| Patent | Date |
|---|
Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the same
Grant 9,691,684 - Park , et al. June 27, 2 | 2017-06-27 |
Semiconductor device and semiconductor package
Grant 9,490,216 - Moon , et al. November 8, 2 | 2016-11-08 |
Integrated circuit devices having through silicon via structures and methods of manufacturing the same
Grant 9,379,042 - Park , et al. June 28, 2 | 2016-06-28 |
Integrated circuit devices including a through-silicon via structure and methods of fabricating the same
Grant 9,214,411 - Park , et al. December 15, 2 | 2015-12-15 |
Semiconductor Device And Semiconductor Package
App 20150287683 - MOON; KWANG-JIN ; et al. | 2015-10-08 |
Integrated circuit device having through-silicon-via structure and method of manufacturing the integrated circuit device
Grant 9,142,490 - Park , et al. September 22, 2 | 2015-09-22 |
Integrated circuit having through silicon via structure with minimized deterioration
Grant 9,018,768 - Park , et al. April 28, 2 | 2015-04-28 |
Integrated Circuit Devices Having Through Silicon Via Structures and Methods of Manufacturing the Same
App 20150108605 - Park; Jae-Hwa ; et al. | 2015-04-23 |
Integrated Circuit Devices Including a Through-Silicon Via Structure and Methods of Fabricating the Same
App 20150102497 - Park; Jae-Hwa ; et al. | 2015-04-16 |
Integrated Circuit Device Including Through-silicon Via Structure And Decoupling Capacitor And Method Of Manufacturing The Same
App 20150028450 - PARK; Jae-hwa ; et al. | 2015-01-29 |
Integrated Circuit Device Having Through-silicon-via Structure And Method Of Manufacturing The Integrated Circuit Device
App 20150028494 - PARK; Jae-hwa ; et al. | 2015-01-29 |
Electrode connecting structures containing copper
Grant 8,860,221 - Park , et al. October 14, 2 | 2014-10-14 |
Semiconductor device and method of fabricating the same
Grant 8,847,399 - Park , et al. September 30, 2 | 2014-09-30 |
Methods Of Forming A Semiconductor Device
App 20130337647 - JUNG; Deok-Young ; et al. | 2013-12-19 |
Methods of manufacturing a semiconductor device
Grant 8,592,310 - Park , et al. November 26, 2 | 2013-11-26 |
Method of forming semiconductor device
Grant 8,546,256 - Jung , et al. October 1, 2 | 2013-10-01 |
Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same
Grant 8,497,157 - Moon , et al. July 30, 2 | 2013-07-30 |
Semiconductor Device and Method of Fabricating the Same
App 20130187287 - Park; Byung-lyul ; et al. | 2013-07-25 |
Electrode Connecting Structures Containing Copper
App 20130140697 - Park; Kun-Sang ; et al. | 2013-06-06 |
Stacked semiconductor device and related method
Grant 8,419,853 - Kang , et al. April 16, 2 | 2013-04-16 |
Method Of Manufacturing A Semiconductor Device And Method Of Manufacturing A Semiconductor Package Including The Same
App 20120282736 - MOON; Kwang-Jin ; et al. | 2012-11-08 |
Methods Of Manufacturing A Semiconductor Device
App 20120142185 - Park; Byung-Lyul ; et al. | 2012-06-07 |
Semiconductor Devices And Methods Of Manufacturing The Same
App 20120132986 - Kang; Pil-Kyu ; et al. | 2012-05-31 |
Semiconductor Device and Method of Fabricating the Same
App 20120043666 - Park; Byung-Lyul ; et al. | 2012-02-23 |
Method Of Forming Semiconductor Device
App 20110318922 - Jung; Deok-young ; et al. | 2011-12-29 |
Semiconductor Device And Method Of Fabricating The Same Including A Conductive Structure Is Formed Through At Least One Dielectric Layer After Forming A Via Structure
App 20110318923 - Park; Byung-Lyul ; et al. | 2011-12-29 |
Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structure
Grant 8,076,234 - Park , et al. December 13, 2 | 2011-12-13 |
Stacked semiconductor device and related method
Grant 7,682,450 - Kang , et al. March 23, 2 | 2010-03-23 |
Stacked Semiconductor Device And Related Method
App 20100065912 - KANG; Yun-Seung ; et al. | 2010-03-18 |
Semiconductor device and method of manufacturing the same
Grant 7,585,757 - Ahn , et al. September 8, 2 | 2009-09-08 |
Semiconductor memory device and method of manufacturing the same
App 20080087933 - Chung; Eun-Kuk ; et al. | 2008-04-17 |
Capacitor Of Semiconductor Device Applying Damascene Process And Method Of Fabricating The Same
App 20070281434 - AHN; Jong-Seon ; et al. | 2007-12-06 |
Method of fabricating CMOS transistor that prevents gate thinning
Grant 7,268,029 - Chung , et al. September 11, 2 | 2007-09-11 |
Stacked semiconductor device and related method
App 20070023794 - Kang; Yun-Seung ; et al. | 2007-02-01 |
Semiconductor device and method of manufacturing the same
App 20060281290 - Ahn; Jong-Seon ; et al. | 2006-12-14 |
Capacitor of semiconductor device applying damascene process and method of fabricating the same
App 20050110143 - Ahn, Jong-Seon ; et al. | 2005-05-26 |
Method of fabricating CMOS transistor that prevents gate thinning
App 20050112814 - Chung, Eun-kuk ; et al. | 2005-05-26 |
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