Arvin; Charles L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arvin; Charles L..The latest application filed is for "personalized copper block for selective solder removal".

Company Profile

98.155.148

Arvin; Charles L. - Poughkeepsie NY
Arvin; Charles L. - Savannah GA
Arvin; Charles L - Poughkeepsie NY
Arvin; Charles L. - Hopewell Junction NY
Arvin; Charles L. - South Bend IN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polygon integrated circuit (IC) packaging Grant 11,410,894 - Arvin , et al. August 9, 2	2022-08-09
Direct attachment of capacitors to flip chip dies Grant 11,404,365 - Arvin , et al. August 2, 2	2022-08-02
Alignment carrier for interconnect bridge assembly Grant 11,393,759 - Weiss , et al. July 19, 2	2022-07-19
Thin film capacitors for core and adjacent build up layers Grant 11,388,821 - Arvin , et al. July 12, 2	2022-07-12
Mixed UBM and mixed pitch on a single die Grant 11,270,964 - Arvin , et al. March 8, 2	2022-03-08
Personalized copper block for selective solder removal Grant 11,235,404 - Arvin , et al. February 1, 2	2022-02-01
Direct bonded heterogeneous integration packaging structures Grant 11,177,217 - Sikka , et al. November 16, 2	2021-11-16
Formation of terminal metallurgy on laminates and boards Grant 11,168,400 - Arvin , et al. November 9, 2	2021-11-09
Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste Grant 11,164,804 - Arvin , et al. November 2, 2	2021-11-02
Personalized Copper Block For Selective Solder Removal App 20210291287 - Arvin; Charles L. ; et al.	2021-09-23
Chip Corner Guard For Chip-package Interaction Failure Mitigation App 20210233824 - Li; Shidong ; et al.	2021-07-29
System for treating solution for use in electroplating application and method for treating solution for use in electroplating application Grant 11,053,604 - Arvin , et al. July 6, 2	2021-07-06
Lead-free solder joining of electronic structures Grant 11,043,468 - Arvin , et al. June 22, 2	2021-06-22
Spacer For Die-to-die Communication In An Integrated Circuit App 20210175207 - Arvin; Charles L. ; et al.	2021-06-10
Spacer for die-to-die communication in an integrated circuit Grant 11,031,373 - Arvin , et al. June 8, 2	2021-06-08
Integrated circuit tester probe contact liner Grant 11,009,545 - Arvin , et al. May 18, 2	2021-05-18
Stacked capacitors for use in integrated circuit modules and the like Grant 11,004,614 - Arvin , et al. May 11, 2	2021-05-11
Alignment Carrier For Interconnect Bridge Assembly App 20210104464 - Weiss; Thomas ; et al.	2021-04-08
Electrochemical cleaning of test probes Grant 10,955,439 - Arvin , et al. March 23, 2	2021-03-23
Bridge support structure Grant 10,957,650 - Arvin , et al. March 23, 2	2021-03-23
Lead-free column interconnect Grant 10,950,573 - Arvin , et al. March 16, 2	2021-03-16
Polygon Integrated Circuit (ic) Packaging App 20210074599 - Arvin; Charles L. ; et al.	2021-03-11
Bridge Support Structure App 20210057341 - Arvin; Charles L. ; et al.	2021-02-25
Multiple chip carrier for bridge assembly Grant 10,916,507 - Arvin , et al. February 9, 2	2021-02-09
Integrated Circuit (IC) Device Package Lid Attach Utilizing Nano Particle Metallic Paste App 20210028079 - Arvin; Charles L. ; et al.	2021-01-28
Prevent and remove organics from reservoir wells Grant 10,895,017 - Arvin , et al. January 19, 2	2021-01-19
Carrier and integrated memory Grant 10,892,249 - Arvin , et al. January 12, 2	2021-01-12
Carrier and integrated memory Grant 10,840,214 - Arvin , et al. November 17, 2	2020-11-17
Direct Attachment Of Capacitors To Flip Chip Dies App 20200357737 - Arvin; Charles L. ; et al.	2020-11-12
Managing thermal warpage of a laminate Grant 10,832,987 - Arvin , et al. November 10, 2	2020-11-10
Precision alignment of multi-chip high density interconnects Grant 10,833,051 - Arvin , et al. November 10, 2	2020-11-10
Mixed UBM and mixed pitch on a single die Grant 10,818,623 - Arvin , et al. October 27, 2	2020-10-27
Non-porous copper to copper interconnect Grant 10,804,241 - Arvin , et al. October 13, 2	2020-10-13
Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate Grant 10,804,204 - Rubin , et al. October 13, 2	2020-10-13
Spacer For Die-to-die Communication In An Integrated Circuit App 20200312812 - Arvin; Charles L. ; et al.	2020-10-01
Conductive pillar shaped for solder confinement Grant 10,790,253 - Arvin , et al. September 29, 2	2020-09-29
Lead-free Column Interconnect App 20200303339 - ARVIN; CHARLES L. ; et al.	2020-09-24
Finned Contact App 20200294946 - Arvin; Charles L. ; et al.	2020-09-17
Electrochemical Cleaning Of Test Probes App 20200292577 - Arvin; Charles L. ; et al.	2020-09-17
Multipart lid for a semiconductor package with multiple components Grant 10,777,482 - Arvin , et al. Sept	2020-09-15
Decoupling capacitor stiffener Grant 10,756,031 - Arvin , et al. A	2020-08-25
Finned contact Grant 10,756,041 - Arvin , et al. A	2020-08-25
Thin Film Capacitors For Core And Adjacent Build Up Layers App 20200245466 - Kind Code	2020-07-30
Precision Alignment Of Multi-chip High Density Interconnects App 20200243479 - Arvin; Charles L. ; et al.	2020-07-30
Prevent and remove organics from reservoir wells Grant 10,718,062 - Arvin , et al.	2020-07-21
Integrated Circuit Tester Probe Contact Liner App 20200209308 - Arvin; Charles L. ; et al.	2020-07-02
Stacked Capacitors For Use In Integrated Circuit Modules And The Like App 20200185156 - Arvin; Charles L. ; et al.	2020-06-11
Multiple Chip Carrier For Bridge Assembly App 20200176383 - Arvin; Charles L. ; et al.	2020-06-04
Integrated circuit tester probe contact liner Grant 10,670,653 - Arvin , et al.	2020-06-02
Lead-free Solder Joining Of Electronic Structures App 20200161272 - ARVIN; CHARLES L. ; et al.	2020-05-21
Thin film capacitors for core and adjacent build up layers Grant 10,660,209 - Arvin , et al.	2020-05-19
Direct Bonded Heterogeneous Integration Packaging Structures App 20200144187 - Sikka; Kamal K. ; et al.	2020-05-07
Multi terminal capacitor within input output path of semiconductor package interconnect Grant 10,622,299 - Arvin , et al.	2020-04-14
Corrosion resistant aluminum bond pad structure Grant 10,615,137 - Arvin , et al.	2020-04-07
Non-porous Copper To Copper Interconnect App 20200098723 - ARVIN; CHARLES L. ; et al.	2020-03-26
Conductive pillar shaped for solder confinement Grant 10,600,751 - Arvin , et al.	2020-03-24
Continuous modification of organics in chemical baths Grant 10,590,561 - Arvin , et al.	2020-03-17
Conductive Pillar Shaped For Solder Confinement App 20200083188 - Arvin; Charles L. ; et al.	2020-03-12
Lead-free solder joining of electronic structures Grant 10,586,782 - Arvin , et al.	2020-03-10
Dedicated Integrated Circuit Chip Carrier Plane Connected to Decoupling Capacitor(s) App 20200075468 - Arvin; Charles L. ; et al.	2020-03-05
Separation of alpha emitting species from plating baths Grant 10,577,703 - Arvin , et al.	2020-03-03
Direct bonded heterogeneous integration packaging structures Grant 10,580,738 - Sikka , et al.	2020-03-03
Continuous modification of organics in chemical baths Grant 10,570,527 - Arvin , et al. Feb	2020-02-25
Element place on laminates Grant 10,566,275 - Arvin , et al. Feb	2020-02-18
Non-porous copper to copper interconnect Grant 10,553,555 - Arvin , et al. Fe	2020-02-04
Multi-chip Package Structure Having Chip Interconnection Bridge Which Provides Power Connections Between Chip And Package Substr App 20200035604 - Rubin; Joshua ; et al.	2020-01-30
Multi-chip Package Structure Having Chip Interconnection Bridge Which Provides Power Connections Between Chip And Package Substrate App 20200035603 - Rubin; Joshua ; et al.	2020-01-30
Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate Grant 10,535,608 - Rubin , et al. Ja	2020-01-14
Formation Of Terminal Metallurgy On Laminates And Boards App 20190390348 - Arvin; Charles L. ; et al.	2019-12-26
Carrier and integrated memory Grant 10,515,929 - Arvin , et al. Dec	2019-12-24
Carrier And Integrated Memory App 20190378816 - Arvin; Charles L. ; et al.	2019-12-12
