Benzel; Hubert

Patent Applications and Registrations

Patent applications and USPTO patent grants for Benzel; Hubert.The latest application filed is for "sensor unit including a decoupling structure and manufacturing method therefor".

Company Profile

0.83.87

Benzel; Hubert - Pliezhausen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sensor unit including a decoupling structure and manufacturing method therefor Grant 9,926,188 - Classen , et al. March 27, 2	2018-03-27
Micromechanical sensor system and corresponding manufacturing method Grant 9,885,626 - Haag , et al. February 6, 2	2018-02-06
Sensor Unit Including A Decoupling Structure And Manufacturing Method Therefor App 20170203958 - CLASSEN; Johannes ; et al.	2017-07-20
Sensor, method for producing a sensor and method for mounting a sensor Grant 9,632,104 - Benzel , et al. April 25, 2	2017-04-25
Integrated diode array and corresponding manufacturing method Grant 9,240,407 - Schuermann , et al. January 19, 2	2016-01-19
Component having a via Grant 9,082,831 - Ahles , et al. July 14, 2	2015-07-14
Micromechanical Sensor System And Corresponding Manufacturing Method App 20150059485 - Haag; Frieder ; et al.	2015-03-05
Integrated Humidity Sensor And Method For The Manufacture Thereof App 20150047430 - Benzel; Hubert	2015-02-19
Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component Grant 8,901,684 - Benzel , et al. December 2, 2	2014-12-02
Micromechanical component having an inclined structure and corresponding manufacturing method Grant 8,847,336 - Pirk , et al. September 30, 2	2014-09-30
Method for producing a semiconductor component and a semiconductor component produced according to the method Grant RE44,995 - Benzel , et al. July 8, 2	2014-07-08
Method for creating monocrystalline piezoresistors Grant 8,759,136 - Benzel , et al. June 24, 2	2014-06-24
Sensor and method for its production Grant 8,749,013 - Benzel , et al. June 10, 2	2014-06-10
Semiconductor Device And Method For Manufacturing A Semiconductor Device App 20140151885 - SCHMOLLNGRUBER; Peter ; et al.	2014-06-05
Integrated Diode Array And Corresponding Manufacturing Method App 20140097511 - Schuermann; Gregor ; et al.	2014-04-10
Sensor, Method For Producing A Sensor And Method For Mounting A Sensor App 20130257420 - Benzel; Hubert ; et al.	2013-10-03
Method for producing a component, and sensor element Grant 8,530,261 - Kramer , et al. September 10, 2	2013-09-10
Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate Grant 8,519,494 - Kramer , et al. August 27, 2	2013-08-27
Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type Grant 8,492,850 - Lammel , et al. July 23, 2	2013-07-23
Micromechanical capacitive pressure transducer and production method Grant 8,492,855 - Lammel , et al. July 23, 2	2013-07-23
Sensor system, method for operating a sensor system, and method for manufacturing a sensor system Grant 8,485,041 - Ahles , et al. July 16, 2	2013-07-16
Method for manufacturing capped MEMS components Grant 8,470,631 - Kramer , et al. June 25, 2	2013-06-25
Micromechanical pressure-sensor element and method for its production Grant 8,429,977 - Ahles , et al. April 30, 2	2013-04-30
Method for producing a plurality of chips and a chip produced accordingly Grant 8,405,210 - Kramer , et al. March 26, 2	2013-03-26
Method for manufacturing chips Grant 8,389,327 - Kramer , et al. March 5, 2	2013-03-05
Manufacturing Method For A Micromechanical Component, Corresponding Composite Component, And Corresponding Micromechanical Component App 20130001711 - BENZEL; Hubert ; et al.	2013-01-03
Method for manufacturing a plurality of thin chips and correspondingly manufactured thin chip Grant 8,318,544 - Benzel , et al. November 27, 2	2012-11-27
Method for creating monocrystalline piezoresistors App 20120248552 - BENZEL; Hubert ; et al.	2012-10-04
