Buenning; Hartmut

Patent Applications and Registrations

Patent applications and USPTO patent grants for Buenning; Hartmut.The latest application filed is for "variable stealth laser dicing process".

Company Profile

3.12.15

Buenning; Hartmut - Hamburg DE
Buenning; Hartmut - Norderstedt DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of making a semiconductor device Grant 11,011,446 - Kamphuis , et al. May 18, 2	2021-05-18
Semiconductor device with six-sided protected walls Grant 10,410,922 - Buenning Sept	2019-09-10
Variable stealth laser dicing process Grant 10,347,534 - Lapke , et al. July 9, 2	2019-07-09
Variable Stealth Laser Dicing Process App 20190080963 - LAPKE; Martin ; et al.	2019-03-14
Semiconductor Device With Six-sided Protected Walls App 20180240707 - Buenning; Hartmut	2018-08-23
Plasma dicing with blade saw patterned underside mask Grant 9,847,258 - Rohleder , et al. December 19, 2	2017-12-19
Combination grinding after laser (GAL) and laser on-off function to increase die strength Grant 9,812,361 - Buenning , et al. November 7, 2	2017-11-07
Semiconductor Device And Method Of Making A Semiconductor Device App 20170148697 - Kamphuis; Tonny ; et al.	2017-05-25
Plasma Dicing With Blade Saw Patterned Underside Mask App 20170092540 - Rohleder; Thomas ; et al.	2017-03-30
Plasma etching and stealth dicing laser process Grant 9,601,437 - Albermann , et al. March 21, 2	2017-03-21
Wafer Material Removal App 20160172243 - Moeller; Sascha ; et al.	2016-06-16
Apparatus, device and method for wafer dicing Grant 9,349,645 - Lapke , et al. May 24, 2	2016-05-24
Plasma Etching And Stealth Dicing Laser Process App 20160071770 - Albermann; Guido ; et al.	2016-03-10
Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) Grant 9,245,804 - Zenz , et al. January 26, 2	2016-01-26
Protection of a wafer-level chip scale package (WLCSP) Grant 9,196,537 - Van Gemert , et al. November 24, 2	2015-11-24
Encapsulated Wafer-level Chip Scale (wlscp) Pedestal Packaging App 20150162306 - VAN GEMERT; Leonardus Antonius Elisabeth ; et al.	2015-06-11
Apparatus, Device And Method For Wafer Dicing App 20150104931 - Lapke; Martin ; et al.	2015-04-16
Encapsulated wafer-level chip scale (WLSCP) pedestal packaging Grant 8,987,057 - Van Gemert , et al. March 24, 2	2015-03-24
Combination Grinding After Laser (gal) And Laser On-off Function To Increase Die Strength App 20150069578 - BUENNING; Hartmut ; et al.	2015-03-12
Die preparation for wafer-level chip scale package (WLCSP) Grant 8,895,363 - Buenning , et al. November 25, 2	2014-11-25
Die Preparation for Wafer-Level Chip Scale Package (WLCSP) App 20140264768 - Buenning; Hartmut ; et al.	2014-09-18
High die strength semiconductor wafer processing method and system Grant 8,809,166 - Buenning , et al. August 19, 2	2014-08-19
High Die Strength Semiconductor Wafer Processing Method And System App 20140179083 - BUENNING; HARTMUT ; et al.	2014-06-26
Protection Of A Wafer-level Chip Scale Package (wlcsp) App 20140138855 - VAN GEMERT; Leonardus Antonius Elisabeth ; et al.	2014-05-22
Using A Double-cut For Mechanical Protection Of A Wafer-level Chip Scale Package (wlcsp) App 20140110842 - ZENZ; Christian ; et al.	2014-04-24
Backside Protection For A Wafer-level Chip Scale Package (wlcsp) App 20140110826 - BUENNING; Hartmut ; et al.	2014-04-24
Encapsulated Wafer-level Chip Scale (wlscp) Pedestal Packaging App 20140091458 - VAN GEMERT; Leonardus Antonius Elisabeth ; et al.	2014-04-03

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