Integrated Circuit Tester Probe Contact Liner App 20190353702 - Arvin; Charles L. ; et al.	2019-11-21
System For Treating Solution For Use In Electroplating Application And Method For Treating Solution For Use In Electroplating Ap App 20190345627 - Arvin; Charles L. ; et al.	2019-11-14
Prevent And Remove Organics From Reservoir Wells App 20190338441 - Arvin; Charles L. ; et al.	2019-11-07
Separation of alpha emitting species from plating baths Grant 10,458,033 - Arvin , et al. Oc	2019-10-29
System for treating solution for use in electroplating application and method for treating solution for use in electroplating application Grant 10,450,667 - Arvin , et al. Oc	2019-10-22
Carrier And Integrated Memory App 20190312011 - Arvin; Charles L. ; et al.	2019-10-10
Carrier And Integrated Memory App 20190312009 - Arvin; Charles L. ; et al.	2019-10-10
Carrier And Integrated Memory App 20190312010 - Arvin; Charles L. ; et al.	2019-10-10
Carrier and integrated memory Grant 10,431,563 - Arvin , et al. O	2019-10-01
Direct Bonded Heterogeneous Integration Packaging Structures App 20190295952 - Sikka; Kamal K. ; et al.	2019-09-26
Managing Thermal Warpage Of A Laminate App 20190295921 - Arvin; Charles L. ; et al.	2019-09-26
Photonics chip Grant 10,409,006 - Gambino , et al. Sept	2019-09-10
Prevent and remove organics from reservoir wells Grant 10,392,720 - Arvin , et al. A	2019-08-27
Multipart Lid For A Semiconductor Package With Multiple Components App 20190259683 - ARVIN; CHARLES L. ; et al.	2019-08-22
Wearable articles for repelling decay products generated from radon Grant 10,388,418 - Arvin , et al. A	2019-08-20
Multipart lid for a semiconductor package with multiple components Grant 10,325,830 - Arvin , et al.	2019-06-18
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect App 20190172784 - Arvin; Charles L. ; et al.	2019-06-06
Multipart Lid For A Semiconductor Package With Multiple Components App 20190164864 - ARVIN; CHARLES L. ; et al.	2019-05-30
Conductive Pillar Shaped For Solder Confinement App 20190164921 - Arvin; Charles L. ; et al.	2019-05-30
Thin Film Capacitors For Core And Adjacent Build Up Layers App 20190150287 - Arvin; Charles L. ; et al.	2019-05-16
Element Place On Laminates App 20190148283 - Arvin; Charles L. ; et al.	2019-05-16
Separation of alpha emitting species from plating baths Grant 10,287,702 - Arvin , et al.	2019-05-14
Separation of alpha emitting species from plating baths Grant 10,287,698 - Arvin , et al.	2019-05-14
Conductive pillar shaped for solder confinement Grant 10,290,599 - Arvin , et al.	2019-05-14
Corrosion Resistant Aluminum Bond Pad Structure App 20190139919 - ARVIN; Charles L. ; et al.	2019-05-09
Reducing environmental radon Grant 10,276,275 - Arvin , et al.	2019-04-30
Reducing Environmental Radon App 20190122778 - Arvin; Charles L. ; et al.	2019-04-25
Mixed UBM and mixed pitch on a single die Grant 10,249,586 - Arvin , et al.	2019-04-02
Reducing environmental radon Grant 10,236,089 - Arvin , et al.	2019-03-19
Reducing Environmental Radon App 20190080809 - Arvin; Charles L. ; et al.	2019-03-14
Reducing Environmental Radon App 20190080810 - Arvin; Charles L. ; et al.	2019-03-14
Element place on laminates Grant 10,224,269 - Arvin , et al.	2019-03-05
Multi terminal capacitor within input output path of semiconductor package interconnect Grant 10,224,274 - Arvin , et al.	2019-03-05
Multi terminal capacitor within input output path of semiconductor package interconnect Grant 10,224,273 - Arvin , et al.	2019-03-05
Non-porous Copper To Copper Interconnect App 20190067239 - Arvin; Charles L. ; et al.	2019-02-28
Corrosion resistant aluminum bond pad structure Grant 10,204,877 - Arvin , et al. Feb	2019-02-12
Conductive pillar shaped for solder confinement Grant 10,192,839 - Arvin , et al. Ja	2019-01-29
Lead-free Solder Joining Of Electronic Structures App 20190006312 - ARVIN; CHARLES L. ; et al.	2019-01-03
Separation of alpha emitting species from plating baths Grant 10,167,568 - Arvin , et al. J	2019-01-01