Pressure sensor having a cap above a first diaphragm connected to a hollow space below a second diaphragm Grant 8,256,299 - Mitschke , et al. September 4, 2	2012-09-04
Workpiece composite having a preform and a gel Grant 8,250,925 - Benzel , et al. August 28, 2	2012-08-28
Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component Grant 8,232,126 - Benzel , et al. July 31, 2	2012-07-31
Method For Manufacturing A Semiconductor Structure, And A Corresponding Semiconductor Structure App 20120132925 - Lammel; Gerhard ; et al.	2012-05-31
Sensor system and method for manufacturing a sensor system Grant 8,146,439 - Ahles , et al. April 3, 2	2012-04-03
Method for manufacturing a semiconductor structure, and a corresponding Semiconductor Structure Grant 8,148,234 - Lammel , et al. April 3, 2	2012-04-03
Sensor system for detecting high pressures App 20120073379 - Ahles; Marcus ; et al.	2012-03-29
Component having a VIA App 20120068356 - Ahles; Marcus ; et al.	2012-03-22
Method for producing a semiconductor component and a semiconductor component produced according to the method Grant 8,123,963 - Benzel , et al. February 28, 2	2012-02-28
Sensor System, Method For Operating A Sensor System, And Method For Manufacturing A Sensor System App 20110259109 - Ahles; Marcus ; et al.	2011-10-27
Micromechanical component and method for manufacturing a micromechanical component App 20110220471 - Benzel; Hubert ; et al.	2011-09-15
Micromechanical pressure-sensor element and method for its production App 20110209555 - Ahles; Marcus ; et al.	2011-09-01
Method for manufacturing a component, method for manufacturing a component system, component, and component system App 20110169107 - Kramer; Torsten ; et al.	2011-07-14
Manufacturing method for a micromechanical component, corresponding composite component, and corresponding micromechanical component App 20110163396 - Benzel; Hubert ; et al.	2011-07-07
Micromechanical Component Having An Inclined Structure And Corresponding Manufacturing Method App 20110147862 - Pirk; Tjalf ; et al.	2011-06-23
Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrate App 20110147864 - Kramer; Torsten ; et al.	2011-06-23
Method For Manufacturing Chips App 20110151620 - Kramer; Torsten ; et al.	2011-06-23
Method For Manufacturing A Plurality Of Thin Chips And Correspondingly Manufactured Thin Chip App 20110115095 - Benzel; Hubert ; et al.	2011-05-19
Micromechanical Capacitive Sensor Element App 20110108932 - Benzel; Hubert ; et al.	2011-05-12
Micromechanical sensor element Grant 7,918,136 - Muchow , et al. April 5, 2	2011-04-05
Sensor System And Method For Manufacturing A Sensor System App 20110072906 - AHLES; Marcus ; et al.	2011-03-31
Sensor System And Method For Manufacturing Same App 20110073969 - Benzel; Hubert ; et al.	2011-03-31
Semiconductor wafer having a multitude of sensor elements and method for measuring sensor elements on a semiconductor wafer Grant 7,872,487 - Ross , et al. January 18, 2	2011-01-18
Sensor And Method For Producing The Same App 20110002359 - Benzel; Hubert ; et al.	2011-01-06
Method for manufacturing a sensor array including a monolithically integrated circuit Grant 7,858,424 - Benzel , et al. December 28, 2	2010-12-28
Micromechanical semiconductor sensor Grant 7,843,025 - Benzel , et al. November 30, 2	2010-11-30
Micromechanical component and corresponding production method Grant 7,833,405 - Benzel , et al. November 16, 2	2010-11-16
Method For Producing A Plurality Of Chips And A Chip Produced Accordingly App 20100283147 - Kramer; Torsten ; et al.	2010-11-11
Method For Manufacturing Capped Mems Components App 20100267183 - Kramer; Torsten ; et al.	2010-10-21
Semiconductor component configured as a diaphragm sensor Grant 7,755,152 - Benzel , et al. July 13, 2	2010-07-13
Method For Producing A Component, And Sensor Element App 20100164027 - Kramer; Torsten ; et al.	2010-07-01
