ARIPIN; Azhar
Patent Applications and Registrations
Patent applications and USPTO patent grants for ARIPIN; Azhar.The latest application filed is for "direct bonded copper semiconductor packages and related methods".
- ARIPIN; Azhar - Subang Jaya MY
- Aripin; Azhar - Selangor MY
| Patent | Date |
|---|---|
| Direct Bonded Copper Semiconductor Packages And Related Methods App 20200161209 - TOLENTINO; Erik Nino ; et al. | 2020-05-21 |
| Direct bonded copper semiconductor packages and related methods Grant 10,546,798 - Tolentino , et al. Ja | 2020-01-28 |
| Direct Bonded Copper Semiconductor Packages And Related Methods App 20180261525 - TOLENTINO; Erik Nino ; et al. | 2018-09-13 |
| Embedded Stacked Die Packages And Related Methods App 20180211939 - LIN; Yusheng ; et al. | 2018-07-26 |
| Embedded stacked die packages and related methods Grant 9,941,257 - Lin , et al. April 10, 2 | 2018-04-10 |
| Embedded Stacked Die Packages And Related Methods App 20180033777 - LIN; Yusheng ; et al. | 2018-02-01 |
| Semiconductor Packages With Sub-terminals And Related Methods App 20170365518 - Prajuckamol; Atapol ; et al. | 2017-12-21 |
| Method of forming an electronic package and structure Grant 9,768,091 - Aripin September 19, 2 | 2017-09-19 |
| Embedded stacked die packages and related methods Grant 9,679,878 - Lin , et al. June 13, 2 | 2017-06-13 |
| Direct bonded copper semiconductor packages and related methods Grant 9,659,837 - Tolentino , et al. May 23, 2 | 2017-05-23 |
| Semiconductor Packages With Sub-terminals And Related Methods App 20160240452 - Prajuckamol; Atapol ; et al. | 2016-08-18 |
| Direct Bonded Copper Semiconductor Packages And Related Methods App 20160225693 - Tolentino; Erik Nino ; et al. | 2016-08-04 |
| Method Of Forming An Electronic Package And Structure App 20130208439 - Aripin; Azhar | 2013-08-15 |
| Leadframe for a semiconductor device Grant 7,482,679 - Aripin , et al. January 27, 2 | 2009-01-27 |
| Leadframe For a Semiconductor Device App 20080283978 - Aripin; Azhar ; et al. | 2008-11-20 |
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