Bathan; Henry Descalzo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bathan; Henry Descalzo.The latest application filed is for "semiconductor device and method of forming mold degating structure for pre-molded substrate".

Company Profile

2.153.108

Bathan; Henry Descalzo - Simi Valley CA
Bathan; Henry Descalzo - Thousand Oaks CA
Bathan; Henry Descalzo - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device and Method of Forming Mold Degating Structure for Pre-Molded Substrate App 20210151359 - Bathan; Henry Descalzo ; et al.	2021-05-20
Side-Solderable Leadless Package App 20210118776 - Bathan; Henry Descalzo	2021-04-22
Side-solderable leadless package Grant 10,892,211 - Bathan January 12, 2	2021-01-12
Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps Grant RE47,923 - Camacho , et al.	2020-03-31
Side-Solderable Leadless Package App 20190051584 - Bathan; Henry Descalzo	2019-02-14
Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof Grant 9,337,161 - Camacho , et al. May 10, 2	2016-05-10
Integrated circuit packaging system with trace protection layer and method of manufacture thereof Grant 9,177,897 - Do , et al. November 3, 2	2015-11-03
Integrated circuit packaging system with plated leads and method of manufacture thereof Grant 9,142,531 - Camacho , et al. September 22, 2	2015-09-22
Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof Grant 9,059,151 - Camacho , et al. June 16, 2	2015-06-16
Integrated circuit package system with planar interconnect Grant 9,059,074 - Camacho , et al. June 16, 2	2015-06-16
Integrated circuit packaging system with a flip chip and method of manufacture thereof Grant 9,034,692 - Bathan , et al. May 19, 2	2015-05-19
Integrated circuit packaging system with a lead and method of manufacture thereof Grant 9,035,440 - Espiritu , et al. May 19, 2	2015-05-19
Integrated circuit package system with relief Grant 8,981,548 - Shim , et al. March 17, 2	2015-03-17
Integrated circuit package system with array of external interconnects Grant 8,957,515 - Camacho , et al. February 17, 2	2015-02-17
Etched recess package on package system Grant 8,941,219 - Camacho , et al. January 27, 2	2015-01-27
Integrated circuit packaging system with die paddles and method of manufacture thereof Grant 8,936,971 - Camacho , et al. January 20, 2	2015-01-20
Integrated circuit package system with device cavity Grant 8,937,393 - Bathan , et al. January 20, 2	2015-01-20
Integrated circuit packaging system with lead frame and method of manufacture thereof Grant 8,912,046 - Espiritu , et al. December 16, 2	2014-12-16
Integrated Circuit Package System with Removable Backing Element Having Plated Terminal Leads and Method of Manufacture Thereof App 20140332955 - Camacho; Zigmund R. ; et al.	2014-11-13
Integrated circuit packaging system with plated leads and method of manufacture thereof Grant 8,809,119 - Espiritu , et al. August 19, 2	2014-08-19
Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof Grant 8,810,017 - Camacho , et al. August 19, 2	2014-08-19
Integrated circuit packaging system with high lead count and method of manufacture thereof Grant 8,810,015 - Camacho , et al. August 19, 2	2014-08-19
Integrated circuit packaging system with protective coating and method of manufacture thereof Grant 8,803,300 - Bathan , et al. August 12, 2	2014-08-12
Integrated circuit packaging system with island terminals and method of manufacture thereof Grant 8,802,501 - Camacho , et al. August 12, 2	2014-08-12
Integrated circuit packaging system with interconnects and method of manufacture thereof Grant 8,802,555 - Bathan , et al. August 12, 2	2014-08-12
Integrated circuit packaging system with leads and transposer and method of manufacture thereof Grant 8,786,063 - Camacho , et al. July 22, 2	2014-07-22
Integrated circuit mounting system with paddle interlock and method of manufacture thereof Grant 8,779,565 - Han , et al. July 15, 2	2014-07-15
Integrated circuit packaging system with flip chip and method of manufacture thereof Grant 8,766,428 - Camacho , et al. July 1, 2	2014-07-01
