Appelt; Bernd K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Appelt; Bernd K..The latest application filed is for "stackable wafer level packages and related methods".

Company Profile

0.10.11

Appelt; Bernd K. - Gulf Breeze FL
Appelt; Bernd K. - Sunnyvale NY
Appelt; Bernd K. - Endicott NY
Appelt; Bernd K. - Brackney PA
Appelt; Bernd K. - Apalachin NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stackable Wafer Level Packages And Related Methods App 20130037929 - Essig; Kay S. ; et al.	2013-02-14
Printed circuit board capacitor structure and method Grant 6,815,085 - Appelt , et al. November 9, 2	2004-11-09
Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same Grant 6,781,064 - Appelt , et al. August 24, 2	2004-08-24
Method for producing dendrite interconnect for planarization Grant 6,739,046 - Appelt , et al. May 25, 2	2004-05-25
Printed circuit board capacitor structure and method App 20030202314 - Appelt, Bernd K., ; et al.	2003-10-30
Method of forming a capacitive element Grant 6,625,857 - Appelt , et al. September 30, 2	2003-09-30
Electrically conductive filled through holes App 20030162047 - Appelt, Bernd K. ; et al.	2003-08-28
An Electronic Package Having A Substrate With Electrically Conductive Filled Through Holes App 20030006066 - APPELT, BERND K. ; et al.	2003-01-09
Method for producing conductor interconnect with dendrites Grant 6,427,323 - Appelt , et al. August 6, 2	2002-08-06
Process for manufacturing a multi-layer circuit board App 20010042733 - Appelt, Bernd K. ; et al.	2001-11-22
Conductor interconnect with dendrites through film and method for producing same App 20010034937 - Appelt, Bernd K. ; et al.	2001-11-01
Method and structure for preventing adhesive bleed onto surfaces App 20010028117 - Appelt, Bernd K. ; et al.	2001-10-11
Printed circuit board capacitor structure and method App 20010022718 - Appelt, Bernd K. ; et al.	2001-09-20
Chip carriers with enhanced wire bondabi lity App 20010013644 - Papathomas, Konstantinos ; et al.	2001-08-16
Printed circuit board capacitor structure and method App 20010005304 - Appelt, Bernd K. ; et al.	2001-06-28
Printed circuit board capacitor structure and method Grant 6,215,649 - Appelt , et al. April 10, 2	2001-04-10
Dendrite interconnect for planarization and method for producing same Grant 5,977,642 - Appelt , et al. November 2, 1	1999-11-02
Electrical and/or thermal interconnections and methods for obtaining such Grant 5,189,261 - Alexander , et al. February 23, 1	1993-02-23
Direct electroplating of through holes Grant 4,969,979 - Appelt , et al. November 13, 1	1990-11-13
Method and composition for applying coatings on printed circuit boards Grant 4,479,983 - Appelt , et al. October 30, 1	1984-10-30

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