Structures and methods to enable a full intermetallic interconnect Grant 10,170,446 - Arvin , et al. J	2019-01-01
Electrodeposition system and method incorporating an anode having a back side capacitive element Grant 10,156,019 - Arvin , et al. Dec	2018-12-18
Prevent And Remove Organics From Reservoir Wells App 20180355506 - Arvin; Charles L. ; et al.	2018-12-13
Separation Of Alpha Emitting Species From Plating Baths App 20180355504 - Arvin; Charles L. ; et al.	2018-12-13
Prevent And Remove Organics From Reservoir Wells App 20180355507 - Arvin; Charles L. ; et al.	2018-12-13
Separation of alpha emitting species from plating baths Grant 10,138,568 - Arvin , et al. Nov	2018-11-27
Mixed Ubm And Mixed Pitch On A Single Die App 20180331056 - ARVIN; CHARLES L. ; et al.	2018-11-15
Continuous Modification Of Organics In Chemical Baths App 20180298517 - Arvin; Charles L. ; et al.	2018-10-18
Prevent and remove organics from reservoir wells Grant 10,087,546 - Arvin , et al. October 2, 2	2018-10-02
Nanowires for pillar interconnects Grant 10,068,864 - Arvin , et al. September 4, 2	2018-09-04
Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution Grant 10,053,794 - Arvin , et al. August 21, 2	2018-08-21
Separation Of Alpha Emitting Species From Plating Baths App 20180223445 - Arvin; Charles L. ; et al.	2018-08-09
Method of forming a temporary test structure for device fabrication Grant 10,043,723 - Arvin , et al. August 7, 2	2018-08-07
Electrodeposition systems and methods that minimize anode and/or plating solution degradation Grant 10,041,183 - Arvin , et al. August 7, 2	2018-08-07
Separation of alpha emitting species from plating baths Grant 10,030,315 - Arvin , et al. July 24, 2	2018-07-24
Corrosion Resistant Aluminum Bond Pad Structure App 20180174988 - ARVIN; Charles L. ; et al.	2018-06-21
Photonics Chip App 20180164508 - GAMBINO; Jeffrey P. ; et al.	2018-06-14
Method of forming a temporary test structure for device fabrication Grant 9,997,424 - Arvin , et al. June 12, 2	2018-06-12
Structures And Methods To Enable A Full Intermetallic Interconnect App 20180158797 - Arvin; Charles L. ; et al.	2018-06-07
Separation Of Alpha Emitting Species From Plating Baths App 20180148856 - Arvin; Charles L. ; et al.	2018-05-31
Security mesh and method of making Grant 9,961,765 - Arvin , et al. May 1, 2	2018-05-01
Continuous Modification Of Organics In Chemical Baths App 20180112324 - Arvin; Charles L. ; et al.	2018-04-26
Corrosion resistant aluminum bond pad structure Grant 9,953,940 - Arvin , et al. April 24, 2	2018-04-24
PREVENTING AN UNWANTED DEPOSITION OF METAL DURING a FLUX CLEAN App 20180104758 - Arvin; Charles L. ; et al.	2018-04-19
Determining crackstop strength of integrated circuit assembly at the wafer level Grant 9,947,598 - Tunga , et al. April 17, 2	2018-04-17
Mixed Ubm And Mixed Pitch On A Single Die App 20180102335 - Arvin; Charles L. ; et al.	2018-04-12
Mixed Ubm And Mixed Pitch On A Single Die App 20180102336 - Arvin; Charles L. ; et al.	2018-04-12
Conductive Pillar Shaped For Solder Confinement App 20180102337 - Arvin; Charles L. ; et al.	2018-04-12
Photonics chip Grant 9,933,577 - Gambino , et al. April 3, 2	2018-04-03
Method Of Forming A Temporary Test Structure For Device Fabrication App 20180090399 - Arvin; Charles L. ; et al.	2018-03-29
Method Of Forming A Temporary Test Structure For Device Fabrication App 20180090400 - Arvin; Charles L. ; et al.	2018-03-29
Conductive Pillar Shaped For Solder Confinement App 20180082968 - Arvin; Charles L. ; et al.	2018-03-22
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect App 20180068945 - Arvin; Charles L. ; et al.	2018-03-08
Structures and methods to enable a full intermetallic interconnect Grant 9,911,711 - Arvin , et al. March 6, 2	2018-03-06
Conductive pillar shaped for solder confinement Grant 9,911,708 - Arvin , et al. March 6, 2	2018-03-06
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect App 20180053717 - Arvin; Charles L. ; et al.	2018-02-22
Electrodeposition System And Method Incorporating An Anode Having A Back Side Capacitive Element App 20180051385 - Arvin; Charles L. ; et al.	2018-02-22
