Cady; James W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cady; James W..The latest application filed is for "low profile chip scale stacking system and method".
Company Profile
0.38.46
- Cady; James W. - Solana Beach CA
- Cady; James W. - Austin TX
- Cady; James W. - Shelburne VT
Patent Activity
| Patent | Date |
|---|---|
| Die module system Grant 7,768,796 - Cady , et al. August 3, 2 | 2010-08-03 |
| Low profile stacking system and method Grant 7,626,273 - Partridge , et al. December 1, 2 | 2009-12-01 |
| Low Profile Chip Scale Stacking System And Method App 20090273069 - Cady; James W. ; et al. | 2009-11-05 |
| Compact module system and method Grant 7,606,050 - Cady , et al. October 20, 2 | 2009-10-20 |
| Integrated circuit stacking system Grant 7,606,048 - Cady , et al. October 20, 2 | 2009-10-20 |
| Module thermal management system and method Grant 7,606,049 - Goodwin , et al. October 20, 2 | 2009-10-20 |
| Thin module system and method Grant 7,602,613 - Goodwin , et al. October 13, 2 | 2009-10-13 |
| Flex-based circuit module Grant 7,595,550 - Cady , et al. September 29, 2 | 2009-09-29 |
| Integrated circuit stacking system Grant 7,586,758 - Cady , et al. September 8, 2 | 2009-09-08 |
| Memory expansion and integrated circuit stacking system and method Grant 7,542,304 - Rapport , et al. June 2, 2 | 2009-06-02 |
| Low Profile Stacking System and Method App 20090124045 - Partridge; Julian ; et al. | 2009-05-14 |
| Integrated circuit stacking system and method Grant 7,524,703 - Cady , et al. April 28, 2 | 2009-04-28 |
| Stacking system and method Grant 7,495,334 - Rapport , et al. February 24, 2 | 2009-02-24 |
| Die Module System App 20080278924 - Cady; James W. ; et al. | 2008-11-13 |
| Die module system Grant 7,423,885 - Cady , et al. September 9, 2 | 2008-09-09 |
| Low profile chip scale stacking system and method App 20080211077 - Cady; James W. ; et al. | 2008-09-04 |
| Integrated circuit stacking system and method Grant 7,335,975 - Cady , et al. February 26, 2 | 2008-02-26 |
| Memory expansion and chip scale stacking system and method Grant 7,256,484 - Rapport , et al. August 14, 2 | 2007-08-14 |
| Memory Module System and Method App 20070126124 - Rapport; Russell ; et al. | 2007-06-07 |
| Memory Module System and Method App 20070126125 - Rapport; Russell ; et al. | 2007-06-07 |
| Low Profile Stacking System and Method App 20070117262 - Partridge; Julian ; et al. | 2007-05-24 |
| Thin Module System and Method App 20070115017 - Goodwin; Paul ; et al. | 2007-05-24 |
| Low Profile Stacking System and Method App 20070114649 - Partridge; Julian ; et al. | 2007-05-24 |
| Pitch change and chip scale stacking system and method Grant 7,202,555 - Roper , et al. April 10, 2 | 2007-04-10 |
| Low profile stacking system and method Grant 7,180,167 - Partridge , et al. February 20, 2 | 2007-02-20 |
| Memory module system and method App 20060261449 - Rapport; Russell ; et al. | 2006-11-23 |
| Low profile chip scale stacking system and method Grant 7,094,632 - Cady , et al. August 22, 2 | 2006-08-22 |
| Systems, methods, and apparatus for generating ball-out matrix configuration output for a flex circuit App 20060175693 - Cady; James W. ; et al. | 2006-08-10 |
| Flexible circuit connector for stacked chip module Grant 7,066,741 - Burns , et al. June 27, 2 | 2006-06-27 |
| Stacking system and method App 20060131716 - Cady; James W. ; et al. | 2006-06-22 |
| Pitch change and chip scale stacking system Grant 7,053,478 - Roper , et al. May 30, 2 | 2006-05-30 |
| Stacking system and method App 20060091521 - Cady; James W. ; et al. | 2006-05-04 |
| Low profile chip scale stacking system and method Grant 7,026,708 - Cady , et al. April 11, 2 | 2006-04-11 |
| Thin module system and method App 20060050492 - Goodwin; Paul ; et al. | 2006-03-09 |
| Die module system and method App 20060050498 - Cady; James W. ; et al. | 2006-03-09 |
| Minimized profile circuit module systems and methods App 20060048385 - Cady; James W. ; et al. | 2006-03-09 |
| Module thermal management system and method App 20060049502 - Goodwin; Paul ; et al. | 2006-03-09 |
| Compact module system and method App 20060050592 - Cady; James W. ; et al. | 2006-03-09 |
| Stacked integrated circuit cascade signaling system and method App 20060043558 - Cady; James W. ; et al. | 2006-03-02 |
| Integrated circuit stacking system and method App 20060008945 - Cady; James W. ; et al. | 2006-01-12 |
| Stacking system and method App 20050280135 - Rapport, Russell ; et al. | 2005-12-22 |
| Flex-based circuit module App 20050263872 - Cady, James W. ; et al. | 2005-12-01 |
| Integrated circuit stacking system and method Grant 6,956,284 - Cady , et al. October 18, 2 | 2005-10-18 |