Micropump having a pump diaphragm and a polysilicon layer Grant 7,740,459 - Fuertsch , et al. June 22, 2	2010-06-22
Construction of a pressure sensor App 20100139409 - Mitschke; Michaela ; et al.	2010-06-10
Differential-pressure Sensor System And Corresponding Production Method App 20100133631 - BENZEL; Hubert	2010-06-03
Workpiece Composite and Use of the Workpiece Composite App 20100077862 - Benzel; Hubert ; et al.	2010-04-01
Method for manufacturing a semiconductor component and a semiconductor component, in particular a diaphragm sensor Grant 7,679,154 - Benzel , et al. March 16, 2	2010-03-16
Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type App 20100035068 - Lammel; Gerhard ; et al.	2010-02-11
Micromechanical device and method for producing a micromechanical device Grant 7,647,832 - Muchow , et al. January 19, 2	2010-01-19
Method For Manufacturing A Semiconductor Component, As Well As A Semiconductor Component, In A Particular A Diaphragm Sensor App 20090256219 - BENZEL; Hubert ; et al.	2009-10-15
Method for Manufacturing a Semiconductor Structure, and a Corresponding Semiconductor Structure App 20090236610 - Lammel; Gerhard ; et al.	2009-09-24
Container for an analysis chip Grant 7,585,662 - Weiblen , et al. September 8, 2	2009-09-08
Method for manufacturing a micromechanical sensor element Grant 7,572,661 - Benzel , et al. August 11, 2	2009-08-11
Electrical through-plating of semiconductor chips Grant 7,572,660 - Benzel , et al. August 11, 2	2009-08-11
Method for manufacturing a diaphragm sensor Grant 7,569,412 - Benzel , et al. August 4, 2	2009-08-04
Semiconductor Wafer Having A Multitude Of Sensor Elements And Method For Measuring Sensor Elements On A Semiconductor Wafer App 20090189629 - ROSS; Holger ; et al.	2009-07-30
Method for mounting semiconductor chips, and corresponding semiconductor chip system Grant 7,563,634 - Benzel July 21, 2	2009-07-21
Micromechanical device having two sensor patterns Grant 7,555,956 - Benzel , et al. July 7, 2	2009-07-07
Method for Manufacturing a Sensor Array Including a Monolithically Integrated Circuit App 20090142873 - Benzel; Hubert ; et al.	2009-06-04
Method For Manufacturing A Semiconductor Component, As Well As A Semiconductor Component, In Particular A Membrane Sensor App 20090127640 - Benzel; Hubert ; et al.	2009-05-21
Micromechanical Capacitive Pressure Transducer and Production Method App 20090101997 - Lammel; Gerhard ; et al.	2009-04-23
Micromechanical Sensor Element App 20090084182 - Muchow; Joerg ; et al.	2009-04-02
Micromechanical pressure sensor system Grant 7,493,819 - Benzel , et al. February 24, 2	2009-02-24
Method for manufacturing a membrane sensor Grant 7,494,839 - Benzel , et al. February 24, 2	2009-02-24
Method for producing cavities having optically transparent wall Grant 7,479,234 - Benzel , et al. January 20, 2	2009-01-20
Method for producing a semiconductor component and a semiconductor component produced according to the method Grant 7,479,232 - Benzel , et al. January 20, 2	2009-01-20
Method for producing a semiconductor component and a semiconductor component produced according to the method App 20080286970 - Benzel; Hubert ; et al.	2008-11-20
Method for Accelerated Etching of Silicon App 20080254635 - Benzel; Hubert ; et al.	2008-10-16
Micromechanical component and method Grant 7,404,332 - Lammel , et al. July 29, 2	2008-07-29
Method For Mounting Semiconductor Chips, and Corresponding Semiconductor Chip System App 20080128840 - Benzel; Hubert	2008-06-05
Method of making a differential pressure sensor Grant 7,368,313 - Benzel , et al. May 6, 2	2008-05-06
Method for manufacturing a semcoductor component and a semiconductor component, in particular a diaphragm sensor App 20080093694 - Benzel; Hubert ; et al.	2008-04-24
Sensor element with trenched cavity Grant 7,354,786 - Benzel , et al. April 8, 2	2008-04-08