Multi terminal capacitor within input output path of semiconductor package interconnect Grant 9,899,313 - Arvin , et al. February 20, 2	2018-02-20
Method of forming a temporary test structure for device fabrication Grant 9,899,280 - Arvin , et al. February 20, 2	2018-02-20
Electroplating System And Method Of Using Electroplating System For Controlling Concentration Of Organic Additives In Electroplating Solution App 20180016699 - Arvin; Charles L. ; et al.	2018-01-18
Multi Terminal Capacitor Within Input Output Path Of Semiconductor Package Interconnect App 20180012838 - Arvin; Charles L. ; et al.	2018-01-11
Electrodeposition system and method incorporating an anode having a back side capacitive element Grant 9,863,051 - Arvin , et al. January 9, 2	2018-01-09
Semiconductor device contact structure having stacked nickel, copper, and tin layers Grant 9,853,006 - Arvin , et al. December 26, 2	2017-12-26
Filtering lead from photoresist stripping solution Grant 9,804,498 - Arvin , et al. October 31, 2	2017-10-31
Mixed UBM and mixed pitch on a single die Grant 9,799,618 - Arvin , et al. October 24, 2	2017-10-24
All intermetallic compound with stand off feature and method to make Grant 9,793,232 - Arvin , et al. October 17, 2	2017-10-17
Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solution Grant 9,777,388 - Arvin , et al. October 3, 2	2017-10-03
Photonics Chip App 20170261693 - GAMBINO; Jeffery P. ; et al.	2017-09-14
Method Of Forming A Temporary Test Structure For Device Fabrication App 20170263514 - Arvin; Charles L. ; et al.	2017-09-14
Structures to enable a full intermetallic interconnect Grant 9,741,682 - Arvin , et al. August 22, 2	2017-08-22
Method of forming a temporary test structure for device fabrication Grant 9,735,071 - Arvin , et al. August 15, 2	2017-08-15
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer Grant 9,728,440 - Arvin , et al. August 8, 2	2017-08-08
Electrodeposition Systems And Methods That Minimize Anode And/or Plating Solution Degradation App 20170211199 - Arvin; Charles L. ; et al.	2017-07-27
Electrodeposition systems and methods that minimize anode and/or plating solution degradation Grant 9,689,084 - Arvin , et al. June 27, 2	2017-06-27
Nanowires For Pillar Interconnects App 20170179061 - Arvin; Charles L. ; et al.	2017-06-22
Structures And Methods To Enable A Full Intermetallic Interconnect App 20170179071 - Arvin; Charles L. ; et al.	2017-06-22
Protection Of Elements On A Laminate Surface App 20170179042 - Arvin; Charles L. ; et al.	2017-06-22
Structures To Enable A Full Intermetallic Interconnect App 20170179068 - Arvin; Charles L. ; et al.	2017-06-22
Element Place On Laminates App 20170179015 - Arvin; Charles L. ; et al.	2017-06-22
Security Mesh And Method Of Making App 20170171964 - Arvin; Charles L. ; et al.	2017-06-15
Nanowires for pillar interconnects Grant 9,679,806 - Arvin , et al. June 13, 2	2017-06-13
Anodized metal on carrier wafer Grant 9,679,796 - Arvin , et al. June 13, 2	2017-06-13
Nanowires For Pillar Interconnects App 20170162536 - Arvin; Charles L. ; et al.	2017-06-08
Nanowires For Pillar Interconnects App 20170162436 - Arvin; Charles L. ; et al.	2017-06-08
Separation Of Alpha Emitting Species From Plating Baths App 20170145575 - Arvin; Charles L. ; et al.	2017-05-25
Separation Of Alpha Emitting Species From Plating Baths App 20170145576 - Arvin; Charles L. ; et al.	2017-05-25
Separation Of Alpha Emitting Species From Plating Baths App 20170145583 - Arvin; Charles L. ; et al.	2017-05-25
Separation Of Alpha Emitting Species From Plating Baths App 20170145579 - Arvin; Charles L. ; et al.	2017-05-25
Conductive Pillar Shaped For Solder Confinement App 20170125368 - Arvin; Charles L. ; et al.	2017-05-04
Tin-based solder composition with low void characteristic Grant 9,604,316 - Arvin , et al. March 28, 2	2017-03-28
Under die surface mounted electrical elements Grant 9,601,423 - Arvin , et al. March 21, 2	2017-03-21