| Memory expansion and chip scale stacking system and method Grant 6,955,945 - Rapport , et al. October 18, 2 | 2005-10-18 |
| Integrated circuit stacking system and method Grant 6,940,729 - Cady , et al. September 6, 2 | 2005-09-06 |
| Low profile stacking system and method App 20050146031 - Partridge, Julian ; et al. | 2005-07-07 |
| Pitch change and chip scale stacking system and method App 20050146011 - Roper, David L. ; et al. | 2005-07-07 |
| Memory expansion and chip scale stacking system and method Grant 6,914,324 - Rapport , et al. July 5, 2 | 2005-07-05 |
| Memory expansion and chip scale stacking system and method App 20050067683 - Rapport, Russell ; et al. | 2005-03-31 |
| Memory expansion and chip scale stacking system and method App 20050062144 - Rapport, Russell ; et al. | 2005-03-24 |
| Memory expansion and integrated circuit stacking system and method App 20050057911 - Rapport, Russell ; et al. | 2005-03-17 |
| Stacked module systems and methods App 20050056921 - Wehrly, James Douglas JR. ; et al. | 2005-03-17 |
| Integrated circuit stacking system and method App 20050041404 - Cady, James W. ; et al. | 2005-02-24 |
| Integrated circuit stacking system and method App 20050041403 - Cady, James W. ; et al. | 2005-02-24 |
| Integrated circuit stacking system and method App 20050041402 - Cady, James W. ; et al. | 2005-02-24 |
| Pitch change and chip scale stacking system App 20050018412 - Roper, David L. ; et al. | 2005-01-27 |
| Stacked module systems and methods for CSP packages App 20050009234 - Partridge, Julian ; et al. | 2005-01-13 |
| Point to point memory expansion system and method App 20040245615 - Cady, James W. ; et al. | 2004-12-09 |
| Integrated circuit stacking system and method App 20040235222 - Cady, James W. ; et al. | 2004-11-25 |
| Low profile chip scale stacking system and method App 20040229402 - Cady, James W. ; et al. | 2004-11-18 |
| Memory Expansion And Chip Scale Stacking System And Method App 20040197956 - Rapport, Russell ; et al. | 2004-10-07 |
| Integrated circuit stacking system and method App 20040183183 - Cady, James W. ; et al. | 2004-09-23 |
| Memory expansion and chip scale stacking system and method App 20040178496 - Rapport, Russell ; et al. | 2004-09-16 |
| Low profile chip scale stacking system and method App 20040052060 - Cady, James W. ; et al. | 2004-03-18 |
| Memory expansion and chip scale stacking system and method App 20040000708 - Rapport, Russell ; et al. | 2004-01-01 |
| Low profile stacking system and method App 20030234443 - Partridge, Julian ; et al. | 2003-12-25 |
| Flexible circuit connector for stacked chip module App 20030203663 - Burns, Carmen D. ; et al. | 2003-10-30 |
| Stacking system and method App 20030137048 - Cady, James W. ; et al. | 2003-07-24 |
| Chip scale stacking system and method Grant 6,576,992 - Cady , et al. June 10, 2 | 2003-06-10 |
| Flexible circuit connector for stacked chip module Grant 6,572,387 - Burns , et al. June 3, 2 | 2003-06-03 |
| Integrated circuit stacking system and method App 20030081392 - Cady, James W. ; et al. | 2003-05-01 |
| Flexible circuit connector for stacked chip module App 20020102870 - Burns, Carmen D. ; et al. | 2002-08-01 |
| Rambus stakpak Grant 6,404,662 - Cady , et al. June 11, 2 | 2002-06-11 |
| Warp-resistent ultra-thin integrated circuit package fabrication method Grant 6,194,247 - Burns , et al. February 27, 2 | 2001-02-27 |
| Simulcast standard multichip memory addressing system Grant RE36,229 - Cady June 15, 1 | 1999-06-15 |
| Warp-resistant ultra-thin integrated circuit package Grant 5,581,121 - Burns , et al. December 3, 1 | 1996-12-03 |
| Ultra high density integrated circuit packages Grant 5,550,711 - Burns , et al. August 27, 1 | 1996-08-27 |
| Method of assembling ultra high density integrated circuit packages Grant 5,475,920 - Burns , et al. December 19, 1 | 1995-12-19 |
| Ultra high density integrated circuit packages Grant 5,446,620 - Burns , et al. August 29, 1 | 1995-08-29 |
| Simulcast standard multichip memory addressing system Grant 5,371,866 - Cady December 6, 1 | 1994-12-06 |
| Ultra high density integrated circuit packages method Grant 5,367,766 - Burns , et al. November 29, 1 | 1994-11-29 |
| Warp-resistent ultra-thin integrated circuit package fabrication method Grant 5,369,056 - Burns , et al. November 29, 1 | 1994-11-29 |
| Electrical connector for coaxial cable Grant 5,295,863 - Cady March 22, 1 | 1994-03-22 |
| Multiwire cable Grant 5,084,594 - Cady , et al. January 28, 1 | 1992-01-28 |
Company Registrations
| SEC | 0001269217 | CADY JAMES W |
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