loadpatents
Patent applications and USPTO patent grants for Ashizawa; Hiroaki.The latest application filed is for "film forming method, method for manufacturing semiconductor device, film forming device, and system for manufacturing semiconductor device".
Patent | Date |
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Laser machining apparatus and laser machining method Grant 11,389,907 - Funaoka , et al. July 19, 2 | 2022-07-19 |
Semiconductor film forming method using hydrazine-based compound gas Grant 11,348,794 - Nakamura , et al. May 31, 2 | 2022-05-31 |
Film Forming Method, Method For Manufacturing Semiconductor Device, Film Forming Device, And System For Manufacturing Semiconductor Device App 20220157600 - ASHIZAWA; Hiroaki ;   et al. | 2022-05-19 |
Composite Structure And Semiconductor Manufacturing Apparatus Including Composite Structure App 20210343511 - ASHIZAWA; Hiroaki ;   et al. | 2021-11-04 |
Composite Structure And Semiconductor Manufacturing Apparatus Including Composite Structure App 20210340066 - ASHIZAWA; Hiroaki ;   et al. | 2021-11-04 |
Laser Machining Apparatus And Laser Machining Method App 20210308799 - FUNAOKA; Koji ;   et al. | 2021-10-07 |
Film forming method and film forming apparatus Grant 10,864,548 - Ashizawa , et al. December 15, 2 | 2020-12-15 |
Composite structure, semiconductor manufacturing apparatus and display manufacturing apparatus provided with composite structure Grant 10,759,710 - Iwasawa , et al. Sep | 2020-09-01 |
Structure Grant 10,618,847 - Ashizawa , et al. | 2020-04-14 |
Film-forming Method And Film-forming Apparatus App 20200063258 - TAKAHASHI; Tsuyoshi ;   et al. | 2020-02-27 |
Film Forming Method And Film Forming Apparatus App 20190378723 - Nakamura; Hideo ;   et al. | 2019-12-12 |
Composite Structure, Semiconductor Manufacturing Apparatus And Display Manufacturing Apparatus Provided With Composite Structure App 20190276368 - IWASAWA; Junichi ;   et al. | 2019-09-12 |
Substrate mounting method and substrate mounting device Grant 10,340,176 - Fujisato , et al. | 2019-07-02 |
Structure App 20180362411 - ASHIZAWA; Hiroaki ;   et al. | 2018-12-20 |
Structure App 20180354859 - ASHIZAWA; Hiroaki ;   et al. | 2018-12-13 |
Film Forming Method And Film Forming Apparatus App 20180311700 - Ashizawa; Hiroaki ;   et al. | 2018-11-01 |
Structure Grant 10,087,109 - Ashizawa , et al. October 2, 2 | 2018-10-02 |
Structure Grant 10,081,576 - Ashizawa , et al. September 25, 2 | 2018-09-25 |
Structure App 20180127319 - ASHIZAWA; Hiroaki ;   et al. | 2018-05-10 |
Structure App 20180127320 - ASHIZAWA; Hiroaki ;   et al. | 2018-05-10 |
Film forming method and film forming apparatus Grant 9,963,784 - Ashizawa , et al. May 8, 2 | 2018-05-08 |
Substrate Mounting Method And Substrate Mounting Device App 20180040503 - FUJISATO; Toshiaki ;   et al. | 2018-02-08 |
Ruthenium film formation method and storage medium Grant 9,331,139 - Ashizawa , et al. May 3, 2 | 2016-05-03 |
Film Forming Method And Film Forming Apparatus App 20150110959 - ASHIZAWA; Hiroaki ;   et al. | 2015-04-23 |
Ruthenium Film Formation Method And Storage Medium App 20140287585 - ASHIZAWA; Hiroaki ;   et al. | 2014-09-25 |
Method For Forming Ruthenium Oxide Film App 20130115367 - NORO; Naotaka ;   et al. | 2013-05-09 |
Method and apparatus for perforating printed circuit board Grant 8,278,594 - Arai , et al. October 2, 2 | 2012-10-02 |
Film formation method, cleaning method and film formation apparatus Grant 8,021,717 - Murakami , et al. September 20, 2 | 2011-09-20 |
Composite structure Grant 7,897,268 - Iwasawa , et al. March 1, 2 | 2011-03-01 |
Cmp Conditioner And Process For Producing The Same App 20090239454 - Yamashita; Tetsuji ;   et al. | 2009-09-24 |
Composite Structure App 20090233126 - Iwasawa; Junichi ;   et al. | 2009-09-17 |
Sharp Blade And Its Manufacturing Method App 20090196989 - Katayama; Takeshi ;   et al. | 2009-08-06 |
Method and apparatus for perforating printed circuit board App 20090166340 - Arai; Kunio ;   et al. | 2009-07-02 |
Film Formation Method, Cleaning Method And Film Formation Apparatus App 20090142513 - MURAKAMI; Seishi ;   et al. | 2009-06-04 |
Method and apparatus for laser perforating printed circuit board Grant 7,531,767 - Arai , et al. May 12, 2 | 2009-05-12 |
Method for Producing Film Using Aerosol, Particles Mixture Therefor, and Film and Composite Material App 20080274347 - Iwasawa; Junichi ;   et al. | 2008-11-06 |
Method for Producing Coating Film Using Aerosol, Fine Particles for Use Therein, and Coating Film and Composite Material App 20080274348 - Iwasawa; Junichi ;   et al. | 2008-11-06 |
Laser machining method and laser machining apparatus Grant 7,205,501 - Arai , et al. April 17, 2 | 2007-04-17 |
Method and apparatus for perforating printed circuit board App 20060211158 - Arai; Kunio ;   et al. | 2006-09-21 |
Laser machining method and laser machining apparatus App 20050155958 - Arai, Kunio ;   et al. | 2005-07-21 |
Film-formation method for semiconductor process App 20050136657 - Yokoi, Hiroaki ;   et al. | 2005-06-23 |
Single-substrate-heat-processing apparatus and method for semiconductor process App 20020022379 - Ashizawa, Hiroaki ;   et al. | 2002-02-21 |
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