Method Of Forming A Temporary Test Structure For Device Fabrication App 20170062291 - Arvin; Charles L. ; et al.	2017-03-02
Conductive pillar shaped for solder confinement Grant 9,583,451 - Arvin , et al. February 28, 2	2017-02-28
Rinsing and drying for electrochemical processing Grant 9,574,283 - Arvin , et al. February 21, 2	2017-02-21
Security mesh and method of making Grant 9,565,777 - Arvin , et al. February 7, 2	2017-02-07
Separation of alpha emitting species from plating baths Grant 9,546,433 - Arvin , et al. January 17, 2	2017-01-17
Corrosion Resistant Aluminum Bond Pad Structure App 20160379948 - ARVIN; Charles L. ; et al.	2016-12-29
Conductive Pillar Shaped For Solder Confinement App 20160372430 - Arvin; Charles L. ; et al.	2016-12-22
Electrodeposition system and method incorporating an anode having a back side capacitive element Grant 9,481,940 - Arvin , et al. November 1, 2	2016-11-01
Layered Contact Structure App 20160307860 - Arvin; Charles L. ; et al.	2016-10-20
Passivation layer topography Grant 9,466,547 - Arvin , et al. October 11, 2	2016-10-11
Apparatuses, systems and methods that allow for selective removal of a specific metal from a multi-metal plating solution Grant 9,428,841 - Arvin , et al. August 30, 2	2016-08-30
Low alpha tin Grant 9,425,164 - Arvin , et al. August 23, 2	2016-08-23
Dual layer stack for contact formation Grant 9,401,336 - Arvin , et al. July 26, 2	2016-07-26
Multilayered contact structure having nickel, copper, and nickel-iron layers Grant 9,396,991 - Arvin , et al. July 19, 2	2016-07-19
Electromigration-resistant lead-free solder interconnect structures Grant 9,379,007 - Arvin , et al. June 28, 2	2016-06-28
Separation of alpha emitting species from plating baths Grant 9,359,687 - Arvin , et al. June 7, 2	2016-06-07
Method and apparatus for controlling and monitoring the potential Grant 9,347,147 - Arvin , et al. May 24, 2	2016-05-24
Dual Layer Stack For Contact Formation App 20160126201 - Arvin; Charles L. ; et al.	2016-05-05
Electroplating System And Method Of Using Electroplating System For Controlling Concentration Of Organic Additives In Electroplating Solution App 20160115616 - Arvin; Charles L. ; et al.	2016-04-28
Anodized Metal On Carrier Wafer App 20160118283 - Arvin; Charles L. ; et al.	2016-04-28
Non-transparent Microelectronic Grade Glass As A Substrate, Temporary Carrier Or Wafer App 20160118287 - Arvin; Charles L. ; et al.	2016-04-28
System For Treating Solution For Use In Electroplating Application And Method For Treating Solution For Use In Electroplating Application App 20160115618 - Arvin; Charles L. ; et al.	2016-04-28
Prevent And Remove Organics From Reservoir Wells App 20160115617 - Arvin; Charles L. ; et al.	2016-04-28
Use of electrolytic plating to control solder wetting Grant 9,324,669 - Arvin , et al. April 26, 2	2016-04-26
Tin-based Solder Composition With Low Void Characteristic App 20160082551 - Arvin; Charles L. ; et al.	2016-03-24
Use Of Electrolytic Plating To Control Solder Wetting App 20160079193 - Arvin; Charles L. ; et al.	2016-03-17
Rinsing And Drying For Electrochemical Processing App 20160076167 - Arvin; Charles L. ; et al.	2016-03-17
Rinsing And Drying For Electrochemical Processing App 20160076165 - Arvin; Charles L. ; et al.	2016-03-17
Multilayered Contact Structure Having Nickel, Copper, And Nickel-iron Layers App 20160056072 - Arvin; Charles L. ; et al.	2016-02-25
Electrodeposition System And Method Incorporating An Anode Having A Back Side Capacitive Element App 20150376808 - Arvin; Charles L. ; et al.	2015-12-31
Electrodeposition System And Method Incorporating An Anode Having A Back Side Capacitive Element App 20150376812 - Arvin; Charles L. ; et al.	2015-12-31
Rinsing and drying for electrochemical processing Grant 9,222,194 - Arvin , et al. December 29, 2	2015-12-29
Filtering Lead From Photoresist Stripping Solution App 20150352476 - Arvin; Charles L. ; et al.	2015-12-10
Selective Plating Without Photoresist App 20150348910 - Arvin; Charles L. ; et al.	2015-12-03
