Bae; Han Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bae; Han Jun.The latest application filed is for "semiconductor package including stacked semiconductor chips".

Company Profile

3.17.19

Bae; Han Jun - Icheon-si KR
BAE; Han Jun - Icheon-si Gyeonggi-do KR
BAE; Han-Jun - Seoul KR
Bae; Han Jun - Seongnam-si KR
BAE; Han Jun - Seongnam-si Gyeonggi-do KR
BAE; Han-Jun - Gyeonggi-do KR
- Gyeonggi-do KR
Bae; Han Jun - Kyoungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package including stacked semiconductor chips Grant 11,309,303 - Eom , et al. April 19, 2	2022-04-19
Semiconductor package including capacitor Grant 11,270,958 - Eom , et al. March 8, 2	2022-03-08
Semiconductor Package Including Stacked Semiconductor Chips App 20220037304 - EOM; Ju Il ; et al.	2022-02-03
Semiconductor Package Including Capacitor App 20210366847 - EOM; Ju Il ; et al.	2021-11-25
Device And Method For Mediating Heavy Equipment And System Using The Same App 20210334869 - BAE; Seok-Ho ; et al.	2021-10-28
Stretchable semiconductor packages and semiconductor devices including the same Grant 9,972,568 - Kim , et al. May 15, 2	2018-05-15
Flexible device including sliding interconnection structure Grant 9,888,567 - Lee , et al. February 6, 2	2018-02-06
Stretchable Semiconductor Packages And Semiconductor Devices Including The Same App 20180019188 - KIM; Jong Hoon ; et al.	2018-01-18
Semiconductor packages including heat spreaders and methods of manufacturing the same Grant 9,847,285 - Sung , et al. December 19, 2	2017-12-19
Semiconductor Packages Including Heat Spreaders And Methods Of Manufacturing The Same App 20170352612 - SUNG; Ki Jun ; et al.	2017-12-07
Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same Grant 9,806,015 - Sung , et al. October 31, 2	2017-10-31
Stretchable semiconductor packages and semiconductor devices including the same Grant 9,806,016 - Kim , et al. October 31, 2	2017-10-31
Stretchable Semiconductor Packages And Semiconductor Devices Including The Same App 20170148708 - KIM; Jong Hoon ; et al.	2017-05-25
Semiconductor packages, methods of manufacturing the same, electronic systems including the same, and memory cards including the same Grant 9,659,833 - Lee , et al. May 23, 2	2017-05-23
Flexible Device Including Sliding Interconnection Structure App 20170064832 - Lee; Seung Yeop ; et al.	2017-03-02
Stack Package And Method For Manufacturing The Stack Package App 20170033081 - YOO; Je Sik ; et al.	2017-02-02
Semiconductor package Grant 9,543,384 - Bae , et al. January 10, 2	2017-01-10
Semiconductor Device App 20160254251 - BAE; Han Jun ; et al.	2016-09-01
Semiconductor Packages, Methods Of Manufacturing The Same, Electronic Systems Including The Same, And Memory Cards Including The Same App 20160211188 - LEE; Dae Woong ; et al.	2016-07-21
Stack packages and methods of fabricating the same Grant 9,368,482 - Kim , et al. June 14, 2	2016-06-14
Stack packages and methods of manufacturing the same Grant 9,343,439 - Bae , et al. May 17, 2	2016-05-17
Stack Packages And Methods Of Fabricating The Same App 20160064359 - KIM; Jong Hoon ; et al.	2016-03-03
Stack Packages And Methods Of Manufacturing The Same App 20160035708 - BAE; Jin Ho ; et al.	2016-02-04
Stack packages and methods of fabricating the same Grant 9,214,410 - Kim , et al. December 15, 2	2015-12-15
Stack packages and methods of manufacturing the same Grant 9,196,607 - Bae , et al. November 24, 2	2015-11-24
Stack Packages And Methods Of Fabricating The Same App 20150028473 - KIM; Jong Hoon ; et al.	2015-01-29
Stack Packages And Methods Of Manufacturing The Same App 20140361441 - BAE; Jin Ho ; et al.	2014-12-11
Semiconductor Package And Method For Fabricating The Same App 20140264848 - SON; Ho-Young ; et al.	2014-09-18
Semiconductor package using through-electrodes having voids Grant 08618637 -	2013-12-31
Semiconductor package using through-electrodes having voids Grant 8,618,637 - Bae , et al. December 31, 2	2013-12-31
Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrode Grant 8,072,046 - Bae , et al. December 6, 2	2011-12-06
Semiconductor package having structure for warpage prevention Grant 7,759,807 - Bae , et al. July 20, 2	2010-07-20
Semiconductor Package Using Through-electrodes Having Voids App 20090321892 - BAE; Han Jun ; et al.	2009-12-31
Through-electrode, Circuit Board Having A Through-electrode, Semiconductor Package Having A Through-electrode, And Stacked Semiconductor Package Having The Semiconductor Chip Or Package Having A Through-electrode App 20090261458 - BAE; Han Jun ; et al.	2009-10-22
Semiconductor Package Having Structure For Warpage Prevention App 20080116563 - Bae; Han Jun ; et al.	2008-05-22

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