loadpatents
name:-0.059309959411621
name:-0.033315896987915
name:-0.0047039985656738
BAE; Hyun-cheol Patent Filings

BAE; Hyun-cheol

Patent Applications and Registrations

Patent applications and USPTO patent grants for BAE; Hyun-cheol.The latest application filed is for "laser bonding method and a semiconductor package including a bonding part and a bonding target".

Company Profile
3.30.52
  • BAE; Hyun-cheol - Sejong-si KR
  • BAE; Hyun-cheol - Sejong KR
  • Bae; Hyun Cheol - Suwon-si KR
  • Bae; Hyun-cheol - Daejeon KR
  • Bae; Hyun Cheol - Gyeonggi-do KR
  • Bae; Hyun Cheol - Suwon KR
  • Bae; Hyun-Cheol - Yuseong-gu KR
  • Bae; Hyun-Cheol - Kyungki-Do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laser Bonding Method And A Semiconductor Package Including A Bonding Part And A Bonding Target
App 20210358885 - CHOI; Kwang-Seong ;   et al.
2021-11-18
Laser bonding method
Grant 11,107,790 - Choi , et al. August 31, 2
2021-08-31
Apparatus For Supplying Pellet And Method For Supplying Pellet
App 20210162674 - KIM; Kyung Hyun ;   et al.
2021-06-03
Method of fabricating a semiconductor package
Grant 10,636,761 - Choi , et al.
2020-04-28
Laser Bonding Method
App 20200075535 - CHOI; Kwang-Seong ;   et al.
2020-03-05
Filling Composition For Semiconductor Package
App 20190287870 - JANG; KeonSoo ;   et al.
2019-09-19
Adhesive Film For Electric Device And Method Of Fabricating Semiconductor Package Using The Same
App 20190211231 - JANG; KeonSoo ;   et al.
2019-07-11
Method Of Fabricating A Semiconductor Package
App 20190067235 - CHOI; Kwang-Seong ;   et al.
2019-02-28
Method and system for reprogramming
Grant 10,033,546 - Lee , et al. July 24, 2
2018-07-24
Pattern-forming method for forming a conductive circuit pattern
Grant 9,980,393 - Eom , et al. May 22, 2
2018-05-22
Method of fabricating a semiconductor package
Grant 9,853,010 - Choi , et al. December 26, 2
2017-12-26
Method Of Fabricating A Semiconductor Package
App 20170141071 - CHOI; Kwang-Seong ;   et al.
2017-05-18
Bonding structure of electronic equipment
Grant 9,538,666 - Choi , et al. January 3, 2
2017-01-03
Semiconductor Package And Method For Manufacturing The Same
App 20160358892 - LEE; Haksun ;   et al.
2016-12-08
System and method for transferring message in ethernet based vehicle network
Grant 9,432,207 - Seo , et al. August 30, 2
2016-08-30
Transceiver Module And Communication Apparatus Including The Same
App 20160094258 - BAE; Hyun-cheol ;   et al.
2016-03-31
Apparatus and method for controlling cooling of battery of environment-friendly vehicle
Grant 9,293,795 - Kwon , et al. March 22, 2
2016-03-22
Apparatus and method for detecting in-vehicle network attack
Grant 9,231,967 - Ahn , et al. January 5, 2
2016-01-05
Stack Module Package And Method For Manufacturing The Same
App 20150364445 - CHOI; Kwang Seong ;   et al.
2015-12-17
Ethernet backbone network system for vehicle and method for controlling fail safe of the ethernet backbone network system
Grant 9,172,635 - Kim , et al. October 27, 2
2015-10-27
Semiconductor device and method of fabricating the same
Grant 9,123,548 - Koo , et al. September 1, 2
2015-09-01
Pattern-forming Composition And Pattern-forming Method Using The Same
App 20150237739 - EOM; Yong Sung ;   et al.
2015-08-20
Semiconductor Device And Method Of Manufacturing The Same
App 20150228617 - LEE; Haksun ;   et al.
2015-08-13
Semiconductor Device And Method Of Fabricating The Same
App 20150228640 - KOO; JIN-GUN ;   et al.
2015-08-13
Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same
Grant 9,034,750 - Choi , et al. May 19, 2
2015-05-19
Methods of forming bump and semiconductor device with the same
Grant 9,006,037 - Choi , et al. April 14, 2
2015-04-14
Ethernet Backbone Network System For Vehicle And Method For Controlling Fail Safe Of The Ethernet Backbone Network System
App 20150085645 - Kim; Seung Su ;   et al.
2015-03-26
Bonding Structure Of Electronic Equipment
App 20150043175 - CHOI; KWANG-SEONG ;   et al.
2015-02-12
System And Method For Transferring Message In Ethernet Based Vehicle Network
App 20150003456 - Seo; Suk Hyun ;   et al.
2015-01-01
Apparatus And Method For Controlling Cooling Of Battery Of Environment-friendly Vehicle
App 20140370333 - Kwon; Mun Soon ;   et al.
2014-12-18
Method Of Fabricating A Solder Particle
App 20140367375 - BAE; Hyun-cheol ;   et al.
2014-12-18
Methods Of Forming Bump And Semiconductor Device With The Same
App 20140287556 - CHOI; Kwang-Seong ;   et al.
2014-09-25
Method And System For Reprogramming
App 20140188253 - LEE; So Jin ;   et al.
2014-07-03
Apparatus And Method For Modeling Controller Of Can Bus Simulator
App 20140189621 - KIM; Jeong Hwan ;   et al.
2014-07-03
