| Patent | Date |
|---|
Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
Grant 11,147,158 - Busby , et al. October 12, 2 | 2021-10-12 |
Tamper-respondent sensors with liquid crystal polymer layers
Grant 11,122,682 - Busby , et al. September 14, 2 | 2021-09-14 |
Enclosure-to-board interface with tamper-detect circuit(s)
Grant 11,083,082 - Fadden , et al. August 3, 2 | 2021-08-03 |
Tamper detection at enclosure-to-board interface
Grant 10,798,816 - Busby , et al. October 6, 2 | 2020-10-06 |
Tamper-respondent assemblies with bond protection
Grant 10,624,202 - Brodsky , et al. | 2020-04-14 |
Tamper detection at enclosure-to-board interface
Grant 10,595,401 - Busby , et al. | 2020-03-17 |
Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
Grant 10,575,398 - Busby , et al. Feb | 2020-02-25 |
Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
Grant 10,568,202 - Busby , et al. Feb | 2020-02-18 |
Tamper-respondent Assembly With Interconnect Characteristic(s) Obscuring Circuit Layout
App 20200045812 - BUSBY; James A. ; et al. | 2020-02-06 |
Tamper-proof electronic packages with stressed glass component substrate(s)
Grant 10,535,619 - Busby , et al. Ja | 2020-01-14 |
Tamper-proof electronic packages with stressed glass component substrate(s)
Grant 10,535,618 - Busby , et al. Ja | 2020-01-14 |
Enclosure-to-board interface with tamper-detect circuit(s)
Grant 10,531,561 - Fadden , et al. J | 2020-01-07 |
Enclosure-to-board Interface With Tamper-detect Circuit(s)
App 20200008295 - FADDEN; Kathleen Ann ; et al. | 2020-01-02 |
Tamper-respondent Sensors With Liquid Crystal Polymer Layers
App 20190313526 - BUSBY; James A. ; et al. | 2019-10-10 |
Enclosure-to-board Interface With Tamper-detect Circuit(s)
App 20190261506 - FADDEN; Kathleen Ann ; et al. | 2019-08-22 |
Tamper-respondent assemblies
Grant 10,334,722 - Brodsky , et al. | 2019-06-25 |
Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor
Grant 10,327,329 - Brodsky , et al. | 2019-06-18 |
Enclosure-to-board interface with tamper-detect circuit(s)
Grant 10,306,753 - Fadden , et al. | 2019-05-28 |
Tamper-respondent assemblies with bond protection
Grant 10,264,665 - Brodsky , et al. | 2019-04-16 |
Tamper-proof electronic packages formed with stressed glass
Grant 10,257,924 - Busby , et al. | 2019-04-09 |
Tamper-respondent assembly with nonlinearity monitoring
Grant 10,242,543 - Busby , et al. | 2019-03-26 |
Multi-layer stack with embedded tamper-detect protection
Grant 10,217,336 - Busby , et al. Feb | 2019-02-26 |
Tamper-respondent Assembly With Interconnect Characteristic(s) Obscuring Circuit Layout
App 20190037687 - BUSBY; James A. ; et al. | 2019-01-31 |
Tamper-respondent Assembly With Interconnect Characteristic(s) Obscuring Circuit Layout
App 20190037686 - BUSBY; James A. ; et al. | 2019-01-31 |
Tamper-proof electronic packages with stressed glass component substrate(s)
Grant 10,177,102 - Busby , et al. J | 2019-01-08 |
Multi-layer stack with embedded tamper-detect protection
Grant 10,169,967 - Busby , et al. J | 2019-01-01 |
Multi-layer stack with embedded tamper-detect protection
Grant 10,169,968 - Busby , et al. J | 2019-01-01 |
Tamper-respondent assemblies with enclosure-to-board protection
Grant 10,172,232 - Brodsky , et al. J | 2019-01-01 |
