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Arakawa; Yoshikazu Patent Filings

Arakawa; Yoshikazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arakawa; Yoshikazu.The latest application filed is for "deposition method for wiring thin film".

Company Profile
0.2.5
  • Arakawa; Yoshikazu - Tokyo JP
  • Arakawa; Yoshikazu - Miyagi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Deposition method for wiring thin film
App 20070032075 - Usami; Tetsuo ;   et al.
2007-02-08
Deposition method for wiring thin film
Grant 7,135,399 - Usami , et al. November 14, 2
2006-11-14
Semiconductor device
App 20060226485 - Arakawa; Yoshikazu
2006-10-12
Method for manufacturing capacitor structure, and method for manufacturing capacitor element
Grant 6,703,285 - Arakawa , et al. March 9, 2
2004-03-09
Method for manufacturing capacitor structure, and method for manufacturing capacitor element
App 20030219955 - Arakawa, Yoshikazu ;   et al.
2003-11-27
Deposition method for wiring thin film
App 20010034128 - Usami, Tetsuo ;   et al.
2001-10-25
Process for manufacturing semiconductor device
App 20010019890 - Arakawa, Yoshikazu
2001-09-06

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