| Patent | Date |
|---|
Semiconductor Package
App 20220230933 - Choi; Dong Joo ; et al. | 2022-07-21 |
Semiconductor package
Grant 11,302,598 - Choi , et al. April 12, 2 | 2022-04-12 |
Semiconductor device, method of testing semiconductor device and method of manufacturing semiconductor device
Grant 11,133,232 - Jang , et al. September 28, 2 | 2021-09-28 |
Semiconductor Package
App 20210296200 - JANG; Ae-Nee ; et al. | 2021-09-23 |
Semiconductor Package
App 20210249327 - CHOI; Dong Joo ; et al. | 2021-08-12 |
Semiconductor packages
Grant 11,081,425 - Chang , et al. August 3, 2 | 2021-08-03 |
Semiconductor package
Grant 11,056,414 - Jang , et al. July 6, 2 | 2021-07-06 |
Semiconductor package
Grant 10,804,218 - Kim , et al. October 13, 2 | 2020-10-13 |
Semiconductor chip and semiconductor package including the same
Grant 10,756,062 - Kim , et al. A | 2020-08-25 |
Semiconductor package and semiconductor device including the same
Grant 10,658,300 - Kim , et al. | 2020-05-19 |
Semiconductor Packages
App 20200144159 - CHANG; Gun-Ho ; et al. | 2020-05-07 |
Semiconductor Device, Method Of Testing Semiconductor Device And Method Of Manufacturing Semiconductor Device
App 20200144138 - JANG; Ae-Nee ; et al. | 2020-05-07 |
Semiconductor Package
App 20200126882 - JANG; Ae-Nee ; et al. | 2020-04-23 |
Semiconductor Chip And Semiconductor Package Including The Same
App 20200013753 - Kim; Kyoung-Soo ; et al. | 2020-01-09 |
Semiconductor Package
App 20190229071 - KIM; YOUNG-LYONG ; et al. | 2019-07-25 |
Semiconductor Package And Semiconductor Device Including The Same
App 20190221520 - KIM; YOUNG-LYONG ; et al. | 2019-07-18 |
Semiconductor Package
App 20190206841 - KIM; Young Lyong ; et al. | 2019-07-04 |
Semiconductor Package And Method Of Manufacturing The Same
App 20170047310 - SHIM; Jong-Bo ; et al. | 2017-02-16 |
Fabricating Method Of Semiconductor Device
App 20170047309 - BAEK; Seung-Duk ; et al. | 2017-02-16 |
Semiconductor module
Grant 8,928,154 - Kang , et al. January 6, 2 | 2015-01-06 |
Wafer level package and methods of fabricating the same
Grant 8,779,576 - Park , et al. July 15, 2 | 2014-07-15 |
Semiconductor packages and methods of manufacturing the same
Grant 8,735,276 - Chung , et al. May 27, 2 | 2014-05-27 |
Chip stack package
Grant 8,446,016 - Kang , et al. May 21, 2 | 2013-05-21 |
Chipstack package and manufacturing method thereof
Grant 8,368,231 - Lee , et al. February 5, 2 | 2013-02-05 |
Semiconductor Packages And Methods Of Manufacturing The Same
App 20120129334 - CHUNG; Hyun-Soo ; et al. | 2012-05-24 |
Semiconductor memory device having improved voltage transmission path and driving method thereof
Grant 8,174,860 - Kang , et al. May 8, 2 | 2012-05-08 |
Semiconductor Module
App 20120104631 - Kang; Sun-Won ; et al. | 2012-05-03 |
Wafer-level stack package
Grant 8,153,521 - Kang , et al. April 10, 2 | 2012-04-10 |
Semiconductor device including redistribution line structure and method of fabricating the same
Grant 8,143,693 - Baek , et al. March 27, 2 | 2012-03-27 |
Semiconductor module
Grant 8,115,324 - Kang , et al. February 14, 2 | 2012-02-14 |
Wafer level semiconductor module and method for manufacturing the same
Grant 8,110,922 - Chung , et al. February 7, 2 | 2012-02-07 |
Stack package
Grant 8,097,940 - Baek , et al. January 17, 2 | 2012-01-17 |
Chip Stack Package
App 20110316159 - KANG; Sun-Won ; et al. | 2011-12-29 |