Pressure sensor featuring pressure loading of the fastening element Grant 7,343,806 - Muchow , et al. March 18, 2	2008-03-18
Method for producing a semiconductor component and a semiconductor component, especially a membrane sensor Grant 7,306,966 - Benzel , et al. December 11, 2	2007-12-11
Corrosion Protection for Pressure Sensors App 20070279845 - Kuhnt; Winfried ; et al.	2007-12-06
Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method Grant 7,300,854 - Benzel , et al. November 27, 2	2007-11-27
Micromechanical piezoresistive pressure sensor device Grant 7,252,008 - Muchow , et al. August 7, 2	2007-08-07
Micromechanical device having two sensor patterns; method for producing a micromechanical device App 20070169558 - Benzel; Hubert ; et al.	2007-07-26
Micromechanical device and method for producing a micromechanical device App 20070126069 - Muchow; Joerg ; et al.	2007-06-07
Sensor system and method for manufacturing a sensor system App 20070113661 - Benzel; Hubert ; et al.	2007-05-24
Micromechanical sensor Grant 7,213,465 - Benzel , et al. May 8, 2	2007-05-08
Semiconductor component and a method for producing the same Grant 7,193,290 - Benzel , et al. March 20, 2	2007-03-20
Method of producing a semiconductor sensor component Grant 7,160,750 - Benzel , et al. January 9, 2	2007-01-09
Method for the production of a micromechanical part preferably used for fluidic applications, and micropump comprising a pump membrane made of a polysilicon layer App 20060186085 - Fuertsch; Matthias ; et al.	2006-08-24
Pressure sensor having a silicon chip on a steel diaphragm Grant 7,093,493 - Benzel , et al. August 22, 2	2006-08-22
Pressure sensor featuring pressure loading of the fastening element App 20060162462 - Muchow; Joerg ; et al.	2006-07-27
Sensor for measuring pressure in a sealed volume Grant 7,073,400 - Benzel , et al. July 11, 2	2006-07-11
Micromechanical component and method App 20060137460 - Lammel; Gerhard ; et al.	2006-06-29
Micromechanical pressure sensor Grant 7,055,392 - Muchow , et al. June 6, 2	2006-06-06
Method for producing micromechanic sensors and sensors produced by said method Grant 7,045,382 - Benzel , et al. May 16, 2	2006-05-16
Method for production of a semiconductor component and a semiconductor component produced by said method Grant 7,037,438 - Benzel , et al. May 2, 2	2006-05-02
Method for dicing semiconductor chips and corresponding semiconductor chip system Grant 7,026,224 - Benzel , et al. April 11, 2	2006-04-11
Micromechanical sensor element App 20060063293 - Benzel; Hubert ; et al.	2006-03-23
Sensor element with trenched cavity App 20060057816 - Benzel; Hubert ; et al.	2006-03-16
Method for producing a semiconductor component and a semiconductor component produced according to the method App 20060014392 - Benzel; Hubert ; et al.	2006-01-19
Semiconductor component having a first earlier structure differing from a second earlier structure Grant 6,972,447 - Benzel , et al. December 6, 2	2005-12-06
Micromechanical piezoresistive pressure sensor device App 20050252302 - Muchow, Joerg ; et al.	2005-11-17
Differential pressure sensor App 20050199973 - Benzel, Hubert ; et al.	2005-09-15
Method for mounting semiconductor chips and corresponding semiconductor chip system App 20050194685 - Weiblen, Kurt ; et al.	2005-09-08
Method for packaging semiconductor chips and corresponding semiconductor chip system App 20050186703 - Weiblen, Kurt ; et al.	2005-08-25
Method for manufacturing a semiconductor component, as well as a semiconductor component, in particular a membrane sensor App 20050181529 - Benzel, Hubert ; et al.	2005-08-18
Pressure sensor having a silicon chip on a steel diaphragm App 20050178208 - Benzel, Hubert ; et al.	2005-08-18
Method for manufacturing a semicondutor component, as well as a semicondutor component, in particular a diaphragm sensor App 20050142687 - Benzel, Hubert ; et al.	2005-06-30
