| Patent | Date |
|---|
Offset-aligned three-dimensional integrated circuit
Grant 11,437,359 - Wilkerson , et al. September 6, 2 | 2022-09-06 |
Semiconductor chip gettering
Grant 11,393,697 - Agarwal , et al. July 19, 2 | 2022-07-19 |
Molded chip package with anchor structures
Grant 11,367,628 - Shah , et al. June 21, 2 | 2022-06-21 |
Multirow Semiconductor Chip Connections
App 20220189879 - AGARWAL; RAHUL ; et al. | 2022-06-16 |
Semiconductor chip with solder cap probe test pads
Grant 11,309,222 - Fu , et al. April 19, 2 | 2022-04-19 |
Hybrid Bridged Fanout Chiplet Connectivity
App 20220102276 - AGARWAL; RAHUL ; et al. | 2022-03-31 |
Arrangement And Thermal Management Of 3d Stacked Dies
App 20220059425 - WUU; JOHN ; et al. | 2022-02-24 |
Molded die last chip combination
Grant 11,211,332 - Bhagavat , et al. December 28, 2 | 2021-12-28 |
Arrangement and thermal management of 3D stacked dies
Grant 11,189,540 - Wuu , et al. November 30, 2 | 2021-11-30 |
Arrangement and thermal management of 3D stacked dies
Grant 11,164,807 - Wuu , et al. November 2, 2 | 2021-11-02 |
Integrated Circuit Package With Integrated Voltage Regulator
App 20210313269 - BHAGAVAT; MILIND S. ; et al. | 2021-10-07 |
Molded Semiconductor Chip Package With Stair-step Molding Layer
App 20210296194 - Shah; Priyal ; et al. | 2021-09-23 |
Semiconductor Chip With Reduced Pitch Conductive Pillars
App 20210193604 - SHAH; PRIYAL ; et al. | 2021-06-24 |
Bond Pads For Low Temperature Hybrid Bonding
App 20210183810 - SHAH; PRIYAL ; et al. | 2021-06-17 |
Multi-chip package with offset 3D structure
Grant 11,018,125 - Bhagavat , et al. May 25, 2 | 2021-05-25 |
Integrated circuit package with integrated voltage regulator
Grant 11,011,466 - Bhagavat , et al. May 18, 2 | 2021-05-18 |
Optical encoder with direction-dependent optical properties comprising a spindle having an array of surface features defining a concave contour along a first direction and a convex contour along a second direction
Grant 11,002,572 - Boonsom , et al. May 11, 2 | 2021-05-11 |
Scheme For Enabling Die Reuse In 3d Stacked Products
App 20210098441 - Wuu; John J. ; et al. | 2021-04-01 |
Fabricating Active-bridge-coupled Gpu Chiplets
App 20210098419 - SALEH; Skyler J. ; et al. | 2021-04-01 |
Integrated Circuit Module With Integrated Discrete Devices
App 20210098437 - Bhagavat; Milind S. ; et al. | 2021-04-01 |
Semiconductor chip with reduced pitch conductive pillars
Grant 10,943,880 - Shah , et al. March 9, 2 | 2021-03-09 |
Semiconductor Chip With Solder Cap Probe Test Pads
App 20210066144 - Fu; Lei ; et al. | 2021-03-04 |
Bond pads for low temperature hybrid bonding
Grant 10,937,755 - Shah , et al. March 2, 2 | 2021-03-02 |
Fan-out Package With Reinforcing Rivets
App 20210057352 - Agarwal; Rahul ; et al. | 2021-02-25 |
Die stacking for multi-tier 3D integration
Grant 10,930,621 - Agarwal , et al. February 23, 2 | 2021-02-23 |
Semiconductor Chip Gettering
App 20210050223 - AGARWAL; RAHUL ; et al. | 2021-02-18 |
Multi-RDL structure packages and methods of fabricating the same
Grant 10,903,168 - Bhagavat , et al. January 26, 2 | 2021-01-26 |
Molded Chip Package With Anchor Structures
App 20210020459 - Shah; Priyal ; et al. | 2021-01-21 |
Gpu Chiplets Using High Bandwidth Crosslinks
App 20200409859 - SALEH; Skyler J. ; et al. | 2020-12-31 |
Integrated circuit module with integrated discrete devices
Grant 10,867,978 - Bhagavat , et al. December 15, 2 | 2020-12-15 |
Semiconductor Chip With Reduced Pitch Conductive Pillars
App 20200365543 - Shah; Priyal ; et al. | 2020-11-19 |
Die Stacking For Multi-tier 3d Integration
App 20200350292 - Agarwal; Rahul ; et al. | 2020-11-05 |
Semiconductor chip gettering
Grant 10,825,692 - Agarwal , et al. November 3, 2 | 2020-11-03 |
Multi-chip Package With Offset 3d Structure
App 20200343236 - Bhagavat; Milind S. ; et al. | 2020-10-29 |
Integrated Circuit Package With Integrated Voltage Regulator
App 20200312766 - Bhagavat; Milind S. ; et al. | 2020-10-01 |
