loadpatents
name:-0.01642107963562
name:-0.01278018951416
name:-0.0010721683502197
Baiocchi; Frank A. Patent Filings

Baiocchi; Frank A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Baiocchi; Frank A..The latest application filed is for "moisture barrier for a wire bond".

Company Profile
0.12.15
  • Baiocchi; Frank A. - Allentown PA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Moisture barrier for a wire bond
Grant 9,136,245 - DeLucca , et al. September 15, 2
2015-09-15
Moisture Barrier For A Wire Bond
App 20140349475 - DeLucca; John M. ;   et al.
2014-11-27
Moisture barrier for a wire bond
Grant 8,766,436 - DeLucca , et al. July 1, 2
2014-07-01
Allotropic or morphologic change in silicon induced by electromagnetic radiation for resistance turning of integrated circuits
Grant 8,610,215 - Baiocchi , et al. December 17, 2
2013-12-17
Moisture Barrier For A Wire Bond
App 20120223432 - DELUCCA; JOHN M. ;   et al.
2012-09-06
Allotropic Changes In Si And Use In Fabricating Materials For Solar Cells
App 20120204941 - Cargo; James T. ;   et al.
2012-08-16
Aluminum Bond Pads With Enhanced Wire Bond Stability
App 20120111927 - Baiocchi; Frank A. ;   et al.
2012-05-10
Modification Of Logic By Morphological Manipulation Of A Semiconductor Resistive Element
App 20120033479 - DeLucca; John M. ;   et al.
2012-02-09
Aluminum bond pads with enhanced wire bond stability
Grant 8,101,871 - Baiocchi , et al. January 24, 2
2012-01-24
Allotropic Or Morphologic Change In Silicon Induced By Electromagnetic Radiation For Resistance Turning Of Integrated Circuits
App 20110163419 - Baiocchi; Frank A. ;   et al.
2011-07-07
Material removing processes in device formation and the devices formed thereby
Grant 7,972,873 - Baiocchi , et al. July 5, 2
2011-07-05
Inhibition Of Copper Dissolution For Lead-free Soldering
App 20100319967 - Amin; Ahmed ;   et al.
2010-12-23
Aluminum Bond Pads With Enhanced Wire Bond Stability
App 20100300741 - Baiocchi; Frank A. ;   et al.
2010-12-02
Method of making electronic entities
Grant 7,724,359 - Amin , et al. May 25, 2
2010-05-25
Material removing processes in device formation and the devices formed thereby
App 20100102398 - Baiocchi; Frank A. ;   et al.
2010-04-29
Method of making electronic entities
App 20090298286 - Amin; Ahmed Nur ;   et al.
2009-12-03
Method of fabricating an electronic device
App 20090029490 - Baiocchi; Frank A. ;   et al.
2009-01-29
Calibration standard for transmission electron microscopy
Grant 7,291,849 - Baiocchi , et al. November 6, 2
2007-11-06
Metal-oxide-semiconductor Device With Enhanced Source Electrode
App 20070007593 - Baiocchi; Frank A. ;   et al.
2007-01-11
Metal-oxide-semiconductor device with enhanced source electrode
Grant 7,126,193 - Baiocchi , et al. October 24, 2
2006-10-24
Enhanced substrate contact for a semiconductor device
Grant 7,041,561 - Baiocchi , et al. May 9, 2
2006-05-09
Method for making enhanced substrate contact for a semiconductor device
Grant 6,987,052 - Baiocchi , et al. January 17, 2
2006-01-17
Enhanced substrate contact for a semiconductor device
App 20050221563 - Baiocchi, Frank A. ;   et al.
2005-10-06
Enhanced substrate contact for a semiconductor device
App 20050093097 - Baiocchi, Frank A. ;   et al.
2005-05-05
Metal-oxide-semiconductor device with enhanced source electrode
App 20050077552 - Baiocchi, Frank A. ;   et al.
2005-04-14

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