Wafer Level Package And Methods Of Fabricating The Same
App 20110272819 - Park; Sang-wook ; et al. | 2011-11-10 |
Chip stack package
Grant 8,039,928 - Kang , et al. October 18, 2 | 2011-10-18 |
Chipstack Package And Manufacturing Method Thereof
App 20110237004 - Lee; Kang-Wook ; et al. | 2011-09-29 |
Stack module, card including the stack module, and system including the stack module
Grant 8,004,848 - Baek , et al. August 23, 2 | 2011-08-23 |
Semiconductor chip package and printed circuit board having through interconnections
Grant 8,004,081 - Lee , et al. August 23, 2 | 2011-08-23 |
Chipstack package and manufacturing method thereof
Grant 7,977,156 - Lee , et al. July 12, 2 | 2011-07-12 |
Semiconductor Memory Device Having Improved Voltage Transmission Path And Driving Method Thereof
App 20110157952 - Kang; Sun-Won ; et al. | 2011-06-30 |
Semiconductor memory device having improved voltage transmission path and driving method thereof
Grant 7,924,592 - Kang , et al. April 12, 2 | 2011-04-12 |
Wafer-level Stack Package
App 20110076803 - KANG; SUN-WON ; et al. | 2011-03-31 |
Semiconductor package apparatus
Grant 7,893,526 - Mun , et al. February 22, 2 | 2011-02-22 |
Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package
Grant 7,884,458 - Kang , et al. February 8, 2 | 2011-02-08 |
Method of manufacturing chip-on-chip semiconductor device
Grant 7,851,256 - Chung , et al. December 14, 2 | 2010-12-14 |
Wafer level package having floated metal line and method thereof
Grant 7,767,576 - Chung , et al. August 3, 2 | 2010-08-03 |
Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module
Grant 7,759,716 - Baek , et al. July 20, 2 | 2010-07-20 |
Semiconductor Memory Device Having Improved Voltage Transmission Path And Driving Method Thereof
App 20100102434 - Kang; Sun-Won ; et al. | 2010-04-29 |
Stack package
App 20100090326 - Baek; Seung-Duk ; et al. | 2010-04-15 |
Semiconductor memory device having improved voltage transmission path and driving method thereof
Grant 7,663,903 - Kang , et al. February 16, 2 | 2010-02-16 |
Wafer level semiconductor module and method for manufacturing the same
App 20100032807 - Chung; Hyun-Soo ; et al. | 2010-02-11 |
Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module
Grant 7,652,383 - Baek , et al. January 26, 2 | 2010-01-26 |
Semiconductor Chip Package And Printed Circuit Board Having Through Interconnections
App 20090283894 - LEE; Jong-joo ; et al. | 2009-11-19 |
Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip
Grant 7,595,559 - Baek September 29, 2 | 2009-09-29 |
Packaged semiconductor die and manufacturing method thereof
Grant 7,586,182 - Baek , et al. September 8, 2 | 2009-09-08 |
Chipstack package and manufacturing method thereof
App 20090209063 - Lee; Kang-Wook ; et al. | 2009-08-20 |
Semiconductor Packages And Methods Of Manufacturing The Same
App 20090184411 - CHUNG; Hyun-Soo ; et al. | 2009-07-23 |
Wafer-level Stack Package
App 20090166840 - KANG; Sun-Won ; et al. | 2009-07-02 |
Chip stack package and manufacturing method thereof
Grant 7,537,959 - Lee , et al. May 26, 2 | 2009-05-26 |
Semiconductor module
App 20090127717 - Kang; Sun-Won ; et al. | 2009-05-21 |
Chip Stack Package
App 20090108469 - KANG; Sun-Won ; et al. | 2009-04-30 |
Method of manufacturing chip-on-chip semiconductor device
App 20090111217 - Chung; Hyun-soo ; et al. | 2009-04-30 |
Three-dimensional semiconductor module having multi-sided ground block