Integrated circuit packaging system with a leaded package and method of manufacture thereof Grant 8,729,693 - Camacho , et al. May 20, 2	2014-05-20
System and apparatus for wafer level integration of components Grant 8,722,457 - Camacho , et al. May 13, 2	2014-05-13
Integrated circuit packaging system with array contacts and method of manufacture thereof Grant 8,723,338 - Bathan , et al. May 13, 2	2014-05-13
Integrated circuit packaging system with pad connection and method of manufacture thereof Grant 8,723,324 - Camacho , et al. May 13, 2	2014-05-13
Integrated circuit packaging system with plated leads and method of manufacture thereof Grant 8,692,377 - Camacho , et al. April 8, 2	2014-04-08
Integrated circuit packaging system with interlock and method of manufacture thereof Grant 8,669,649 - Camacho , et al. March 11, 2	2014-03-11
Integrated Circuit Packaging System With Array Contacts And Method Of Manufacture Thereof App 20140048919 - Bathan; Henry Descalzo ; et al.	2014-02-20
Integrated circuit package system with anti-peel contact pads Grant 8,652,881 - Camacho , et al. February 18, 2	2014-02-18
Integrated circuit packaging system with leads and method of manufacturing thereof Grant 8,643,166 - Camacho , et al. February 4, 2	2014-02-04
Integrated circuit package system with flex bump Grant 8,637,394 - Pisigan , et al. January 28, 2	2014-01-28
Integrated circuit packaging system with interlock and method of manufacture thereof Grant 8,617,933 - Camacho , et al. December 31, 2	2013-12-31
Integrated circuit packaging system with locking interconnects and method of manufacture thereof Grant 8,604,596 - Camacho , et al. December 10, 2	2013-12-10
Semiconductor device and method of forming through hole vias in die extension region around periphery of die Grant 8,592,252 - Bathan , et al. November 26, 2	2013-11-26
Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation Grant 8,569,872 - Bathan , et al. October 29, 2	2013-10-29
Integrated circuit packaging system with interconnects and method of manufacture thereof Grant 8,558,369 - Camacho , et al. October 15, 2	2013-10-15
Integrated circuit packaging system with cap layer and method of manufacture thereof Grant 8,536,690 - Camacho , et al. September 17, 2	2013-09-17
Integrated circuit packaging system with connection supports and method of manufacture thereof Grant 8,508,026 - Camacho , et al. August 13, 2	2013-08-13
Integrated circuit package system with extended corner leads Grant 8,502,371 - Camacho , et al. August 6, 2	2013-08-06
Integrated circuit packaging system with multi-row leads and method of manufacture thereof Grant 8,502,358 - Camacho , et al. August 6, 2	2013-08-06
Integrated circuit packaging system with shaped lead and method of manufacture thereof Grant 8,502,357 - Camacho , et al. August 6, 2	2013-08-06
Packaging system with hollow package and method for the same Grant 8,493,748 - Camacho , et al. July 23, 2	2013-07-23
Integrated circuit packaging system with dual connection and method of manufacture thereof Grant 8,482,109 - Camacho , et al. July 9, 2	2013-07-09
Integrated Circuit Packaging System With Leads And Method Of Manufacture Thereof App 20130154115 - Camacho; Zigmund Ramirez ; et al.	2013-06-20
Integrated circuit packaging system with multiple row leads and method of manufacture thereof Grant 8,455,993 - Camacho , et al. June 4, 2	2013-06-04
Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof Grant 8,420,447 - Tay , et al. April 16, 2	2013-04-16
Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof Grant 8,420,508 - Camacho , et al. April 16, 2	2013-04-16
Integrated circuit packaging system with lead interlocking mechanisms and method of manufacture thereof Grant 8,415,205 - Camacho , et al. April 9, 2	2013-04-09
Integrated Circuit Packaging System With Dual Connection And Method Of Manufacture Thereof App 20130075883 - Camacho; Zigmund Ramirez ; et al.	2013-03-28
Integrated circuit packaging system with paddle molding and method of manufacture thereof Grant 8,404,524 - Camacho , et al. March 26, 2	2013-03-26
