Belani; Suresh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Belani; Suresh.The latest application filed is for "dual lead frame semiconductor package and method of manufacture".

Company Profile

0.12.10

Belani; Suresh - Los Altos CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dual lead frame semiconductor package and method of manufacture Grant 10,229,893 - Kuo , et al.	2019-03-12
Dual Lead Frame Semiconductor Package and Method of Manufacture App 20170271304 - Kuo; Frank ; et al.	2017-09-21
Dual lead frame semiconductor package and method of manufacture Grant 9,595,503 - Kuo , et al. March 14, 2	2017-03-14
Common drain power clip for battery pack protection mosfet Grant 9,379,045 - Wu , et al. June 28, 2	2016-06-28
Dual lead frame semiconductor package and method of manufacture Grant 9,184,152 - Kuo , et al. November 10, 2	2015-11-10
Dual Lead Frame Semiconductor Package and Method of Manufacture App 20140370661 - Kuo; Frank ; et al.	2014-12-18
Dual Lead Frame Semiconductor Package and Method of Manufacture App 20140332939 - Kuo; Frank ; et al.	2014-11-13
Dual lead frame semiconductor package and method of manufacture Grant 8,822,273 - Kuo , et al. September 2, 2	2014-09-02
Multi-chip module power clip Grant 8,723,300 - Wu , et al. May 13, 2	2014-05-13
Common Drain Power Clip For Battery Pack Protection Mosfet App 20140070392 - Wu; Chung-Lin ; et al.	2014-03-13
Multi-chip Module Power Clip App 20140042599 - Wu; Chung-Lin ; et al.	2014-02-13
Semiconductor packages including die and L-shaped lead and method of manufacture Grant 8,586,419 - Jaunay , et al. November 19, 2	2013-11-19
Dual Lead Frame Semiconductor Package and Method of Manufacture App 20120112331 - Kuo; Frank ; et al.	2012-05-10
Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture App 20110175217 - Jaunay; Serge ; et al.	2011-07-21

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