Bhagath; Shrikar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bhagath; Shrikar.The latest application filed is for "power reallocation for memory device".

Company Profile

3.31.37

Bhagath; Shrikar - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power Reallocation For Memory Device App 20220293195 - Bhagath; Shrikar ; et al.	2022-09-15
Package Process, Daf Replacement App 20220028819 - ZHANG; Siqi ; et al.	2022-01-27
Semiconductor Device Package Having Cover Portion With Curved Surface Profile App 20210384099 - Yang; Bo ; et al.	2021-12-09
Memory scaling semiconductor device Grant 11,094,674 - Vodrahalli , et al. August 17, 2	2021-08-17
Memory scaling semiconductor device Grant 11,011,500 - Vodrahalli , et al. May 18, 2	2021-05-18
Memory Scaling Semiconductor Device App 20210104495 - Vodrahalli; Nagesh ; et al.	2021-04-08
Memory Scaling Semiconductor Device App 20210104494 - Vodrahalli; Nagesh ; et al.	2021-04-08
Partial memory die Grant 10,290,354 - Linnen , et al.	2019-05-14
Partial Memory Die App 20190130978 - Linnen; Daniel ; et al.	2019-05-02
Semiconductor device including die bond pads at a die edge Grant 10,128,218 - Yan , et al. November 13, 2	2018-11-13
Semiconductor Device Including Die Bond Pads At A Die Edge App 20180175006 - Yan; Junrong ; et al.	2018-06-21
Epoxy Coating On Substrate For Die Attach App 20150214184 - Gu; Wei ; et al.	2015-07-30
Extrinsic gettering on semiconductor devices Grant 9,064,836 - Chiu , et al. June 23, 2	2015-06-23
System-in-a-package based flash memory card Grant 8,852,999 - Takiar , et al. October 7, 2	2014-10-07
System-in-a-package based flash memory card Grant 8,637,978 - Takiar , et al. January 28, 2	2014-01-28
Semiconductor device having under-filled die in a die stack Grant 8,575,724 - Bhagath , et al. November 5, 2	2013-11-05
Method of fabricating stacked semiconductor package with localized cavities for wire bonding Grant 8,470,640 - Takiar , et al. June 25, 2	2013-06-25
Stacked wire bonded semiconductor package with low profile bond line Grant 8,432,043 - Takiar , et al. April 30, 2	2013-04-30
Epoxy Coating On Substrate For Die Attach App 20120279651 - Gu; Wei ; et al.	2012-11-08
Stacked semiconductor package with localized cavities for wire bonding Grant 8,294,251 - Takiar , et al. October 23, 2	2012-10-23
Method of fabricating stacked wire bonded semiconductor package with low profile bond line Grant 8,241,953 - Takiar , et al. August 14, 2	2012-08-14
System-in-a-package Based Flash Memory Card App 20120009732 - Takiar; Hem ; et al.	2012-01-12
System-in-a-package Based Flash Memory Card App 20120007226 - Takiar; Hem ; et al.	2012-01-12
System-in-a-package based flash memory card Grant 8,022,519 - Takiar , et al. September 20, 2	2011-09-20
Padless substrate for surface mounted components Grant 7,967,184 - Liao , et al. June 28, 2	2011-06-28
Semiconductor Device Having Under-filled Die In A Die Stack App 20110024881 - Bhagath; Shrikar ; et al.	2011-02-03
Method of under-filling semiconductor die in a die stack and semiconductor device formed thereby Grant 7,816,181 - Bhagath , et al. October 19, 2	2010-10-19
Leadframe based flash memory cards Grant 7,795,715 - Takiar , et al. September 14, 2	2010-09-14
Semiconductor device having multiple die redistribution layer Grant 7,791,191 - Takiar , et al. September 7, 2	2010-09-07
Method Of Fabricating Stacked Wire Bonded Semiconductor Package With Low Profile Bond Line App 20090325344 - Takiar; Hem ; et al.	2009-12-31