Fan-out Packages With Warpage Resistance
App 20200294914 - Agarwal; Rahul ; et al. | 2020-09-17 |
Multi-rdl Structure Packages And Methods Of Fabricating The Same
App 20200294923 - Bhagavat; Milind S. ; et al. | 2020-09-17 |
Optical Encoder With Direction-dependent Optical Properties
App 20200271483 - Boonsom; Paisith P. ; et al. | 2020-08-27 |
Die stacking for multi-tier 3D integration
Grant 10,727,204 - Agarwal , et al. | 2020-07-28 |
Multi-chip package with offset 3D structure
Grant 10,714,462 - Bhagavat , et al. | 2020-07-14 |
Semiconductor Chip Gettering
App 20200203177 - Agarwal; Rahul ; et al. | 2020-06-25 |
Offset-aligned Three-dimensional Integrated Circuit
App 20200194413 - Wilkerson; Brett P. ; et al. | 2020-06-18 |
Integrated Circuit Module With Integrated Discrete Devices
App 20200185367 - Bhagavat; Milind S. ; et al. | 2020-06-11 |
Multi-RDL structure packages and methods of fabricating the same
Grant 10,672,712 - Bhagavat , et al. | 2020-06-02 |
Molded Die Last Chip Combination
App 20200168549 - Bhagavat; Milind S. ; et al. | 2020-05-28 |
Watch with rotatable optical encoder having a spindle defining an array of alternating regions extending along an axial direction parallel to the axis of a shaft
Grant 10,655,988 - Boonsom , et al. | 2020-05-19 |
Fan-out package with multi-layer redistribution layer structure
Grant 10,593,620 - Agarwal , et al. | 2020-03-17 |
Molded die last chip combination
Grant 10,593,628 - Bhagavat , et al. | 2020-03-17 |
Multi-rdl Structure Packages And Methods Of Fabricating The Same
App 20200035606 - Bhagavat; Milind S. ; et al. | 2020-01-30 |
3D stacked dies with disparate interconnect footprints
Grant 10,529,693 - Agarwal , et al. J | 2020-01-07 |
Bond Pads For Low Temperature Hybrid Bonding
App 20200006280 - Shah; Priyal ; et al. | 2020-01-02 |
Arrangement And Thermal Management Of 3d Stacked Dies
App 20190393123 - Wuu; John ; et al. | 2019-12-26 |
Arrangement And Thermal Management Of 3d Stacked Dies
App 20190393124 - Wuu; John ; et al. | 2019-12-26 |
Molded chip combination
Grant 10,510,721 - Bhagavat , et al. Dec | 2019-12-17 |
Die Stacking For Multi-tier 3d Integration
App 20190371763 - Agarwal; Rahul ; et al. | 2019-12-05 |
Fan-out Package With Multi-layer Redistribution Layer Structure
App 20190333851 - Agarwal; Rahul ; et al. | 2019-10-31 |
Molded Die Last Chip Combination
App 20190326221 - Bhagavat; Milind S. ; et al. | 2019-10-24 |
High Density Fan-out Packaging
App 20190326257 - Agarwal; Rahul ; et al. | 2019-10-24 |
Multi-chip Package With Offset 3d Structure
App 20190326273 - Bhagavat; Milind S. ; et al. | 2019-10-24 |
Arrangement and thermal management of 3D stacked dies
Grant 10,431,517 - Wuu , et al. O | 2019-10-01 |
Stacked Dies And Dummy Components For Improved Thermal Performance
App 20190189590 - Agarwal; Rahul ; et al. | 2019-06-20 |
Stacked dies and dummy components for improved thermal performance
Grant 10,312,221 - Agarwal , et al. | 2019-06-04 |
3d Stacked Dies With Disparate Interconnect Footprints
App 20190164936 - Agarwal; Rahul ; et al. | 2019-05-30 |
Arrangement And Thermal Management Of 3d Stacked Dies
App 20190067152 - Wuu; John ; et al. | 2019-02-28 |
Molded Chip Combination
App 20190051633 - Bhagavat; Milind S. ; et al. | 2019-02-14 |
Optical Encoder With Direction-dependent Optical Properties
App 20190017846 - Boonsom; Paisith P. ; et al. | 2019-01-17 |
Optical encoder with direction-dependent optical properties having an optically anisotropic region to produce a first and a second light distribution
Grant 10,145,711 - Boonsom , et al. De | 2018-12-04 |
Biometric sensor chip having distributed sensor and control circuitry
Grant 9,883,822 - Bhagavat , et al. February 6, 2 | 2018-02-06 |
Method and system for CMOS based MEMS bump stop contact damage prevention
Grant 9,850,127 - Bhagavat , et al. December 26, 2 | 2017-12-26 |
Method And System For Cmos Based Mems Bump Stop Contact Damage Prevention