Steering Device Having Tilting And Telescopic Function
App 20140180541 - Yu; Tae Young ;   et al.
2014-06-26
System for providing parking information based on dual wireless communication and method thereof
Grant 8,754,784 - Ji , et al. June 17, 2
2014-06-17
Apparatus And Method For Detecting In-vehicle Network Attack
App 20140165191 - AHN; Hyun Soo ;   et al.
2014-06-12
Silicon interposer including backside inductor
Grant 8,723,292 - Bae , et al. May 13, 2
2014-05-13
Method Of Fabricating A Solder-on-pad Structure And Flip-chip Bonding Method Using The Same
App 20140117070 - Choi; Kwang-Seong ;   et al.
2014-05-01
Vehicle location information-based abnormal driving determination and warning system
Grant 8,711,003 - Yu , et al. April 29, 2
2014-04-29
Telematics device for remote charging control and method of providing service thereof
Grant 8,610,401 - Kim , et al. December 17, 2
2013-12-17
Direct Bonded Copper Substrate And Power Semiconductor Module
App 20130328200 - Bae; Hyun Cheol
2013-12-12
Vacuum wafer level packaging method for micro electro mechanical system device
Grant 8,524,571 - Moon , et al. September 3, 2
2013-09-03
Pattern-forming Composition And Pattern-forming Method Using The Same
App 20130146342 - EOM; Yong Sung ;   et al.
2013-06-13
Silicon Interposer Including Backside Inductor
App 20130087884 - BAE; Hyun-Cheol ;   et al.
2013-04-11
Vehicle Location Information-based Abnormal Driving Determination And Warning System
App 20130088369 - Yu; Tae Young ;   et al.
2013-04-11
Composition For Filling Through Silicon Via (tsv), Tsv Filling Method And Substrate Including Tsv Plug Formed Of The Composition
App 20120161326 - Choi; Kwang-Seong ;   et al.
2012-06-28
Vacuum Wafer Level Packaging Method For Micro Electro Mechanical System Device
App 20120164787 - Moon; Jong Tae ;   et al.
2012-06-28
Fbar Duplexer Module And Fabrication Method Thereof
App 20120154072 - Bae; Hyun-Cheol ;   et al.
2012-06-21
System For Providing Parking Information Based On Dual Wireless Communication And Method Thereof
App 20120139757 - Ji; Sang Woo ;   et al.
2012-06-07
Vehicle Network System Interconnecting With A Home Network
App 20120120930 - Ji; Sang Woo ;   et al.
2012-05-17
Telematics Device For Remote Charging Control And Method Of Providing Service Thereof
App 20120086395 - Kim; Sung Yun ;   et al.
2012-04-12
Navigation System For Electric Vehicle And Navigation Service Method Thereof
App 20120089329 - Kim; Sung Yun ;   et al.
2012-04-12
Communication Access Control System Of Vehicle
App 20120005343 - Ji; Sang Woo ;   et al.
2012-01-05
Electronic device including LTCC inductor
Grant 8,044,757 - Bae , et al. October 25, 2
2011-10-25
Method for fabricating a semiconductor package
Grant 8,030,200 - Eom , et al. October 4, 2
2011-10-04
Filling Composition, Semiconductor Device Including The Same, And Method Of Fabricating The Semiconductor Device
App 20110227228 - EOM; Yong Sung ;   et al.
2011-09-22
Device Packages And Methods Of Fabricating The Same
App 20110115036 - MOON; Jong Tae ;   et al.
2011-05-19
Package Structure
App 20110090651 - Jung; Sunghae ;   et al.
2011-04-21
Electronic Device Including Ltcc Inductor
App 20110018670 - BAE; Hyun-Cheol ;   et al.
2011-01-27
Method For Fabricating Semiconductor Package And Semiconductor Package Using The Same
App 20100320596 - Eom; Yong Sung ;   et al.
2010-12-23
Buried Capacitor, Method Of Manufacturing The Same, And Method Of Changing Capacitance Thereof
App 20100142115 - Bae; Hyun-Cheol ;   et al.
2010-06-10
SiGe semiconductor device and method of manufacturing the same
Grant 7,666,749 - Kim , et al. February 23, 2
2010-02-23
Germanium semiconductor device and method of manufacturing the same
Grant 7,550,796 - Kim , et al. June 23, 2
2009-06-23
Germanium Semiconductor Device And Method Of Manufacturing The Same
App 20080135878 - KIM; Sang Hun ;   et al.
2008-06-12
SiGe SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
App 20080128754 - KIM; Sang Hun ;   et al.
2008-06-05
Semiconductor device and method of manufacturing the same
Grant 7,303,966 - Kim , et al. December 4, 2
2007-12-04
Semiconductor device and method of manufacturing the same
App 20070134879 - Kim; Sang Hun ;   et al.
2007-06-14
Method of fabricating SiGe Bi-CMOS device
Grant 7,115,459 - Bae , et al. October 3, 2
2006-10-03
Integrated inductor and method of fabricating the same
App 20060125046 - Bae; Hyun Cheol ;   et al.
2006-06-15
Method of fabricating SiGe Bi-CMOS device
App 20060121667 - Bae; Hyun Cheol ;   et al.
2006-06-08
Vehicle door connector structure
Grant 6,652,289 - Bae November 25, 2
2003-11-25
Vehicle door connector structure
App 20030119339 - Bae, Hyun-Cheol
2003-06-26

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