Semiconductor device and method of forming through hole vias in die extension region around periphery of die Grant 8,399,991 - Bathan , et al. March 19, 2	2013-03-19
Integrated circuit packaging system with isolated pads and method of manufacture thereof Grant 8,389,332 - Camacho , et al. March 5, 2	2013-03-05
Integrated circuit packaging system with multiple row leads and method of manufacture thereof Grant 8,377,750 - Camacho , et al. February 19, 2	2013-02-19
Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof Grant 8,362,601 - Camacho , et al. January 29, 2	2013-01-29
Integrated Circuit Packaging System With A Lead And Method Of Manufacture Thereof App 20120326285 - Espiritu; Emmanuel ; et al.	2012-12-27
Method of manufacture of integrated circuit packaging system with stacked integrated circuit Grant 8,338,233 - Camacho , et al. December 25, 2	2012-12-25
Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof Grant 8,334,584 - Camacho , et al. December 18, 2	2012-12-18
Package system with a shielded inverted internal stacking module and method of manufacture thereof Grant 8,334,171 - Pagaila , et al. December 18, 2	2012-12-18
Integrated Circuit Packaging System With Interlock And Method Of Manufacture Thereof App 20120299196 - Camacho; Zigmund Ramirez ; et al.	2012-11-29
Integrated circuit packaging system with bond wire pads and method of manufacture thereof Grant 8,304,337 - Bathan , et al. November 6, 2	2012-11-06
Integrated circuit packaging system with interconnect and method of manufacture thereof Grant 8,304,921 - Camacho , et al. November 6, 2	2012-11-06
Fan-in interposer on lead frame for an integrated circuit package on package system Grant 8,304,869 - Camacho , et al. November 6, 2	2012-11-06
Integrated Circuit Package System With Removable Backing Element Having Plated Terminal Leads And Method Of Manufacture Thereof App 20120261808 - Camacho; Zigmund Ramirez ; et al.	2012-10-18
Integrated Circuit Packaging System With Locking Interconnects And Method Of Manufacture Thereof App 20120241947 - Camacho; Zigmund Ramirez ; et al.	2012-09-27
Integrated Circuit Packaging System With A Flip Chip And Method Of Manufacture Thereof App 20120241983 - Bathan; Henry Descalzo ; et al.	2012-09-27
Integrated Circuit Packaging System With Leveling Standoff And Method Of Manufacture Thereof App 20120241926 - Camacho; Zigmund Ramirez ; et al.	2012-09-27
Integrated Circuit Packaging System With Interconnects And Method Of Manufacture Thereof App 20120241931 - Bathan; Henry Descalzo ; et al.	2012-09-27
Integrated Circuit Packaging System With Flipchip Leadframe And Method Of Manufacture Thereof App 20120241928 - Tay; Lionel Chien Hui ; et al.	2012-09-27
Integrated Circuit Packaging System With Plated Leads And Method Of Manufacture Thereof App 20120241966 - Camacho; Zigmund Ramirez ; et al.	2012-09-27
Integrated Circuit Packaging System With Interconnects And Method Of Manufacture Thereof App 20120241968 - Camacho; Zigmund Ramirez ; et al.	2012-09-27
Integrated circuit package system with integration port Grant 8,273,602 - Bathan , et al. September 25, 2	2012-09-25
Integrated circuit package system with lead support Grant 8,258,609 - Camacho , et al. September 4, 2	2012-09-04
Semiconductor device and method of forming through hole vias in die extension region around periphery of die Grant 8,252,666 - Bathan , et al. August 28, 2	2012-08-28
Integrated circuit packaging system with pad connection and method of manufacture thereof Grant 8,241,965 - Bathan , et al. August 14, 2	2012-08-14
Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof Grant 8,236,607 - Bathan , et al. August 7, 2	2012-08-07
Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof Grant 8,212,342 - Camacho , et al. July 3, 2	2012-07-03
Integrated circuit package system with encapsulating features Grant 8,207,600 - Bathan , et al. June 26, 2	2012-06-26
Integrated circuit package in package system with adhesiveless package attach Grant 8,203,214 - Bathan , et al. June 19, 2	2012-06-19
Integrated circuit packaging system with leads and method of manufacture thereof Grant 8,203,201 - Camacho , et al. June 19, 2	2012-06-19
