| Patent | Date |
|---|
Metal Oxide Nanofibrous Materials For Photodegradation Of Environmental Toxins
App 20200316577 - Jones; Wayne E. ; et al. | 2020-10-08 |
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
Grant 10,699,972 - Bernier , et al. | 2020-06-30 |
Metal oxide nanofibrous materials for photodegradation of environmental toxins
Grant 10,661,261 - Jones , et al. | 2020-05-26 |
Increased thermal stabilization of optical absorbers
Grant 10,459,121 - Bernier , et al. Oc | 2019-10-29 |
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection
App 20180350768 - BERNIER; William E. ; et al. | 2018-12-06 |
Flat Laminate, Symmetrical Test Structures And Method Of Use To Gauge White Bump Sensitivity
App 20180082912 - Bernier; William E. ; et al. | 2018-03-22 |
Conductive films and devices comprised thereof
Grant 9,920,220 - Bernier , et al. March 20, 2 | 2018-03-20 |
Increased thermal stabilization of optical absorbers
Grant 9,915,757 - Bernier , et al. March 13, 2 | 2018-03-13 |
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
Grant 9,899,279 - Bernier , et al. February 20, 2 | 2018-02-20 |
Metal Oxide Nanofibrous Materials For Photodegradation Of Environmental Toxins
App 20170056873 - Jones; Wayne E. ; et al. | 2017-03-02 |
Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection
App 20160233190 - Bernier; William E. ; et al. | 2016-08-11 |
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity
Grant 8,957,531 - Bernier , et al. February 17, 2 | 2015-02-17 |
Flat Laminate, Symmetrical Test Structures And Method Of Use To Gauge White Bump Sensitivity
App 20150036716 - Bernier; William E. ; et al. | 2015-02-05 |
Conductive Films And Devices Comprised Thereof
App 20140272342 - Bernier; William E. ; et al. | 2014-09-18 |
Uniform solder reflow fixture
Grant 8,444,043 - Bernier , et al. May 21, 2 | 2013-05-21 |
Flat Laminate, Symmetrical Test Structures and Method of Use To Gauge White Bump Sensitivity
App 20130098176 - Bernier; William E. ; et al. | 2013-04-25 |
Interposer for ESD, EMI, and EMC
App 20130082365 - BERNIER; WILLIAM E. ; et al. | 2013-04-04 |
Pulpstone for long fiber pulp production
Grant 8,167,962 - Smith , et al. May 1, 2 | 2012-05-01 |
Compressible films surrounding solder connectors
Grant 7,566,649 - Bernier , et al. July 28, 2 | 2009-07-28 |
Low stress conductive polymer bump
Grant 7,442,878 - Bernier , et al. October 28, 2 | 2008-10-28 |
Pulpstone for Long Fiber Pulp Production
App 20080250725 - Smith; Glen A. ; et al. | 2008-10-16 |
Compressible films surrounding solder connectors
Grant 7,332,821 - Bernier , et al. February 19, 2 | 2008-02-19 |
Compressible Films Surrounding Solder Connectors
App 20080009101 - Bernier; William E. ; et al. | 2008-01-10 |
Compliant electrical contacts
Grant 7,316,572 - Bernier , et al. January 8, 2 | 2008-01-08 |
Compliant Electrical Contacts
App 20080000080 - Bernier; William E. ; et al. | 2008-01-03 |
Low Stress Conductive Polymer Bump
App 20070084629 - Bernier; William E. ; et al. | 2007-04-19 |
Low stress conductive polymer bump
Grant 7,170,187 - Bernier , et al. January 30, 2 | 2007-01-30 |
Extension of fatigue life for C4 solder ball to chip connection
Grant 7,119,003 - Bernier , et al. October 10, 2 | 2006-10-10 |
Compliant Electrical Contacts
App 20060172565 - Bernier; William E. ; et al. | 2006-08-03 |
Extension of fatigue life for C4 solder ball to chip connection
Grant 7,067,916 - Bernier , et al. June 27, 2 | 2006-06-27 |
Low Stress Conductive Polymer Bump
App 20060043608 - Bernier; William E. ; et al. | 2006-03-02 |
Compressible Films Surrounding Solder Connectors
App 20060040567 - Bernier; William E. ; et al. | 2006-02-23 |
Extension of fatigue life for C4 solder ball to chip connection
App 20050224973 - Bernier, William E. ; et al. | 2005-10-13 |
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
Grant 6,921,015 - Bernier , et al. July 26, 2 | 2005-07-26 |
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
App 20030178473 - Bernier, William E. ; et al. | 2003-09-25 |
Method and device for semiconductor testing using electrically conductive adhesives
Grant 6,559,666 - Bernier , et al. May 6, 2 | 2003-05-06 |
Flux composition and soldering method for high density arrays
Grant 6,550,667 - Bernier , et al. April 22, 2 | 2003-04-22 |
Extension of fatigue life for C4 solder ball to chip connection
App 20020195707 - Bernier, William E. ; et al. | 2002-12-26 |
Conductive adhesive having a palladium matrix interface between two metal surfaces
Grant 6,425,772 - Bernier , et al. July 30, 2 | 2002-07-30 |
Flux composition and soldering method for high density arrays
App 20020063146 - Bernier, William E. ; et al. | 2002-05-30 |
Conductive adhesive having a palladium matrix interface between two metal surfaces
App 20020022384 - Bernier, William E. ; et al. | 2002-02-21 |
Method and device for semiconductor testing using electrically conductive adhesives
App 20010035759 - Bernier, William E. ; et al. | 2001-11-01 |
Semiconductor Testing Using Electrically Conductive Adhesives
App 20010024127 - BERNIER, WILLIAM E. ; et al. | 2001-09-27 |
Reduced electrode wear in electrolytic printing by pH control of the print reaction zone
Grant 4,453,171 - Bernier , et al. June 5, 1 | 1984-06-05 |
Electrochromic printing
Grant 4,444,626 - Bernier , et al. April 24, 1 | 1984-04-24 |
Electrolytic printing
Grant 4,374,001 - Bernier February 15, 1 | 1983-02-15 |
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