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Patent applications and USPTO patent grants for Arakawa; Yoshikazu.The latest application filed is for "deposition method for wiring thin film".
Patent | Date |
---|---|
Deposition method for wiring thin film App 20070032075 - Usami; Tetsuo ;   et al. | 2007-02-08 |
Deposition method for wiring thin film Grant 7,135,399 - Usami , et al. November 14, 2 | 2006-11-14 |
Semiconductor device App 20060226485 - Arakawa; Yoshikazu | 2006-10-12 |
Method for manufacturing capacitor structure, and method for manufacturing capacitor element Grant 6,703,285 - Arakawa , et al. March 9, 2 | 2004-03-09 |
Method for manufacturing capacitor structure, and method for manufacturing capacitor element App 20030219955 - Arakawa, Yoshikazu ;   et al. | 2003-11-27 |
Deposition method for wiring thin film App 20010034128 - Usami, Tetsuo ;   et al. | 2001-10-25 |
Process for manufacturing semiconductor device App 20010019890 - Arakawa, Yoshikazu | 2001-09-06 |
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