Integrated Circuit Packaging System With Multiple Row Leads And Method Of Manufacture Thereof App 20120146203 - Camacho; Zigmund Ramirez ; et al.	2012-06-14
Integrated Circuit Mounting System With Paddle Interlock And Method Of Manufacture Thereof App 20120146192 - Han; Byung Joon ; et al.	2012-06-14
Integrated Circuit Packaging System With Pad Connection And Method Of Manufacture Thereof App 20120139104 - Camacho; Zigmund Ramirez ; et al.	2012-06-07
Integrated Circuit Packaging System With Pad Connection And Method Of Manufacture Thereof App 20120139121 - Bathan; Henry Descalzo ; et al.	2012-06-07
Integrated circuit packaging system with pad connection and method of manufacture thereof Grant 8,193,037 - Bathan , et al. June 5, 2	2012-06-05
Integrated Circuit Packaging System With Multi-row Leads And Method Of Manufacture Thereof App 20120133033 - Camacho; Zigmund Ramirez ; et al.	2012-05-31
Integrated Circuit Packaging System With Connection Supports And Method Of Manufacture Thereof App 20120133036 - Camacho; Zigmund Ramirez ; et al.	2012-05-31
Integrated Circuit Packaging System With Lead Frame And Method Of Manufacture Thereof App 20120104585 - Espiritu; Emmanuel ; et al.	2012-05-03
Integrated circuit package system with leaded package and method for manufacturing thereof Grant 8,148,208 - Camacho , et al. April 3, 2	2012-04-03
Integrated Circuit Packaging System With Interlock And Method Of Manufacture Thereof App 20120074548 - Camacho; Zigmund Ramirez ; et al.	2012-03-29
Integrated Circuit Packaging System With Paddle Molding And Method Of Manufacture Thereof App 20120068318 - Camacho; Zigmund Ramirez ; et al.	2012-03-22
Integrated Circuit Packaging System With Die Paddles And Method Of Manufacture Thereof App 20120068363 - Camacho; Zigmund Ramirez ; et al.	2012-03-22
Integrated circuit packaging system with an intermediate pad and method of manufacture thereof Grant 8,138,595 - Camacho , et al. March 20, 2	2012-03-20
Method Of Manufacture Of Integrated Circuit Packaging System With Stacked Integrated Circuit App 20120064668 - Camacho; Zigmund Ramirez ; et al.	2012-03-15
Integrated circuit package system with dual connectivity Grant 8,120,150 - Badakere Govindaiah , et al. February 21, 2	2012-02-21
Integrated circuit package system with thin profile Grant 8,115,305 - Camacho , et al. February 14, 2	2012-02-14
Integrated circuit packaging system with plated pad and method of manufacture thereof Grant 8,106,502 - Bathan , et al. January 31, 2	2012-01-31
Integrated circuit packaging system with a dual substrate package and method of manufacture thereof Grant 8,106,499 - Camacho , et al. January 31, 2	2012-01-31
Integrated Circuit Packaging System With Island Terminals And Method Of Manufacture Thereof App 20120018866 - Camacho; Zigmund Ramirez ; et al.	2012-01-26
Integrated Circuit Packaging System With Island Terminals And Embedded Paddle And Method Of Manufacture Thereof App 20120018865 - Camacho; Zigmund Ramirez ; et al.	2012-01-26
Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof Grant 8,080,867 - Camacho , et al. December 20, 2	2011-12-20
Integrated Circuit Packaging System With Increased Connectivity And Method Of Manufacture Thereof App 20110298113 - Dahilig; Frederick Rodriguez ; et al.	2011-12-08
Integrated circuit package system with shield and tie bar Grant 8,072,047 - Camacho , et al. December 6, 2	2011-12-06
Integrated Circuit Packaging System With Multiple Row Leads And Method Of Manufacture Thereof App 20110291251 - Camacho; Zigmund Ramirez ; et al.	2011-12-01
Integrated circuit package system with multiple die Grant 8,067,825 - Advincula , et al. November 29, 2	2011-11-29
Integrated Circuit Packaging System With Isolated Pads And Method Of Manufacture Thereof App 20110284999 - Camacho; Zigmund Ramirez ; et al.	2011-11-24
Integrated circuit package system with ground bonds Grant 8,062,934 - Punzalan , et al. November 22, 2	2011-11-22
Integrated circuit package system with redistribution layer Grant 8,043,894 - Tay , et al. October 25, 2	2011-10-25