Multi-layer Stack With Embedded Tamper-detect Protection
App 20180365947 - BUSBY; James A. ; et al. | 2018-12-20 |
Multi-layer Stack With Embedded Tamper-detect Protection
App 20180365945 - BUSBY; James A. ; et al. | 2018-12-20 |
Multi-layer Stack With Embedded Tamper-detect Protection
App 20180365946 - BUSBY; James A. ; et al. | 2018-12-20 |
Tamper-proof Electronic Packages With Stressed Glass Component Substrate(s)
App 20180358311 - BUSBY; James A. ; et al. | 2018-12-13 |
Tamper-proof Electronic Packages With Stressed Glass Component Substrate(s)
App 20180350757 - BUSBY; James A. ; et al. | 2018-12-06 |
Circuit layouts of tamper-respondent sensors
Grant 10,143,090 - Brodsky , et al. Nov | 2018-11-27 |
Circuit layouts of tamper-respondent sensors
Grant 10,136,519 - Brodsky , et al. November 20, 2 | 2018-11-20 |
Multi-layer stack with embedded tamper-detect protection
Grant 10,115,275 - Busby , et al. October 30, 2 | 2018-10-30 |
Tamper-respondent Assembly With Flexible Tamper-detect Sensor(s) Overlying In-situ-formed Tamper-detect Sensor
App 20180235081 - BRODSKY; William L. ; et al. | 2018-08-16 |
Tamper-respondent assemblies with trace regions of increased susceptibility to breaking
Grant 9,999,124 - Busby , et al. June 12, 2 | 2018-06-12 |
Tamper-respondent Assemblies With Trace Regions Of Increased Susceptibility To Breaking
App 20180124915 - BUSBY; James A. ; et al. | 2018-05-03 |
Tamper-respondent Assembly With Nonlinearity Monitoring
App 20180108229 - BUSBY; James A. ; et al. | 2018-04-19 |
Tamper-respondent Assemblies With Bond Protection
App 20180103538 - Brodsky; William L. ; et al. | 2018-04-12 |
Tamper-respondent Assemblies With Bond Protection
App 20180103537 - BRODSKY; William L. ; et al. | 2018-04-12 |
Tamper-proof Electronic Packages With Stressed Glass Component Substrate(s)
App 20180102329 - BUSBY; James A. ; et al. | 2018-04-12 |
Tamper-respondent Assemblies With Enclosure-to-board Protection
App 20180098423 - Brodsky; William L. ; et al. | 2018-04-05 |
Tamper-proof Electronic Packages Formed With Stressed Glass
App 20180098424 - BUSBY; James A. ; et al. | 2018-04-05 |
Tamper-respondent assemblies
Grant 9,936,573 - Brodsky , et al. April 3, 2 | 2018-04-03 |
Tamper-respondent assemblies
Grant 9,924,591 - Brodsky , et al. March 20, 2 | 2018-03-20 |
Multi-layer stack with embedded tamper-detect protection
Grant 9,916,744 - Busby , et al. March 13, 2 | 2018-03-13 |
Tamper-respondent Assemblies
App 20180070444 - BRODSKY; William L. ; et al. | 2018-03-08 |
Tamper-proof electronic packages formed with stressed glass
Grant 9,913,370 - Busby , et al. March 6, 2 | 2018-03-06 |
Tamper-respondent assemblies with bond protection
Grant 9,913,362 - Brodsky , et al. March 6, 2 | 2018-03-06 |
Multi-layer Stack With Embedded Tamper-detect Protection
App 20180061196 - BUSBY; James A. ; et al. | 2018-03-01 |
Tamper-respondent assemblies with bond protection
Grant 9,894,749 - Brodsky , et al. February 13, 2 | 2018-02-13 |
Tamper-proof electronic packages with stressed glass component substrate(s)
Grant 9,881,880 - Busby , et al. January 30, 2 | 2018-01-30 |
Tamper-respondent assemblies with enclosure-to-board protection
Grant 9,877,383 - Brodsky , et al. January 23, 2 | 2018-01-23 |
