Buchwalter; Leena Paivikki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Buchwalter; Leena Paivikki.The latest application filed is for "low temperature bi-cmos compatible process for mems rf resonators and filters".

Company Profile

0.13.15

Buchwalter; Leena Paivikki - Hopewell Junction NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers Grant 8,314,500 - Belanger , et al. November 20, 2	2012-11-20
Low Temperature Bi-cmos Compatible Process For Mems Rf Resonators And Filters App 20120270351 - BUCHWALTER; Leena Paivikki ; et al.	2012-10-25
Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters Grant 8,269,291 - Buchwalter , et al. September 18, 2	2012-09-18
Laser release process for very thin Si-carrier build Grant 8,187,923 - Andry , et al. May 29, 2	2012-05-29
Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters Grant 7,943,412 - Buchwalter , et al. May 17, 2	2011-05-17
Low Temperature BI-CMOS Compatible Process For MEMS RF Resonators and Filters App 20110109405 - Buchwalter; Leena Paivikki ; et al.	2011-05-12
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers Grant 7,932,169 - Belanger , et al. April 26, 2	2011-04-26
Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation Grant 7,815,968 - Hougham , et al. October 19, 2	2010-10-19
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers App 20100062597 - Belanger; Luc ; et al.	2010-03-11
Method for precision assembly of integrated circuit chip packages Grant 7,615,405 - Andry , et al. November 10, 2	2009-11-10
Low temperature bi-CMOS compatible process for MEMS RF resonators and filters App 20090108381 - Buchwalter; Leena Paivikki ; et al.	2009-04-30
Method to create flexible connections for integrated circuits Grant 7,456,046 - Buchwalter , et al. November 25, 2	2008-11-25
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation Grant 7,452,568 - Hougham , et al. November 18, 2	2008-11-18
Method To Create Flexible Connections For Integrated Circuits App 20080217778 - Buchwalter; Leena Paivikki ; et al.	2008-09-11
Method For Precision Assembly Of Integrated Circuit Chip Packages App 20080182362 - Andry; Paul Stephen ; et al.	2008-07-31
Interconnections For Flip-chip Using Lead-free Solders And Having Improved Reaction Barrier Layers App 20080157395 - Belanger; Luc ; et al.	2008-07-03
Method To Create Flexible Connections For Integrated Circuits App 20080029889 - Buchwalter; Leena Paivikki ; et al.	2008-02-07
Method for precision assembly of integrated circuit chip packages Grant 7,282,391 - Andry , et al. October 16, 2	2007-10-16
Silicon chip carrier with conductive through-vias and method for fabricating same Grant 7,276,787 - Edelstein , et al. October 2, 2	2007-10-02
Method For Precision Assembly Of Integrated Circuit Chip Packages App 20070222065 - Andry; Paul Stephen ; et al.	2007-09-27
Method to create flexible connections for integrated circuits App 20060186540 - Buchwalter; Leena Paivikki ; et al.	2006-08-24
Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor Grant 7,019,402 - Andry , et al. March 28, 2	2006-03-28
Silicon chip carrier with conductive through-vias and method for fabricating same App 20060027934 - Edelstein; Daniel Charles ; et al.	2006-02-09
Chip packaging module with active cooling mechanisms App 20050168947 - Mok, Lawrence Shungwei ; et al.	2005-08-04
Silicon chip carrier with conductive through-vias and method for fabricating same App 20050121768 - Edelstein, Daniel Charles ; et al.	2005-06-09
Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor App 20050082676 - Andry, Paul Stephen ; et al.	2005-04-21
Microswitch with a micro-electromechanical system Grant 6,818,843 - Meixner , et al. November 16, 2	2004-11-16
Microswitch with a micro-electromechanical system App 20040021151 - Meixner, Michael ; et al.	2004-02-05

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