Integrated circuit package system with different mold locking features Grant 8,039,947 - Punzalan , et al. October 18, 2	2011-10-18
Integrated Circuit Packaging System With Leads And Method Of Manufacture Thereof App 20110233753 - Camacho; Zigmund Ramirez ; et al.	2011-09-29
Integrated Circuit Packaging System With An Intermediate Pad And Method Of Manufacture Thereof App 20110233752 - Camacho; Zigmund Ramirez ; et al.	2011-09-29
Integrated Circuit Packaging System With Package Leads And Method Of Manufacture Thereof App 20110227211 - Camacho; Zigmund Ramirez ; et al.	2011-09-22
Integrated circuit package system with leadfinger support Grant 8,022,514 - Bathan , et al. September 20, 2	2011-09-20
Integrated circuit packaging system with increased connectivity and method of manufacture thereof Grant 8,022,539 - Dahilig , et al. September 20, 2	2011-09-20
Integrated circuit packaging system with isolated pads and method of manufacture thereof Grant 7,998,790 - Camacho , et al. August 16, 2	2011-08-16
Etched Recess Package On Package System App 20110180928 - Camacho; Zigmund Ramirez ; et al.	2011-07-28
Integrated Circuit Packaging System With Lead Interlocking Mechanisms And Method Of Manufacture Thereof App 20110169151 - Camacho; Zigmund Ramirez ; et al.	2011-07-14
Mountable integrated circuit package-in-package system Grant 7,977,779 - Camacho , et al. July 12, 2	2011-07-12
Integrated circuit package system with interference-fit feature Grant 7,977,778 - Bathan , et al. July 12, 2	2011-07-12
Integrated Circuit Package System With Removable Backing Element Having Plated Terminal Leads And Method Of Manufacture Thereof App 20110140251 - Camacho; Zigmund Ramirez ; et al.	2011-06-16
Integrated Circuit Packaging System With Bond Wire Pads And Method Of Manufacture Thereof App 20110140287 - Bathan; Henry Descalzo ; et al.	2011-06-16
Integrated Circuit Packaging System With Flip Chip And Method Of Manufacture Thereof App 20110127661 - Camacho; Zigmund Ramirez ; et al.	2011-06-02
Package System With A Shielded Inverted Internal Stacking Module And Method Of Manufacture Thereof App 20110127653 - Pagaila; Reza Argenty ; et al.	2011-06-02
Integrated Circuit Packaging System With Interconnect And Method Of Manufacture Thereof App 20110115065 - Camacho; Zigmund Ramirez ; et al.	2011-05-19
Integrated Circuit Packaging System With Concave Trenches And Method Of Manufacture Thereof App 20110108966 - Bathan; Henry Descalzo ; et al.	2011-05-12
Integrated Circuit Packaging System With Stacked Integrated Circuit And Method Of Manufacture Thereof App 20110101542 - Camacho; Zigmund Ramirez ; et al.	2011-05-05
Method for forming an etched recess package on package system Grant 7,932,130 - Camacho , et al. April 26, 2	2011-04-26
Integrated Circuit Packaging System With Pad Connection And Method Of Manufacture Thereof App 20110079886 - Bathan; Henry Descalzo ; et al.	2011-04-07
Integrated Circuit Packaging System With Shaped Lead And Method Of Manufacture Thereof App 20110079885 - Camacho; Zigmund Ramirez ; et al.	2011-04-07
Integrated Circuit Packaging System With Protective Coating And Method Of Manufacture Thereof App 20110079888 - Bathan; Henry Descalzo ; et al.	2011-04-07
Integrated circuit package system with multiple devices Grant 7,919,848 - Camacho , et al. April 5, 2	2011-04-05
Integrated Circuit Packaging System With Quad Flat No-lead Package And Method Of Manufacture Thereof App 20110068463 - Camacho; Zigmund Ramirez ; et al.	2011-03-24
Integrated Circuit Packaging System With A Leaded Package And Method Of Manufacture Thereof App 20110068458 - Camacho; Zigmund Ramirez ; et al.	2011-03-24
Integrated Circuit Packaging System With Cap Layer And Method Of Manufacture Thereof App 20110068448 - Camacho; Zigmund Ramirez ; et al.	2011-03-24
Integrated circuit package with improved connections Grant 7,911,040 - Tay , et al. March 22, 2	2011-03-22
Integrated circuit package system with interconnection support and method of manufacture thereof Grant 7,901,996 - Bathan , et al. March 8, 2	2011-03-08
Integrated Circuit Packaging System With Stacked Integrated Circuit And Method Of Manufacture Thereof App 20100320586 - Bathan; Henry Descalzo ; et al.	2010-12-23
