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Arifeen; Shams U. Patent Filings

Arifeen; Shams U.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arifeen; Shams U..The latest application filed is for "methods for forming conductive elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements".

Company Profile
8.10.21
  • Arifeen; Shams U. - Boise ID
  • Arifeen; Shams U - Bellevue WA
  • Arifeen; Shams U - Boise ID
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor devices having crack-inhibiting structures
Grant 11,444,037 - Chun , et al. September 13, 2
2022-09-13
Methods For Forming Conductive Elements For Microelectronic Components, Related Conductive Elements, And Microelectronic Components, Assemblies And Electronic Systems Incorporating Such Conductive Elements
App 20220189899 - Arifeen; Shams U. ;   et al.
2022-06-16
Circuit Board With Spaces For Embedding Components
App 20220122958 - Nguyen; Quang ;   et al.
2022-04-21
Circuit Board With Spaces For Embedding Components
App 20220085002 - Nguyen; Quang ;   et al.
2022-03-17
Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements
Grant 11,276,659 - Arifeen , et al. March 15, 2
2022-03-15
Semiconductor Devices With Reinforced Substrates
App 20220077076 - Sinha; Koustav ;   et al.
2022-03-10
Semiconductor Devices With Thermal Buffer Structures
App 20220037258 - Arifeen; Shams U.
2022-02-03
Apparatus and method for dissipating heat in multiple semiconductor device modules
Grant 11,239,133 - Qu , et al. February 1, 2
2022-02-01
Stacked Semiconductor Die Assemblies With Substrate Heat Sinks And Associated Systems And Methods
App 20220028826 - Arifeen; Shams U. ;   et al.
2022-01-27
Semiconductor Device Packages With Angled Pillars For Decreasing Stress
App 20220028814 - Arifeen; Shams U.
2022-01-27
Semiconductor Devices, Semiconductor Device Packages, Electronic Systems Including Same, And Related Methods
App 20220028850 - Arifeen; Shams U. ;   et al.
2022-01-27
Circuit board with spaces for embedding components
Grant 11,217,576 - Nguyen , et al. January 4, 2
2022-01-04
Semiconductor Device Packages With Angled Pillars For Decreasing Stress
App 20210366859 - Arifeen; Shams U.
2021-11-25
Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods
Grant 11,171,130 - Arifeen , et al. November 9, 2
2021-11-09
Semiconductor device packages with angled pillars for decreasing stress
Grant 11,164,837 - Arifeen November 2, 2
2021-11-02
Apparatus And Method For Dissipating Heat In Multiple Semiconductor Device Modules
App 20210272870 - Qu; Xiaopeng ;   et al.
2021-09-02
Methods For Forming Elements For Microelectronic Components, Related Conductive Elements, And Microelectronic Components, Assemblies And Electronic Systems Incorporating Such Conductive Elements
App 20210272921 - Arifeen; Shams U. ;   et al.
2021-09-02
Warpage Control In Microelectronic Packages, And Related Assemblies And Methods
App 20210257314 - Glancey; Christopher ;   et al.
2021-08-19
Semiconductor Device
App 20210202337 - Chun; Hyunsuk ;   et al.
2021-07-01
Processes For Forming Self-healing Solder Joints And Repair Of Same, Related Solder Joints, And Microelectronic Components, Assemblies And Electronic Systems Incorporating Such Solder Joints
App 20210193607 - Arifeen; Shams U. ;   et al.
2021-06-24
Semiconductor Devices, Semiconductor Device Packages, Electronic Systems Including Same, And Related Methods
App 20210183843 - Arifeen; Shams U. ;   et al.
2021-06-17
Warpage control in microelectronic packages, and related assemblies and methods
Grant 11,031,353 - Glancey , et al. June 8, 2
2021-06-08
Apparatus and method for dissipating heat in multiple semiconductor device modules
Grant 11,011,449 - Qu , et al. May 18, 2
2021-05-18
Warpage Control In Microelectronic Packages, And Related Assemblies And Methods
App 20210057353 - Glancey; Christopher ;   et al.
2021-02-25
Semiconductor Devices Having Crack-inhibiting Structures
App 20210020585 - Arifeen; Shams U. ;   et al.
2021-01-21
Semiconductor Devices Having Crack-inhibiting Structures
App 20200402925 - Chun; Hyunsuk ;   et al.
2020-12-24
Semiconductor devices having crack-inhibiting structures
Grant 10,811,365 - Arifeen , et al. October 20, 2
2020-10-20
Semiconductor devices having crack-inhibiting structures
Grant 10,784,212 - Chun , et al. Sept
2020-09-22
Semiconductor Devices Having Crack-inhibiting Structures
App 20200211983 - Chun; Hyunsuk ;   et al.
2020-07-02
Semiconductor Devices Having Crack-inhibiting Structures
App 20200211982 - Arifeen; Shams U. ;   et al.
2020-07-02
Semiconductor Device
App 20190067145 - Chun; Hyunsuk ;   et al.
2019-02-28

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