Tamper-respondent assembly with nonlinearity monitoring
Grant 9,858,776 - Busby , et al. January 2, 2 | 2018-01-02 |
Tamper-respondent Assembly With Nonlinearity Monitoring
App 20170372570 - BUSBY; James A. ; et al. | 2017-12-28 |
Tamper-proof Electronic Packages Formed With Stressed Glass
App 20170332485 - BUSBY; James A. ; et al. | 2017-11-16 |
Tamper-proof Electronic Packages With Stressed Glass Component Substrate(s)
App 20170330844 - BUSBY; James A. ; et al. | 2017-11-16 |
Multi-layer Stack With Embedded Tamper-detect Protection
App 20170249813 - BUSBY; James A. ; et al. | 2017-08-31 |
Tamper-respondent Assemblies With Enclosure-to-board Protection
App 20170181274 - BRODSKY; William L. ; et al. | 2017-06-22 |
Tamper-respondent assemblies with enclosure-to-board protection
Grant 9,661,747 - Brodsky , et al. May 23, 2 | 2017-05-23 |
Circuit Layouts Of Tamper-respondent Sensors
App 20170108543 - BRODSKY; William L. ; et al. | 2017-04-20 |
Circuit Layouts Of Tamper-respondent Sensors
App 20170111998 - BRODSKY; William L. ; et al. | 2017-04-20 |
Tamper-respondent Assemblies With Bond Protection
App 20170094778 - BRODSKY; William L. ; et al. | 2017-03-30 |
Tamper-respondent Assemblies
App 20170094806 - BRODSKY; William L. ; et al. | 2017-03-30 |
Tamper-respondent Assemblies With Bond Protection
App 20170094820 - BRODSKY; William L. ; et al. | 2017-03-30 |
Tamper-respondent Assemblies
App 20170094784 - BRODSKY; William L. ; et al. | 2017-03-30 |
Tamper-respondent assemblies with enclosure-to-board protection
Grant 9,554,477 - Brodsky , et al. January 24, 2 | 2017-01-24 |
Optimization of metallurgical properties of a solder joint
Grant 8,197,612 - Busby , et al. June 12, 2 | 2012-06-12 |
Sandwiched organic LGA structure
Grant 7,795,724 - Brodsky , et al. September 14, 2 | 2010-09-14 |
Thermal pillow
Grant 7,709,951 - Brodsky , et al. May 4, 2 | 2010-05-04 |
Optimization Of Metallurgical Properties Of A Solder Joint
App 20090266447 - BUSBY; JAMES A. ; et al. | 2009-10-29 |
Sandwiched Organic Lga Structure
App 20090057865 - Brodsky; William L. ; et al. | 2009-03-05 |
Thermal Pillow
App 20080225484 - Brodsky; William L. ; et al. | 2008-09-18 |
Temperature dependent semiconductor module connectors
Grant 7,255,571 - Brodsky , et al. August 14, 2 | 2007-08-14 |
Temperature dependent semiconductor module connectors
App 20070010111 - Brodsky; William L. ; et al. | 2007-01-11 |
Temperature dependent semiconductor module connectors
Grant 7,137,826 - Brodsky , et al. November 21, 2 | 2006-11-21 |
Hook interconnect
Grant 7,128,579 - Brodsky , et al. October 31, 2 | 2006-10-31 |
Temperature Dependent Semiconductor Module Connectors
App 20060205273 - Brodsky; William L. ; et al. | 2006-09-14 |
Electrical coupling of substrates by conductive buttons
Grant 6,848,914 - Beaman , et al. February 1, 2 | 2005-02-01 |
Electrical coupling of substrates by conductive buttons
App 20030073329 - Beaman, Brian S. ; et al. | 2003-04-17 |
Built-in inspection template for a printed circuit
App 20010017765 - Brown, Marshall L. ; et al. | 2001-08-30 |
Built-in inspection template for a printed circuit
Grant 6,212,077 - Brown , et al. April 3, 2 | 2001-04-03 |
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