Stacked Semiconductor Package With Localized Cavities For Wire Bonding App 20090321950 - Takiar; Hem ; et al.	2009-12-31
Stacked Wire Bonded Semiconductor Package With Low Profile Bond Line App 20090321951 - Takiar; Hem ; et al.	2009-12-31
Method Of Fabricating Stacked Semiconductor Package With Localized Cavities For Wire Bonding App 20090325342 - Takiar; Hem ; et al.	2009-12-31
Method of making a semiconductor device having multiple die redistribution layer Grant 7,560,304 - Takiar , et al. July 14, 2	2009-07-14
Tsop Leadframe Strip Of Multiply Encapsulated Packages App 20090166820 - Takiar; Hem ; et al.	2009-07-02
Leadframe Based Flash Memory Cards App 20090134502 - Takiar; Hem ; et al.	2009-05-28
Test pads on flash memory cards Grant 7,495,255 - Takiar , et al. February 24, 2	2009-02-24
Method of fabricating leadframe based flash memory cards including singulation by straight line cuts Grant 7,488,620 - Takiar , et al. February 10, 2	2009-02-10
Method of manufacturing flash memory cards Grant 7,485,501 - Takiar , et al. February 3, 2	2009-02-03
Semiconductor Die Stack Having Heightened Contact For Wire Bond App 20080237887 - Takiar; Hem ; et al.	2008-10-02
Method Of Making Semiconductor Die Stack Having Heightened Contact For Wire Bond App 20080242076 - Takiar; Hem ; et al.	2008-10-02
Method Of Making A Semiconductor Device Having Multiple Die Redistribution Layer App 20080160674 - Takiar; Hem ; et al.	2008-07-03
Semiconductor Device Having Multiple Die Redistribution Layer App 20080157355 - Takiar; Hem ; et al.	2008-07-03
Die Stacking Using Insulated Wire Bonds App 20080128880 - Takiar; Hem ; et al.	2008-06-05
Film-on-wire Bond Semiconductor Device App 20080128879 - Takiar; Hem ; et al.	2008-06-05
Method Of Die Stacking Using Insulated Wire Bonds App 20080131999 - Takiar; Hem ; et al.	2008-06-05
Method of fabricating a film-on-wire bond semiconductor device App 20080131998 - Takiar; Hem ; et al.	2008-06-05
Test Pads On Flash Memory Cards App 20070257352 - Takiar; Hem ; et al.	2007-11-08
Integrated Circuit Package Having Stacked Integrated Circuits And Method Therefor App 20070218588 - Takiar; Hem P. ; et al.	2007-09-20
Test pads on flash memory cards Grant 7,259,028 - Takiar , et al. August 21, 2	2007-08-21
SIP based flash memory card Grant D548,740 - Takiar , et al. August 14, 2	2007-08-14
Strip for integrated circuit packages having a maximized usable area App 20070163109 - Takiar; Hem ; et al.	2007-07-19
Test Pads On Flash Memory Cards App 20070152215 - Takiar; Hem ; et al.	2007-07-05
Leadframe based flash memory cards App 20070155046 - Takiar; Hem ; et al.	2007-07-05
Padless substrate for surface mounted components App 20070108257 - Liao; Chih-Chin ; et al.	2007-05-17
Method of manufacturing flash memory cards App 20070099340 - Takiar; Hem ; et al.	2007-05-03
Apparatus having reduced warpage in an over-molded IC package App 20070001285 - Takiar; Hem ; et al.	2007-01-04
Method of reducing warpage in an over-molded IC package App 20070004094 - Takiar; Hem ; et al.	2007-01-04
Integrated circuit package having stacked integrated circuits and method therefor App 20060267173 - Takiar; Hem P. ; et al.	2006-11-30
System-in-a-package based flash memory card App 20060261454 - Takiar; Hem ; et al.	2006-11-23
Heat sink grounded to a grounded package lid Grant 6,512,675 - Tarter , et al. January 28, 2	2003-01-28
Flip chip package compatible with multiple die footprints and method of assembling the same Grant 6,229,219 - Bhagath , et al. May 8, 2	2001-05-08