Electrodeposition Systems And Methods That Minimize Anode And/or Plating Solution Degradation App 20150337451 - Arvin; Charles L. ; et al.	2015-11-26
Apparatuses, Systems And Methods That Allow For Selective Removal Of A Specific Metal From A Multi-metal Plating Solution App 20150337452 - Arvin; Charles L. ; et al.	2015-11-26
Organic Coating To Inhibit Solder Wetting On Pillar Sidewalls App 20150333025 - Arvin; Charles L. ; et al.	2015-11-19
Organic coating to inhibit solder wetting on pillar sidewalls Grant 9,190,376 - Arvin , et al. November 17, 2	2015-11-17
Contact and solder ball interconnect Grant 9,177,928 - Arvin , et al. November 3, 2	2015-11-03
Selective Plating Without Photoresist App 20150311161 - Arvin; Charles L. ; et al.	2015-10-29
Contact And Solder Ball Interconnect App 20150311170 - Arvin; Charles L. ; et al.	2015-10-29
Semiconductor Wafer With Nonstick Seal Region App 20150303102 - Arvin; Charles L. ; et al.	2015-10-22
Under ball metallurgy (UBM) for improved electromigration Grant 9,142,501 - Arvin , et al. September 22, 2	2015-09-22
Under ball metallurgy (UBM) for improved electromigration Grant 9,084,378 - Arvin , et al. July 14, 2	2015-07-14
Method and apparatus for controlling and monitoring the potential Grant 9,062,388 - Arvin , et al. June 23, 2	2015-06-23
Structures for improving current carrying capability of interconnects and methods of fabricating the same Grant 9,035,459 - Arvin , et al. May 19, 2	2015-05-19
Solder interconnect with non-wettable sidewall pillars and methods of manufacture Grant 9,018,760 - Arvin , et al. April 28, 2	2015-04-28
Chip Connection Structure And Method Of Forming App 20150037971 - Arvin; Charles L. ; et al.	2015-02-05
Working electrode design for electrochemical processing of electronic components Grant 8,926,820 - Arvin , et al. January 6, 2	2015-01-06
Additives for grain fragmentation in Pb-free Sn-based solder Grant 8,910,853 - Arvin , et al. December 16, 2	2014-12-16
Under Ball Metallurgy (ubm) For Improved Electromigration App 20140339699 - Arvin; Charles L. ; et al.	2014-11-20
Under Ball Metallurgy (ubm) For Improved Electromigration App 20140262458 - Arvin; Charles L. ; et al.	2014-09-18
Structures for improving current carrying capability of interconnects and methods of fabricating the same Grant 8,803,317 - Arvin , et al. August 12, 2	2014-08-12
Working electrode design for electrochemical processing of electronic components Grant 8,784,618 - Arvin , et al. July 22, 2	2014-07-22
Control of silver in C4 metallurgy with plating process Grant 8,759,210 - Arvin , et al. June 24, 2	2014-06-24
Solder volume compensation with C4 process Grant 8,742,578 - Arvin , et al. June 3, 2	2014-06-03
Solder Interconnect With Non-wettable Sidewall Pillars And Methods Of Manufacture App 20140077367 - Arvin; Charles L. ; et al.	2014-03-20
Solder interconnect with non-wettable sidewall pillars and methods of manufacture Grant 8,637,392 - Arvin , et al. January 28, 2	2014-01-28
Solder Volume Compensation With C4 Process App 20140021607 - Arvin; Charles L. ; et al.	2014-01-23
Control Of Silver In C4 Metallurgy With Plating Process App 20140021606 - Arvin; Charles L. ; et al.	2014-01-23
Multi-anode system for uniform plating of alloys Grant 8,623,194 - Arvin , et al. January 7, 2	2014-01-07
Ball-limiting-metallurgy layers in solder ball structures Grant 8,592,976 - Arvin , et al. November 26, 2	2013-11-26
Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack Grant 8,587,112 - Arvin , et al. November 19, 2	2013-11-19
Chip Connection Structure And Method Of Forming App 20130299989 - Arvin; Charles L. ; et al.	2013-11-14
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER App 20130284495 - Arvin; Charles L. ; et al.	2013-10-31
Multi-anode system for uniform plating of alloys Grant 8,551,303 - Arvin , et al. October 8, 2	2013-10-08
Electromigration-resistant Lead-free Solder Interconnect Structures App 20130252418 - ARVIN; CHARLES L. ; et al.	2013-09-26