App 20170355599 - Bhagavat; Milind S. ; et al. | 2017-12-14 |
Method and system for CMOS based MEMS bump stop contact damage prevention
Grant 9,751,756 - Bhagavat , et al. September 5, 2 | 2017-09-05 |
Finger biometric sensor assembly including direct bonding interface and related methods
Grant 9,679,187 - Bhagavat , et al. June 13, 2 | 2017-06-13 |
Finger Biometric Sensor Assembly Including Direct Bonding Interface And Related Methods
App 20160371529 - Bhagavat; Milind S. ; et al. | 2016-12-22 |
Biometric Sensor Chip Having Distributed Sensor and Control Circuitry
App 20160278671 - Bhagavat; Milind S. ; et al. | 2016-09-29 |
Optical Encoder With Direction-dependent Optical Properties
App 20160258784 - Boonsom; Paisith P. ; et al. | 2016-09-08 |
Biometric Sensor Chip Having Distributed Sensor And Control Circuitry
App 20160217311 - Bhagavat; Milind S. ; et al. | 2016-07-28 |
Biometric sensor chip having distributed sensor and control circuitry
Grant 9,305,959 - Bhagavat , et al. April 5, 2 | 2016-04-05 |
Flexible routing for chip on board applications
Grant 9,287,189 - Bhagavat , et al. March 15, 2 | 2016-03-15 |
Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections
Grant 9,236,442 - Bhagavat , et al. January 12, 2 | 2016-01-12 |
Flexural Plate Wave Device For Chip Cooling
App 20150318230 - Bhagavat; Milind S. ; et al. | 2015-11-05 |
Method And System For Cmos Based Mems Bump Stop Contact Damage Prevention
App 20150291413 - Bhagavat; Milind S. ; et al. | 2015-10-15 |
Flexural plate wave device for chip cooling
Grant 9,123,698 - Bhagavat , et al. September 1, 2 | 2015-09-01 |
Biometric Sensor Chip Having Distributed Sensor and Control Circuitry
App 20140361395 - Bhagavat; Milind S. ; et al. | 2014-12-11 |
Methods and systems for on-chip osmotic airflow cooling
Grant 8,817,472 - Zhao , et al. August 26, 2 | 2014-08-26 |
Integration Of Chips And Silicon-based Trench Capacitors Using Low Parasitic Silicon-level Connections
App 20140145300 - Bhagavat; Milind S. ; et al. | 2014-05-29 |
Flexible Routing For Chip On Board Applications
App 20140124940 - Bhagavat; Milind S. ; et al. | 2014-05-08 |
Methods and Systems for On-Chip Osmotic Airflow Cooling
App 20120314367 - ZHAO; Sam Ziqun ; et al. | 2012-12-13 |
Methods of grinding semiconductor wafers having improved nanotopology
Grant 8,267,745 - Bhagavat , et al. September 18, 2 | 2012-09-18 |
Flexural Plate Wave Device For Chip Cooling
App 20120050989 - Bhagavat; Milind S. ; et al. | 2012-03-01 |
Wafer clamping device for a double side grinder
Grant 8,066,553 - Bhagavat , et al. November 29, 2 | 2011-11-29 |
Methods of Grinding Semiconductor Wafers Having Improved Nanotopology
App 20110101504 - Bhagavat; Milind S. ; et al. | 2011-05-05 |
Method for assessing workpiece nanotopology using a double side wafer grinder
Grant 7,927,185 - Vandamme , et al. April 19, 2 | 2011-04-19 |
Method For Assessing Workpiece Nanotopology Using A Double Side Wafer Grinder
App 20100087123 - Vandamme; Roland R. ; et al. | 2010-04-08 |
Double side wafer grinder and methods for assessing workpiece nanotopology
Grant 7,662,023 - Vandamme , et al. February 16, 2 | 2010-02-16 |
Double side wafer grinder and methods for assessing workpiece nanotopology
Grant 7,601,049 - Bhagavat , et al. October 13, 2 | 2009-10-13 |
Wafer Clamping Device For A Double Side Grinder
App 20080020684 - Bhagavat; Milind S. ; et al. | 2008-01-24 |
Double side wafer grinder and methods for assessing workpiece nanotopology
App 20070179660 - Bhagavat; Sumeet S. ; et al. | 2007-08-02 |
Double side wafer grinder and methods for assessing workpiece nanotopology
App 20070179659 - Vandamme; Roland D. ; et al. | 2007-08-02 |
Method and apparatus for slicing semiconductor wafers
App 20030170948 - Bhagavat, Milind S. ; et al. | 2003-09-11 |
Method of estimating post-polishing waviness characteristics of a semiconductor wafer
Grant 6,613,591 - Bhagavat , et al. September 2, 2 | 2003-09-02 |
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