Grant 7,508,061 - Kang , et al. March 24, 2 | 2009-03-24 |
Semiconductor package apparatus
App 20090051045 - Mun; Sung-ho ; et al. | 2009-02-26 |
Semiconductor Device, Method Of Fabricating The Same, Stacked Module Including The Same, Card Including The Same, And System Including The Stacked Module
App 20090001367 - BAEK; Seung-Duk ; et al. | 2009-01-01 |
Stack Module, Card Including The Stack Module, And System Including The Stack Module
App 20080304242 - BAEK; Seung-Duk ; et al. | 2008-12-11 |
Semiconductor Device Including Redistribution Line Structure And Method Of Fabricating The Same
App 20080246113 - BAEK; Seung-Duk ; et al. | 2008-10-09 |
Chip Stack Package And Method Of Manufacturing The Same
App 20080128882 - BAEK; Seung-Duk ; et al. | 2008-06-05 |
Semiconductor Memory Device Having Improved Voltage Transmission Path And Driving Method Thereof
App 20080123386 - KANG; Sun-Won ; et al. | 2008-05-29 |
Semiconductor memory modules, methods of arranging terminals therein, and methods of using thereof
App 20080116572 - Baek; Seung-duk ; et al. | 2008-05-22 |
Decoupling Capacitor, Wafer Stack Package Including The Decoupling Capacitor, And Method Of Fabricating The Wafer Stack Package
App 20080116558 - KANG; Sun-Won ; et al. | 2008-05-22 |
Semiconductor Package Including Redistribution Pattern And Method Of Manufacturing The Same
App 20080048322 - BAEK; Seung-Duk ; et al. | 2008-02-28 |
Wafer-level electronic modules with integral connector contacts
Grant 7,307,340 - Baek , et al. December 11, 2 | 2007-12-11 |
Chip stack package and manufacturing method thereof
App 20070281374 - Lee; Kang-Wook ; et al. | 2007-12-06 |
Wafer level semiconductor module and method for manufacturing the same
App 20070246826 - Chung; Hyun-Soo ; et al. | 2007-10-25 |
Chip stack package and manufacturing method thereof
Grant 7,276,799 - Lee , et al. October 2, 2 | 2007-10-02 |
Semiconductor package including redistribution pattern and method of manufacturing the same
Grant 7,274,097 - Baek , et al. September 25, 2 | 2007-09-25 |
Wafer Level Package Having Floated Metal Line And Method Thereof
App 20070176240 - Chung; Hyun-soo ; et al. | 2007-08-02 |
Semiconductor device and method of manufacturing the same
App 20070102814 - Baek; Seung-Duk | 2007-05-10 |
Semiconductor package having dual interconnection form and manufacturing method thereof
App 20070007663 - Baek; Seung-Duk ; et al. | 2007-01-11 |
Three-dimensional semiconductor module having multi-sided ground block
App 20070001282 - Kang; Sun-Won ; et al. | 2007-01-04 |
Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module
App 20060138648 - Baek; Seung-Duk ; et al. | 2006-06-29 |
Packaged semiconductor die and manufacturing method thereof
App 20060134833 - Baek; Seung-Duk ; et al. | 2006-06-22 |
Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip
App 20060118972 - Baek; Seung-Duk ; et al. | 2006-06-08 |
Semiconductor package including redistribution pattern and method of manufacturing the same
App 20050269684 - Baek, Seung-Duk ; et al. | 2005-12-08 |
Wafer-level electronic modules with integral connector contacts and methods of fabricating the same
App 20050121770 - Baek, Seung Duk ; et al. | 2005-06-09 |
Chip stack package and manufacturing method thereof
App 20050046002 - Lee, Kang-Wook ; et al. | 2005-03-03 |
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