Integrated Circuit Packaging System With A Dual Substrate Package And Method Of Manufacture Thereof App 20100320583 - Camacho; Zigmund Ramirez ; et al.	2010-12-23
Integrated Circuit Packaging System With Contact Pads And Method Of Manufacture Thereof App 20100320591 - Camacho; Zigmund Ramirez ; et al.	2010-12-23
Mountable integrated circuit package system with substrate Grant 7,855,444 - Camacho , et al. December 21, 2	2010-12-21
Integrated Circuit Packaging System With High Lead Count And Method Of Manufacture Thereof App 20100314731 - Camacho; Zigmund Ramirez ; et al.	2010-12-16
Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die App 20100311206 - Bathan; Henry Descalzo ; et al.	2010-12-09
Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die App 20100308459 - Bathan; Henry Descalzo ; et al.	2010-12-09
Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die App 20100308467 - Bathan; Henry Descalzo ; et al.	2010-12-09
Integrated Circuit Packaging System With Leads And Transposer And Method Of Manufacture Thereof App 20100289128 - Camacho; Zigmund Ramirez ; et al.	2010-11-18
Integrated Circuit Package System With Integral Inner Lead And Paddle And Method Of Manufacture Thereof App 20100264529 - Punzalan; Jeffrey D. ; et al.	2010-10-21
Integrated Circuit Package System With Leaded Package And Method For Manufacturing Thereof App 20100264525 - Camacho; Zigmund Ramirez ; et al.	2010-10-21
Semiconductor device and method of forming through hole vias in die extension region around periphery of die Grant 7,790,576 - Bathan , et al. September 7, 2	2010-09-07
Mountable integrated circuit package system with exposed external interconnects Grant 7,785,929 - Camacho , et al. August 31, 2	2010-08-31
Integrated circuit package system with integral inner lead and paddle Grant 7,777,310 - Punzalan , et al. August 17, 2	2010-08-17
Integrated circuit package system with leaded package Grant 7,777,354 - Camacho , et al. August 17, 2	2010-08-17
Integrated circuit package system with top and bottom terminals Grant 7,763,493 - Tay , et al. July 27, 2	2010-07-27
Multi-chip package system with multiple substrates Grant 7,750,451 - Camacho , et al. July 6, 2	2010-07-06
Wire-on-lead Package System And Method Of Manufacture Thereof App 20100140764 - Camacho; Zigmund Ramirez ; et al.	2010-06-10
Integrated circuit package system with isloated leads Grant 7,732,901 - Camacho , et al. June 8, 2	2010-06-08
Integrated circuit package system with contoured die Grant 7,723,840 - Bathan , et al. May 25, 2	2010-05-25
Integrated Circuit Packaging System Having Bumped Lead And Method Of Manufacture Thereof App 20100123230 - Dahilig; Frederick Rodriguez ; et al.	2010-05-20
Integrated Circuit Packaging System With Increased Connectivity And Method Of Manufacture Thereof App 20100123227 - Dahilig; Frederick Rodriguez ; et al.	2010-05-20
Integrated Circuit Packaging System With Plated Pad And Method Of Manufacture Thereof App 20100123229 - Bathan; Henry Descalzo ; et al.	2010-05-20
Integrated circuit package system with shielding Grant 7,714,419 - Camacho , et al. May 11, 2	2010-05-11
Integrated circuit packaging system with stacked device and method of manufacturing thereof Grant 7,691,674 - Bathan , et al. April 6, 2	2010-04-06
Integrated Circuit Package System With Singulation Process App 20100078831 - Pisigan; Jairus Legaspi ; et al.	2010-04-01
Integrated Circuit Package System With Anti-peel Pad App 20100072591 - Camacho; Zigmund Ramirez ; et al.	2010-03-25
Integrated Circuit Package System With Redistribution Layer App 20100052131 - Tay; Lionel Chien Hui ; et al.	2010-03-04
A Method For Forming An Etched Recess Package On Package System App 20100025830 - Camacho; Zigmund Ramirez ; et al.	2010-02-04
Fan-in Interposer On Lead Frame For An Integrated Circuit Package On Package System App 20100025834 - Camacho; Zigmund Ramirez ; et al.	2010-02-04
Integrated Circuit Package System With Lead-frame Paddle Scheme For Single Axis Partial Saw Isolation App 20100001384 - Bathan; Henry Descalzo ; et al.	2010-01-07