Electrical through-plating of semiconductor chips App 20050133880 - Benzel, Hubert ; et al.	2005-06-23
Micromechanical component Grant 6,906,392 - Benzel , et al. June 14, 2	2005-06-14
Micromechanical sensor App 20050115321 - Benzel, Hubert ; et al.	2005-06-02
Method for dicing semiconductor chips and corresponding semiconductor chip system App 20050087843 - Benzel, Hubert ; et al.	2005-04-28
Power supply device for a tire-pressure sensor App 20050082912 - Junger, Andreas ; et al.	2005-04-21
Method for producing cavities having optically transparent wall App 20050016949 - Benzel, Hubert ; et al.	2005-01-27
Micromechanical apparatus, pressure sensor, and method App 20050016288 - Muchow, Joerg ; et al.	2005-01-27
Micromechanical component and pressure sensor having a component of this type Grant 6,840,111 - Benzel , et al. January 11, 2	2005-01-11
Micromechanical pressure sensor App 20050000292 - Muchow, Joerg ; et al.	2005-01-06
Method for producing a semiconductor component and a semiconductor component, especially a membrane sensor App 20040266050 - Benzel, Hubert ; et al.	2004-12-30
Micromechanical component and manufacturing method Grant 6,832,523 - Benzel , et al. December 21, 2	2004-12-21
Micromechanical component with different doping types so that one type is anodized into porous silicon Grant 6,803,637 - Benzel , et al. October 12, 2	2004-10-12
Container for an analysis chip App 20040180425 - Weiblen, Kurt ; et al.	2004-09-16
Semicoductor component and a method for producing the same App 20040155751 - Benzel, Hubert ; et al.	2004-08-12
Method for producing optically transparent regions in a silicon substrate App 20040155010 - Benzel, Hubert ; et al.	2004-08-12
Method for producing micromechanic sensors and sensors produced by said method App 20040152228 - Benzel, Hubert ; et al.	2004-08-05
Method for producing a semiconductor component and a semiconductor component produced according to this method App 20040147057 - Benzel, Hubert ; et al.	2004-07-29
Sensor App 20040093962 - Benzel, Hubert ; et al.	2004-05-20
Micromechanical component (on pressure sensor membrane) comprising a bellowstype structure for temperature shifts App 20040089073 - Benzel, Hubert ; et al.	2004-05-13
Micromechanical component and corresponding production method App 20040080004 - Benzel, Hubert ; et al.	2004-04-29
Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method App 20040065931 - Benzel, Hubert ; et al.	2004-04-08
Semiconductor component and method App 20040048430 - Benzel, Hubert ; et al.	2004-03-11
Micromechanical component App 20040021184 - Benzel, Hubert ; et al.	2004-02-05
Apparatus for transmitting and/or receiving data, tire for a motor vehicle, transmitting and/or receiving device and system for the wireless transmission of data App 20030220130 - Munz, Michael ; et al.	2003-11-27
Micromechanical diaphragm Grant 6,649,989 - Benzel , et al. November 18, 2	2003-11-18
Micromechanical component and corresponing production method App 20030116813 - Benzel, Hubert ; et al.	2003-06-26
Micromechanical diaphragm App 20030062579 - Benzel, Hubert ; et al.	2003-04-03
Micromechanical component App 20020174724 - Benzel, Hubert ; et al.	2002-11-28
Method for production of a semiconductor component and a semiconductor component produced by said method App 20020170875 - Benzel, Hubert ; et al.	2002-11-21
Micromechanical component and manufacturing method App 20020139171 - Benzel, Hubert ; et al.	2002-10-03
Micromechanical component and appropriate manufacturing method App 20020006682 - Benzel, Hubert ; et al.	2002-01-17
Pressure sensor Grant 6,062,088 - Ingrisch , et al. May 16, 2	2000-05-16
Capacitive pressure sensors with high linearity by optimizing electrode boundaries Grant 5,792,957 - Luder , et al. August 11, 1	1998-08-11