BUDNAITIS, JOHN J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for BUDNAITIS, JOHN J..The latest application filed is for "method of wafer level burn-in".
- BUDNAITIS, JOHN J. - EAU CLAIRE WI
| Patent | Date |
|---|---|
| Method Of Wafer Level Burn-in App 20020021138 - BUDNAITIS, JOHN J. ; et al. | 2002-02-21 |
| Constraining ring for use in electronic packaging Grant 6,184,589 - Budnaitis , et al. February 6, 2 | 2001-02-06 |
| Method of making a high planarity, low CTE base for semiconductor reliability screening Grant 6,046,060 - Budnaitis April 4, 2 | 2000-04-04 |
| Wafer level burn-in system Grant 5,966,022 - Budnaitis , et al. October 12, 1 | 1999-10-12 |
| Method of forming a wafer level contact sheet having a permanent z-axis material Grant 5,966,593 - Budnaitis , et al. October 12, 1 | 1999-10-12 |
| Method of wafer level burn-in Grant 5,896,038 - Budnaitis , et al. April 20, 1 | 1999-04-20 |
| Wafer level burn-in base unit substrate and assembly Grant 5,886,535 - Budnaitis March 23, 1 | 1999-03-23 |
| Wafer level contact sheet and method of assembly Grant 5,766,979 - Budnaitis June 16, 1 | 1998-06-16 |
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