Electromigration-resistant Lead-free Solder Interconnect Structures App 20130249066 - ARVIN; CHARLES L. ; et al.	2013-09-26
Additives for grain fragmentation in Pb-free Sn-based solder Grant 8,493,746 - Arvin , et al. July 23, 2	2013-07-23
Current spreading in organic substrates Grant 8,450,619 - Arvin , et al. May 28, 2	2013-05-28
Working Electrode Design For Electrochemical Processing Of Electronic Components App 20130062209 - Arvin; Charles L. ; et al.	2013-03-14
Ball-limiting-metallurgy Layers In Solder Ball Structures App 20130008699 - Arvin; Charles L. ; et al.	2013-01-10
Method And Apparatus For Controlling And Monitoring The Potential App 20130001198 - Arvin; Charles L. ; et al.	2013-01-03
Multi-anode System For Uniform Plating Of Alloys App 20120325667 - Arvin; Charles L. ; et al.	2012-12-27
Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof Grant 8,298,930 - Arvin , et al. October 30, 2	2012-10-30
Ball-limiting-metallurgy layers in solder ball structures Grant 8,299,611 - Arvin , et al. October 30, 2	2012-10-30
Creation of lead-free solder joint with intermetallics Grant 8,268,716 - Arvin , et al. September 18, 2	2012-09-18
UNDERBUMP METALLURGY EMPLOYING AN ELECTROLYTIC Cu / ELECTORLYTIC Ni / ELECTROLYTIC Cu STACK App 20120198692 - Arvin; Charles L. ; et al.	2012-08-09
Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack Grant 8,232,655 - Arvin , et al. July 31, 2	2012-07-31
Structures For Improving Current Carrying Capability Of Interconnects And Methods Of Fabricating The Same App 20120187558 - ARVIN; Charles L. ; et al.	2012-07-26
Multi-anode System For Uniform Plating Of Alloys App 20120152750 - Arvin; Charles L. ; et al.	2012-06-21
Undercut-repair Of Barrier Layer Metallurgy For Solder Bumps And Methods Thereof App 20120139113 - Arvin; Charles L. ; et al.	2012-06-07
Multi-anode system for uniform plating of alloys Grant 8,177,945 - Arvin , et al. May 15, 2	2012-05-15
Creation Of Lead-free Solder Joint With Intermetallics App 20120083113 - Arvin; Charles L. ; et al.	2012-04-05
Rinsing and drying for electrochemical processing App 20120043217 - Arvin; Charles L. ; et al.	2012-02-23
Method And Apparatus For Controlling And Monitoring The Potential App 20120043301 - Arvin; Charles L. ; et al.	2012-02-23
Working electrode design for electrochemical processing of electronic components App 20120043216 - Arvin; Charles L. ; et al.	2012-02-23
Solder Interconnect with Non-Wettable Sidewall Pillars and Methods of Manufacture App 20110193218 - Arvin; Charles L. ; et al.	2011-08-11
Current Spreading In Organic Substrates App 20110162876 - Arvin; Charles L. ; et al.	2011-07-07
Ball-limiting-metallurgy Layers In Solder Ball Structures App 20100258940 - Arvin; Charles L. ; et al.	2010-10-14
Structures For Improving Current Carrying Capability Of Interconnects And Methods Of Fabricating The Same App 20100258335 - Arvin; Charles L. ; et al.	2010-10-14
Method to recover underfilled modules by selective removal of discrete components Grant 7,781,232 - Arvin , et al. August 24, 2	2010-08-24
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER App 20100200271 - Arvin; Charles L. ; et al.	2010-08-12
Intermetallic diffusion block device and method of manufacture Grant 7,683,493 - Arvin , et al. March 23, 2	2010-03-23
Intermetallic Diffusion Block Device And Method Of Manufacture App 20090267228 - Arvin; Charles L. ; et al.	2009-10-29
Method To Recover Underfilled Modules By Selective Removal Of Discrete Components App 20090184407 - Arvin; Charles L. ; et al.	2009-07-23
Bump Pad Metallurgy Employing An Electrolytic Cu / Electorlytic Ni / Electrolytic Cu Stack App 20090174045 - Arvin; Charles L. ; et al.	2009-07-09
Multi-anode System For Uniform Plating Of Alloys App 20080179192 - Arvin; Charles L. ; et al.	2008-07-31
Rework method for finishing metallurgy on chip carriers Grant 6,838,009 - Arvin , et al. January 4, 2	2005-01-04
Rework method for finishing metallurgy on chip carriers App 20030080092 - Arvin, Charles L. ; et al.	2003-05-01

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