| Patent | Date |
|---|
Method for manufacturing electric element built-in module with sealed electric element
Grant 7,134,198 - Nakatani , et al. November 14, 2 | 2006-11-14 |
Display apparatus and its manufacturing method
App 20050017268 - Tsukamoto, Masahide ; et al. | 2005-01-27 |
Method of producing mounting structure and mounting structure produced by the same
Grant 6,818,461 - Amami , et al. November 16, 2 | 2004-11-16 |
Semiconductor device including a wiring board with a three-dimensional wiring pattern
App 20040212075 - Shiraishi, Tsukasa ; et al. | 2004-10-28 |
Module with built-in electronic elements and method of manufacture thereof
Grant 6,798,121 - Nakatani , et al. September 28, 2 | 2004-09-28 |
Wiring board and production method thereof
Grant 6,774,316 - Suzuki , et al. August 10, 2 | 2004-08-10 |
Semiconductor device including wiring board with three dimensional wiring pattern
Grant 6,756,663 - Shiraishi , et al. June 29, 2 | 2004-06-29 |
Method for producing mounting structure for an electronic component
Grant 6,749,889 - Takezawa , et al. June 15, 2 | 2004-06-15 |
Surface acoustic wave device, method for producing the same, and circuit module using the same
Grant 6,710,682 - Onishi , et al. March 23, 2 | 2004-03-23 |
Electric element built-in module and method for manufacturing the same
App 20040040740 - Nakatani, Seiichi ; et al. | 2004-03-04 |
Method for producing a printed-circuit board having projection electrodes
Grant 6,694,613 - Nakamura , et al. February 24, 2 | 2004-02-24 |
Method of producing a circuit board
Grant 6,691,409 - Suzuki , et al. February 17, 2 | 2004-02-17 |
Mounting structure for an electronic component and method for producing the same
App 20030207073 - Takezawa, Hiroaki ; et al. | 2003-11-06 |
Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device
Grant 6,603,207 - Bessho August 5, 2 | 2003-08-05 |
Semiconductor device and module of the same
App 20030094685 - Shiraishi, Tsukasa ; et al. | 2003-05-22 |
Circuit board and production of the same
App 20030066683 - Suzuki, Takeshi ; et al. | 2003-04-10 |
Semiconductor device including a wiring board and semiconductor elements mounted thereon
Grant 6,525,414 - Shiraishi , et al. February 25, 2 | 2003-02-25 |
Module with built-in electronic elements and method of manufacture thereof
App 20020159242 - Nakatani, Seiichi ; et al. | 2002-10-31 |
Electrical mounting structure having an elution preventive film
Grant 6,429,382 - Amami , et al. August 6, 2 | 2002-08-06 |
Surface accoustic wave device, method for producing the same, and circuit module using the same
App 20020101304 - Onishi, Keiji ; et al. | 2002-08-01 |
Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device
App 20020081830 - Bessho, Yoshihiro | 2002-06-27 |
Method of producing mounting structure and mounting structure produced by the same
App 20020072151 - Amami, Kazuyoshi ; et al. | 2002-06-13 |
Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate
Grant 6,372,548 - Bessho , et al. April 16, 2 | 2002-04-16 |
Circuit board and production of the same
App 20020038725 - Suzuki, Takeshi ; et al. | 2002-04-04 |
Chip carrier and method of manufacturing and mounting the same
Grant 6,365,499 - Nakamura , et al. April 2, 2 | 2002-04-02 |
Mounting structure for an electronic component and method for producing the same
App 20020034620 - Takezawa, Hiroaki ; et al. | 2002-03-21 |
Method For Fabricating A Semiconductor Package With A Semiconductor Device Attached To A Multilayered Substrate
App 20020017712 - BESSHO, YOSHIHIRO ; et al. | 2002-02-14 |
Conductive Paste, Its Manufacturing Method, And Printed Wiring Board Using The Same
App 20020008228 - TAKEZAWA, HIROAKI ; et al. | 2002-01-24 |
Chip Carrier And Method Of Manufacturing And Mounting The Same
App 20020003299 - NAKAMURA, YOSHIFUMI ; et al. | 2002-01-10 |
Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor device
App 20010033032 - Ono, Masahiro ; et al. | 2001-10-25 |
Printed-circuit board having projection electrodes and method for producing the same
App 20010029666 - Nakamura, Yoshifumi ; et al. | 2001-10-18 |
Printed-circuit board having projection electrodes and method for producing the same
Grant 6,300,576 - Nakamura , et al. October 9, 2 | 2001-10-09 |
Electrode Structure For Semiconductor Device, Method For Forming The Same, Mounted Body Including Semiconductor Device And Semiconductor Device
App 20010014523 - BESSHO, YOSHIHIRO | 2001-08-16 |
Semiconductor device and module of the same
App 20010002727 - Shiraishi, Tsukasa ; et al. | 2001-06-07 |
Semiconductor device and method of manufacturing same
App 20010002733 - Bessho, Yoshihiro ; et al. | 2001-06-07 |
Chip carrier
Grant 6,229,209 - Nakamura , et al. May 8, 2 | 2001-05-08 |
Method for fabricating bump electrodes with a leveling step for uniform heights
Grant 6,207,550 - Hase , et al. March 27, 2 | 2001-03-27 |
Electronic part and a method of production thereof
Grant 6,154,940 - Onishi , et al. December 5, 2 | 2000-12-05 |
Semiconductor unit and method for manufacturing the same
Grant 6,103,551 - Ono , et al. August 15, 2 | 2000-08-15 |
Semiconductor device having a bump having a rugged side
Grant 6,088,236 - Tomura , et al. July 11, 2 | 2000-07-11 |
Electronic part and a method of production thereof
Grant 5,920,142 - Onishi , et al. July 6, 1 | 1999-07-06 |
Semiconductor unit with semiconductor device mounted with conductive adhesive
Grant 5,844,320 - Ono , et al. December 1, 1 | 1998-12-01 |
Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method
Grant 5,670,826 - Bessho , et al. September 23, 1 | 1997-09-23 |
Method of making multi-layered ceramic substrates
Grant 5,662,755 - Miura , et al. September 2, 1 | 1997-09-02 |
Method for mounting a semiconductor device on a circuit board
Grant 5,651,179 - Bessho , et al. July 29, 1 | 1997-07-29 |
Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
Grant 5,641,996 - Omoya , et al. June 24, 1 | 1997-06-24 |
Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex
Grant 5,640,051 - Tomura , et al. June 17, 1 | 1997-06-17 |
Methods for producing a chip carrier and terminal electrode for a circuit substrate
Grant 5,628,919 - Tomura , et al. May 13, 1 | 1997-05-13 |
Method of manufacturing a ceramic substrate
Grant 5,547,530 - Nakamura , et al. August 20, 1 | 1996-08-20 |
Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device
Grant 5,545,589 - Tomura , et al. August 13, 1 | 1996-08-13 |
Ceramic substrate and manufacturing method thereof
Grant 5,525,402 - Nakamura , et al. June 11, 1 | 1996-06-11 |
Assembly formed from conductive paste and insulating paste
Grant 5,496,619 - Itagaki , et al. March 5, 1 | 1996-03-05 |
Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
Grant 5,485,949 - Tomura , et al. January 23, 1 | 1996-01-23 |
Method of forming an electrical contact bump
Grant 5,090,119 - Tsuda , et al. February 25, 1 | 1992-02-25 |
Electrical contact bump and a package provided with the same
Grant 5,014,111 - Tsuda , et al. May 7, 1 | 1991-05-07 |
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