Lin , et al. March 5, 2	2013-03-05
Method of Forming an Inductor on a Semiconductor Wafer App 20130015555 - Lin; Yaojian ; et al.	2013-01-17
Semiconductor Device and Method for Forming Passive Circuit Elements With Through Silicon Vias to Backside Interconnect Structures App 20130015554 - Lin; Yaojian ; et al.	2013-01-17
Semiconductor Device with Solder Bump Formed on High Topography Plated Cu Pads App 20130015575 - Lin; Yaojian ; et al.	2013-01-17
Semiconductor Device and Method of Forming an IPD over a High-Resistivity Encapsulant Separated from other IPDS and Baseband Circuit App 20120292738 - Lin; Yaojian ; et al.	2012-11-22
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Grant 8,310,058 - Lin , et al. November 13, 2	2012-11-13
Method of forming an inductor on a semiconductor wafer Grant 8,309,452 - Lin , et al. November 13, 2	2012-11-13
Semiconductor device with solder bump formed on high topography plated Cu pads Grant 8,304,904 - Lin , et al. November 6, 2	2012-11-06
Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit Grant 8,263,437 - Lin , et al. September 11, 2	2012-09-11
Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process App 20120211881 - Lin; Yaojian ; et al.	2012-08-23
Semiconductor Device and Method of Forming a Fan-Out Structure with Integrated Passive Device and Discrete Component App 20120187572 - Lin; Yaojian ; et al.	2012-07-26
Semiconductor Device and Method of Forming Vertical Interconnect Structure in Substrate for IPD and Baseband Circuit Separated by High-Resistivity Molding Compound App 20120175784 - Lin; Yaojian ; et al.	2012-07-12
Semiconductor Package with Semiconductor Core Structure and Method of Forming Same App 20120175732 - Lin; Yaojian ; et al.	2012-07-12
Semiconductor package with semiconductor core structure and method of forming the same Grant 8,193,604 - Lin , et al. June 5, 2	2012-06-05
Semiconductor Device and Method of Forming Passive Devices App 20120126369 - Lin; Yaojian ; et al.	2012-05-24
Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component Grant 8,183,087 - Lin , et al. May 22, 2	2012-05-22
Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound Grant 8,168,470 - Lin , et al. May 1, 2	2012-05-01
Integrated circuit system with metal-insulator-metal circuit element Grant 8,134,196 - Lin , et al. March 13, 2	2012-03-13
Semiconductor device and method of forming passive devices Grant 8,124,490 - Lin , et al. February 28, 2	2012-02-28
Semiconductor device and method of forming high-frequency circuit structure and method thereof Grant 8,110,477 - Lin , et al. February 7, 2	2012-02-07
Method For Manufacture Of Integrated Circuit Package System With Protected Conductive Layers For Pads App 20120003830 - Lin; Yaojian ; et al.	2012-01-05
Wafer Level Die Integration and Method Therefor App 20110254155 - Lin; Yaojian ; et al.	2011-10-20
Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof Grant 8,026,593 - Lin , et al. September 27, 2	2011-09-27
Integrated circuit package system with bump pad Grant 8,008,770 - Lin , et al. August 30, 2	2011-08-30
Wafer level die integration and method therefor Grant 7,993,972 - Lin , et al. August 9, 2	2011-08-09
Semiconductor Device Having Embedded Integrated Passive Devices Electrically Interconnected Using Conductive Pillars App 20110163414 - Lin; Yaojian ; et al.	2011-07-07
Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillars Grant 7,935,570 - Lin , et al. May 3, 2	2011-05-03
Semiconductor Package with Semiconductor Core Structure and Method of Forming the Same App 20110068468 - Lin; Yaojian ; et al.	2011-03-24
Semiconductor package with semiconductor core structure and method of forming same Grant 7,858,441 - Lin , et al. December 28, 2	2010-12-28
Semiconductor Device and Method of Forming High-Frequency Circuit Structure and Method Thereof App 20100264512 - Lin; Yaojian ; et al.	2010-10-21
Method of Forming an Inductor on a Semiconductor Wafer App 20100264516 - Lin; Yaojian ; et al.	2010-10-21
Semiconductor device and method of forming integrated passive device module Grant 7,790,503 - Lin , et al. September 7, 2	2010-09-07
Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process App 20100200985 - Lin; Yaojian ; et al.	2010-08-12
Method of forming an inductor on a semiconductor wafer Grant 7,772,106 - Lin , et al. August 10, 2	2010-08-10
Semiconductor device and method of forming high-frequency circuit structure and method thereof Grant 7,772,081 - Lin , et al. August 10, 2	2010-08-10
Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate Grant 7,749,814 - Lin , et al. July 6, 2	2010-07-06
Semiconductor Device and Method for Forming Passive Circuit Elements With Through Silicon Vias to Backside Interconnect Structures App 20100140737 - Lin; Yaojian ; et al.	2010-06-10
Semiconductor Package with Semiconductor Core Structure and Method of Forming Same App 20100140779 - Lin; Yaojian ; et al.	2010-06-10
Semiconductor Device and Method of Forming Vertical Interconnect Structure in Substrate for IPD and Baseband Circuit Separated by High-Resistivity Molding Compound App 20100140772 - Lin; Yaojian ; et al.	2010-06-10
Semiconductor Device and Method of Embedding Integrated Passive Devices into the Package Electrically Interconnected Using Conductive Pillars App 20100140736 - Lin; Yaojian ; et al.	2010-06-10
Semiconductor Device with Solder Bump Formed on High Topography Plated Cu Pads App 20100133687 - Lin; Yaojian ; et al.	2010-06-03
Semiconductor device and method of protecting passivation layer in a solder bump process Grant 7,727,876 - Lin , et al. June 1, 2	2010-06-01
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Grant 7,691,747 - Lin , et al. April 6, 2	2010-04-06
Method of forming solder bump on high topography plated Cu Grant 7,682,959 - Lin , et al. March 23, 2	2010-03-23
Semiconductor Device and Method of Forming High-Frequency Circuit Structure and Method Thereof App 20100065942 - Lin; Yaojian ; et al.	2010-03-18
Semiconductor Device and Method of Forming a Fan-Out Structure with Integrated Passive Device and Discrete Component App 20100059855 - Lin; Yaojian ; et al.	2010-03-11
Semiconductor Device and Method of Forming Shielding Layer over Integrated Passive Device Using Conductive Channels App 20100059853 - Lin; Yaojian ; et al.	2010-03-11
Semiconductor Device and Method of Forming an IPD over a High-Resistivity Encapsulant Separated from other IPDS and Baseband Circuit App 20100059854 - Lin; Yaojian ; et al.	2010-03-11
Semiconductor Device With Integrated Passive Circuit and Method of Making the Same Using Sacrificial Substrate App 20090230542 - Lin; Yaojian ; et al.	2009-09-17
Wafer Level Die Integration and Method Therefor App 20090224391 - Lin; Yaojian ; et al.	2009-09-10
Semiconductor Device and Method of Forming Integrated Passive Device Module App 20090155959 - Lin; Yaojian ; et al.	2009-06-18
Semiconductor Device and Method of Making Integrated Passive Devices App 20090140421 - Lin; Yaojian ; et al.	2009-06-04
Semiconductor Device and Method for Forming Passive Circuit Elements with Through Silicon Vias to Backside Interconnect Structures App 20090140381 - Lin; Yaojian ; et al.	2009-06-04
Method of Forming an Inductor on a Semiconductor Wafer App 20090117702 - LIN; Yaojian ; et al.	2009-05-07
Circuit System With Circuit Element And Reference Plane App 20090004504 - Lin; Yaojian ; et al.	2009-01-01
Integrated Circuit Package System With Protected Conductive Layers App 20080237880 - Lin; Yaojian ; et al.	2008-10-02
Method of Forming Solder Bump on High Topography Plated Cu App 20080230902 - LIN; Yaojian ; et al.	2008-09-25
Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process App 20080150161 - Lin; Yaojian ; et al.	2008-06-26
Semiconductor Device and Method of Forming Passive Devices App 20080153245 - Lin; Yaojian ; et al.	2008-06-26
Integrated circuit system for bonding Grant 7,381,634 - Lin , et al. June 3, 2	2008-06-03
Integrated Passive Device System App 20070114634 - Lin; Yaojian ; et al.	2007-05-24
Integrated Circuit Package System With Bump Pad App 20070114639 - Lin; Yaojian ; et al.	2007-05-24
Integrated Circuit System With Metal-insulator-metal Circuit Element App 20070108615 - Lin; Yaojian ; et al.	2007-05-17
Integrated Circuit System For Bonding App 20060231948 - Lin; Yaojian ; et al.	2006-10-19