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name:-0.029407978057861
name:-0.019017934799194
name:-0.0069458484649658
Ashizawa; Hiroaki Patent Filings

Ashizawa; Hiroaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ashizawa; Hiroaki.The latest application filed is for "film forming method, method for manufacturing semiconductor device, film forming device, and system for manufacturing semiconductor device".

Company Profile
7.15.27
  • Ashizawa; Hiroaki - Tokyo JP
  • Ashizawa; Hiroaki - Yamanashi JP
  • ASHIZAWA; Hiroaki - Nirasaki City Yamanashi
  • ASHIZAWA; Hiroaki - KITAKYUSHU-SHI JP
  • Ashizawa; Hiroaki - Kitakyushu JP
  • Ashizawa; Hiroaki - Nirasaki JP
  • Ashizawa; Hiroaki - Ebina JP
  • Ashizawa; Hiroaki - Fukuoka JP
  • Ashizawa; Hiroaki - Ebina-shi JP
  • Ashizawa; Hiroaki - Nirasaki-shi JP
  • Ashizawa; Hiroaki - Fukuoka-Ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laser machining apparatus and laser machining method
Grant 11,389,907 - Funaoka , et al. July 19, 2
2022-07-19
Semiconductor film forming method using hydrazine-based compound gas
Grant 11,348,794 - Nakamura , et al. May 31, 2
2022-05-31
Film Forming Method, Method For Manufacturing Semiconductor Device, Film Forming Device, And System For Manufacturing Semiconductor Device
App 20220157600 - ASHIZAWA; Hiroaki ;   et al.
2022-05-19
Composite Structure And Semiconductor Manufacturing Apparatus Including Composite Structure
App 20210343511 - ASHIZAWA; Hiroaki ;   et al.
2021-11-04
Composite Structure And Semiconductor Manufacturing Apparatus Including Composite Structure
App 20210340066 - ASHIZAWA; Hiroaki ;   et al.
2021-11-04
Laser Machining Apparatus And Laser Machining Method
App 20210308799 - FUNAOKA; Koji ;   et al.
2021-10-07
Film forming method and film forming apparatus
Grant 10,864,548 - Ashizawa , et al. December 15, 2
2020-12-15
Composite structure, semiconductor manufacturing apparatus and display manufacturing apparatus provided with composite structure
Grant 10,759,710 - Iwasawa , et al. Sep
2020-09-01
Structure
Grant 10,618,847 - Ashizawa , et al.
2020-04-14
Film-forming Method And Film-forming Apparatus
App 20200063258 - TAKAHASHI; Tsuyoshi ;   et al.
2020-02-27
Film Forming Method And Film Forming Apparatus
App 20190378723 - Nakamura; Hideo ;   et al.
2019-12-12
Composite Structure, Semiconductor Manufacturing Apparatus And Display Manufacturing Apparatus Provided With Composite Structure
App 20190276368 - IWASAWA; Junichi ;   et al.
2019-09-12
Substrate mounting method and substrate mounting device
Grant 10,340,176 - Fujisato , et al.
2019-07-02
Structure
App 20180362411 - ASHIZAWA; Hiroaki ;   et al.
2018-12-20
Structure
App 20180354859 - ASHIZAWA; Hiroaki ;   et al.
2018-12-13
Film Forming Method And Film Forming Apparatus
App 20180311700 - Ashizawa; Hiroaki ;   et al.
2018-11-01
Structure
Grant 10,087,109 - Ashizawa , et al. October 2, 2
2018-10-02
Structure
Grant 10,081,576 - Ashizawa , et al. September 25, 2
2018-09-25
Structure
App 20180127319 - ASHIZAWA; Hiroaki ;   et al.
2018-05-10
Structure
App 20180127320 - ASHIZAWA; Hiroaki ;   et al.
2018-05-10
Film forming method and film forming apparatus
Grant 9,963,784 - Ashizawa , et al. May 8, 2
2018-05-08
Substrate Mounting Method And Substrate Mounting Device
App 20180040503 - FUJISATO; Toshiaki ;   et al.
2018-02-08
Ruthenium film formation method and storage medium
Grant 9,331,139 - Ashizawa , et al. May 3, 2
2016-05-03
Film Forming Method And Film Forming Apparatus
App 20150110959 - ASHIZAWA; Hiroaki ;   et al.
2015-04-23
Ruthenium Film Formation Method And Storage Medium
App 20140287585 - ASHIZAWA; Hiroaki ;   et al.
2014-09-25
Method For Forming Ruthenium Oxide Film
App 20130115367 - NORO; Naotaka ;   et al.
2013-05-09
Method and apparatus for perforating printed circuit board
Grant 8,278,594 - Arai , et al. October 2, 2
2012-10-02
Film formation method, cleaning method and film formation apparatus
Grant 8,021,717 - Murakami , et al. September 20, 2
2011-09-20
Composite structure
Grant 7,897,268 - Iwasawa , et al. March 1, 2
2011-03-01
Cmp Conditioner And Process For Producing The Same
App 20090239454 - Yamashita; Tetsuji ;   et al.
2009-09-24
Composite Structure
App 20090233126 - Iwasawa; Junichi ;   et al.
2009-09-17
Sharp Blade And Its Manufacturing Method
App 20090196989 - Katayama; Takeshi ;   et al.
2009-08-06
Method and apparatus for perforating printed circuit board
App 20090166340 - Arai; Kunio ;   et al.
2009-07-02
Film Formation Method, Cleaning Method And Film Formation Apparatus
App 20090142513 - MURAKAMI; Seishi ;   et al.
2009-06-04
Method and apparatus for laser perforating printed circuit board
Grant 7,531,767 - Arai , et al. May 12, 2
2009-05-12
Method for Producing Film Using Aerosol, Particles Mixture Therefor, and Film and Composite Material
App 20080274347 - Iwasawa; Junichi ;   et al.
2008-11-06
Method for Producing Coating Film Using Aerosol, Fine Particles for Use Therein, and Coating Film and Composite Material
App 20080274348 - Iwasawa; Junichi ;   et al.
2008-11-06
Laser machining method and laser machining apparatus
Grant 7,205,501 - Arai , et al. April 17, 2
2007-04-17
Method and apparatus for perforating printed circuit board
App 20060211158 - Arai; Kunio ;   et al.
2006-09-21
Laser machining method and laser machining apparatus
App 20050155958 - Arai, Kunio ;   et al.
2005-07-21
Film-formation method for semiconductor process
App 20050136657 - Yokoi, Hiroaki ;   et al.
2005-06-23
Single-substrate-heat-processing apparatus and method for semiconductor process
App 20020022379 - Ashizawa, Hiroaki ;   et al.
2002-02-21

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