Mountable Integrated Circuit Package-in-package System App 20090302452 - Camacho; Zigmund Ramirez ; et al.	2009-12-10
Integrated Circuit Packaging System With Isolated Pads And Method Of Manufacture Thereof App 20090302442 - Camacho; Zigmund Ramirez ; et al.	2009-12-10
Integrated Circuit Package System With Shield And Tie Bar App 20090289335 - Camacho; Zigmund Ramirez ; et al.	2009-11-26
Integrated Circuit Package System With Planar Interconnect App 20090243082 - Camacho; Zigmund Ramirez ; et al.	2009-10-01
Mountable Integrated Circuit Package System With Substrate App 20090243067 - Camacho; Zigmund Ramirez ; et al.	2009-10-01
Mountable Integrated Circuit Package System With Exposed External Interconnects App 20090243066 - Camacho; Zigmund Ramirez ; et al.	2009-10-01
Integrated Circuit Package System With Redistribution App 20090243069 - Camacho; Zigmund Ramirez ; et al.	2009-10-01
Integrated Circuit Package System With Isolated Leads App 20090236704 - Camacho; Zigmund Ramirez ; et al.	2009-09-24
Integrated Circuit Package System With Integration Port App 20090230517 - Bathan; Henry Descalzo ; et al.	2009-09-17
Integrated Circuit Package System With Extended Corner Leads App 20090166845 - Camacho; Zigmund Ramirez ; et al.	2009-07-02
Integrated Circuit Package System With Shielding App 20090166822 - Camacho; Zigmund Ramirez ; et al.	2009-07-02
System and Apparatus for Wafer Level Integration of Components App 20090166825 - Camacho; Zigmund R. ; et al.	2009-07-02
Integrated Circuit Package With Improved Connections App 20090166885 - Tay; Lionel Chien Hui ; et al.	2009-07-02
Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die App 20090140394 - Bathan; Henry Descalzo ; et al.	2009-06-04
Integrated Circuit Package System With Array Of External Interconnects App 20090115040 - Camacho; Zigmund Ramirez ; et al.	2009-05-07
Integrated Circuit Package System With Multiple Die App 20090085181 - Advincula, JR.; Abelardo Hadap ; et al.	2009-04-02
Integrated Circuit Package System With Dual Connectivity App 20090072366 - Badakere Govindaiah; Guruprasad ; et al.	2009-03-19
Integrated Circuit Package System With Multiple Devices App 20090032918 - Camacho; Zigmund Ramirez ; et al.	2009-02-05
Integrated Circuit Package System With Flex Bump App 20090008761 - Pisigan; Jairus Legaspi ; et al.	2009-01-08
Integrated Circuit Package In Package System With Adhesiveless Package Attach App 20090001563 - Bathan; Henry Descalzo ; et al.	2009-01-01
Packaging System With Hollow Package App 20090002961 - Camacho; Zigmund Ramirez ; et al.	2009-01-01
Integrated Circuit Package System With Top And Bottom Terminals App 20090001539 - Tay; Lionel Chien Hui ; et al.	2009-01-01
Integrated Circuit Package System With Contoured Die App 20080303133 - Bathan; Henry Descalzo ; et al.	2008-12-11
Integrated Circuit Package System With Leaded Package App 20080303122 - Camacho; Zigmund Ramirez ; et al.	2008-12-11
Integrated Circuit Package System With Relief App 20080290485 - Shim; Il Kwon ; et al.	2008-11-27
Integrated Circuit Package System With Thin Profile App 20080284002 - Camacho; Zigmund Ramirez ; et al.	2008-11-20
Integrated Circuit Package System With Device Cavity App 20080272479 - Bathan; Henry Descalzo ; et al.	2008-11-06
Integrated Circuit Package System With Interference-fit Feature App 20080273312 - Bathan; Henry Descalzo ; et al.	2008-11-06
Integrated Circuit Package System With Encapsulating Features App 20080237816 - Bathan; Henry Descalzo ; et al.	2008-10-02
Integrated Circuit Package System With Lead Support App 20080230881 - Camacho; Zigmund Ramirez ; et al.	2008-09-25
Multi-chip Package System With Multiple Substrates App 20080185702 - Camacho; Zigmund Ramirez ; et al.	2008-08-07
Integrated Circuit Package System With Integral Inner Lead And Paddle App 20080185693 - Punzalan; Jeffrey D. ; et al.	2008-08-07
Integrated Circuit Package System With Ground Bonds App 20080006929 - Punzalan; Jeffrey D. ; et al.	2008-01-10
Integrated Circuit Package System With Different Mold Locking Features App 20070267731 - Punzalan; Jeffrey D. ; et al.	2007-11-22