BYUN; Dae Jung
Patent Applications and Registrations
Patent applications and USPTO patent grants for BYUN; Dae Jung.The latest application filed is for "cable substrate".
- BYUN; Dae Jung - Suwon-si KR
- Byun; Dae Jung - Busan KR
- Byun; Dae-Jung - Saha-gu KR
| Patent | Date |
|---|---|
| Cable Substrate App 20220174812 - KIM; Jung Soo ; et al. | 2022-06-02 |
| Flexible Printed Circuit Board And Electronic Device Including The Same App 20220167496 - Byun; Dae Jung ; et al. | 2022-05-26 |
| Substrate Having Electronic Component Embedded Therein App 20220130766 - BYUN; Dae Jung ; et al. | 2022-04-28 |
| Printed Circuit Board App 20220095449 - BYUN; Dae Jung ; et al. | 2022-03-24 |
| Printed Circuit Board App 20220095458 - KIM; Jung Soo ; et al. | 2022-03-24 |
| Printed Circuit Board And Substrate Including Electronic Component Embedded Therein App 20220078905 - BYUN; Dae Jung ; et al. | 2022-03-10 |
| Substrate having electronic component embedded therein Grant 11,251,133 - Byun , et al. February 15, 2 | 2022-02-15 |
| Substrate having electronic component embedded therein Grant 11,183,462 - Hwang , et al. November 23, 2 | 2021-11-23 |
| Substrate having electronic component embedded therein Grant 11,075,156 - Byun , et al. July 27, 2 | 2021-07-27 |
| Substrate Having Electronic Component Embedded Therein App 20210193563 - Byun; Dae Jung ; et al. | 2021-06-24 |
| Electronic Component Embedded Substrate App 20210193609 - Hwang; Mi Sun ; et al. | 2021-06-24 |
| Substrate Having Electronic Component Embedded Therein App 20210193580 - BYUN; Dae Jung ; et al. | 2021-06-24 |
| Substrate Embedded Electronic Component Package App 20210183774 - BYUN; Dae Jung ; et al. | 2021-06-17 |
| Substrate Having Electronic Component Embedded Therein App 20210183784 - HWANG; Mi Sun ; et al. | 2021-06-17 |
| Fan-out semiconductor package Grant 10,818,621 - Lee , et al. October 27, 2 | 2020-10-27 |
| Fan-out semiconductor package Grant 10,515,916 - Byun , et al. Dec | 2019-12-24 |
| Fan-out semiconductor package Grant 10,276,467 - Kim , et al. | 2019-04-30 |
| Fan-out semiconductor package Grant 10,157,868 - Byun , et al. Dec | 2018-12-18 |
| Fan-out Semiconductor Package App 20180308815 - Byun; Dae Jung ; et al. | 2018-10-25 |
| Fan-out Semiconductor Package App 20180061795 - BYUN; Dae Jung ; et al. | 2018-03-01 |
| Fan-out semiconductor package Grant 9,859,222 - Kim , et al. January 2, 2 | 2018-01-02 |
| Fan-out Semiconductor Package App 20170358534 - KIM; Jung Soo ; et al. | 2017-12-14 |
| Fan-out Semiconductor Package App 20170278766 - KIM; Eun Sil ; et al. | 2017-09-28 |
| Fan-out Semiconductor Package App 20170278812 - LEE; Doo Hwan ; et al. | 2017-09-28 |
| Method of manufacturing an embedded printed circuit board Grant 8,418,356 - Park , et al. April 16, 2 | 2013-04-16 |
| Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes Grant 8,037,584 - Park , et al. October 18, 2 | 2011-10-18 |
| Electro Device Embedded Printed Circuit Board And Manufacturing Method Thereof App 20110216515 - LEE; Jin-Won ; et al. | 2011-09-08 |
| Electro Device Embedded Printed Circuit Board And Manufacturng Method Thereof App 20110214913 - Lee; Jin-Won ; et al. | 2011-09-08 |
| Electronic Component Embedded Printed Circuit Board And Method Of Manufacturing The Same App 20110141711 - SOHN; Seung-Hyun ; et al. | 2011-06-16 |
| Printed circuit board and manufacturing method thereof Grant 7,665,206 - Park , et al. February 23, 2 | 2010-02-23 |
| Embedded printed circuit board and manufacturing method thereof App 20090242251 - Park; Kwang Soo ; et al. | 2009-10-01 |
| Printed circuit board and manufacturing method thereof App 20080264687 - Park; Kwang-Soo ; et al. | 2008-10-30 |
| Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes App 20080257593 - Park; Kwang-Soo ; et al. | 2008-10-23 |
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