Anjoh; Ichiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Anjoh; Ichiro.The latest application filed is for "semiconductor apparatus and semiconductor device".

Company Profile

0.48.31

Anjoh; Ichiro - Tokyo N/A JP
Anjoh; Ichiro - Koganei JP
Anjoh, Ichiro - Koganei-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device Grant 8,441,126 - Watanabe , et al. May 14, 2	2013-05-14
Semiconductor Apparatus And Semiconductor Device App 20120119356 - WATANABE; Mitsuhisa ; et al.	2012-05-17
Module with stacked semiconductor devices Grant 7,969,019 - Watanabe , et al. June 28, 2	2011-06-28
Method of manufacturing a semiconductor apparatus Grant 7,964,962 - Watanabe , et al. June 21, 2	2011-06-21
Semiconductor device and method for manufacturing semiconductor device Grant 7,786,564 - Watanabe , et al. August 31, 2	2010-08-31
Semiconductor Device And Semiconductor Module Including Semiconductor Devices App 20090184430 - WATANABE; Mitsuhisa ; et al.	2009-07-23
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20090020874 - WATANABE; Mitsuhisa ; et al.	2009-01-22
Semiconductor Apparatus, And Method Of Manufacturing Semiconductor Apparatus App 20090020873 - Watanabe; Mitsuhisa ; et al.	2009-01-22
Semiconductor device and manufacturing method thereof Grant 7,420,284 - Miyazaki , et al. September 2, 2	2008-09-02
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Grant 7,217,992 - Ogino , et al. May 15, 2	2007-05-15
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same Grant 7,202,570 - Nagai , et al. April 10, 2	2007-04-10
Semiconductor device and manufacturing method thereof App 20060261494 - Miyazaki; Chuichi ; et al.	2006-11-23
Semiconductor device and manufacturing method thereof Grant 7,091,620 - Miyazaki , et al. August 15, 2	2006-08-15
Wiring tape for semiconductor device including a buffer layer having interconnected foams Grant 7,038,325 - Ogino , et al. May 2, 2	2006-05-02
Semiconductor device and manufacturing metthod thereof App 20050212142 - Miyazaki, Chuichi ; et al.	2005-09-29
Semiconductor device and manufacturing method thereof App 20050200019 - Miyazaki, Chuichi ; et al.	2005-09-15
Semiconductor device App 20050189639 - Tanie, Hisashi ; et al.	2005-09-01
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Grant 6,888,230 - Ogino , et al. May 3, 2	2005-05-03
Semiconductor devices and methods of making the devices Grant 6,861,294 - Tsunoda , et al. March 1, 2	2005-03-01
Semiconductor device and lead frame therefor Grant 6,844,219 - Kitano , et al. January 18, 2	2005-01-18
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same App 20040224149 - Nagai, Akira ; et al.	2004-11-11
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device App 20040217453 - Ogino, Masahiko ; et al.	2004-11-04
Wiring tape for semiconductor device including a buffer layer having interconnected foams App 20040195702 - Ogino, Masahiko ; et al.	2004-10-07
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same Grant 6,791,194 - Nagai , et al. September 14, 2	2004-09-14
Semiconductor device and manufacturing method thereof App 20040061220 - Miyazaki, Chuichi ; et al.	2004-04-01
Semiconductor devices and methods of making the devices App 20040063272 - Tsunoda, Shigeharu ; et al.	2004-04-01
Semiconductor device comprising stress relaxation layers and method for manufacturing the same Grant 6,710,446 - Nagai , et al. March 23, 2	2004-03-23
Socket for testing of semiconductor device, and semiconductor device and method of manufacturing the semiconductor device Grant 6,710,610 - Tanaka , et al. March 23, 2	2004-03-23
Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame Grant 6,686,226 - Tsunoda , et al. February 3, 2	2004-02-03
Semiconductor device and manufacturing method thereof Grant 6,670,215 - Miyazaki , et al. December 30, 2	2003-12-30
Method of manufacturing a ball grid array type semiconductor package Grant 6,664,135 - Miyazaki , et al. December 16, 2	2003-12-16
Semiconductor device and manufacturing method thereof Grant 6,642,083 - Miyazaki , et al. November 4, 2	2003-11-04
Semiconductor device and manufacturing method thereof Grant 6,521,981 - Miyazaki , et al. February 18, 2	2003-02-18
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same App 20020160185 - Nagai, Akira ; et al.	2002-10-31
Semiconductor device and wiring tape for semiconductor device App 20020158343 - Ogino, Masahiko ; et al.	2002-10-31
Semiconductor device and manufacturing method thereof Grant 6,472,727 - Miyazaki , et al. October 29, 2	2002-10-29
Semiconductor device and method of manufacture thereof App 20020130412 - Nagai, Akira ; et al.	2002-09-19
Semiconductor device and manufacturing method thereof App 20020070461 - Miyazaki, Chuichi ; et al.	2002-06-13
Semiconductor device and manufacturing method thereof App 20020066181 - Miyazaki, Chuichi ; et al.	2002-06-06
Semiconductor device and manufacturing method thereof App 20020068380 - Miyazaki, Chuichi ; et al.	2002-06-06
Semiconductor device and manufacturing method thereof App 20020064901 - Miyazaki, Chuichi ; et al.	2002-05-30
Semiconductor device and method for manufacturing the same technical field Grant 6,396,145 - Nagai , et al. May 28, 2	2002-05-28
Semiconductor device and manufacturing method thereof Grant 6,355,500 - Miyazaki , et al. March 12, 2	2002-03-12
Semiconductor device and manufacturing method thereof Grant 6,355,975 - Miyazaki , et al. March 12, 2	2002-03-12
Sealed stacked arrangement of semiconductor devices Grant RE37,539 - Oguchi , et al. February 5, 2	2002-02-05
Semiconductor Device And Manufacturing Method Thereof App 20010035575 - MIYAZAKI, CHUICHI ; et al.	2001-11-01
Semiconductor device and manufacturing method thereof App 20010008304 - Miyazaki, Chuichi ; et al.	2001-07-19
Semiconductor device and manufacturing method thereof App 20010007781 - Miyazaki, Chuichi ; et al.	2001-07-12
Semiconductor device and manufacturing method thereof App 20010005055 - Miyazaki, Chuichi ; et al.	2001-06-28
Semiconductor device and manufacturing method thereof App 20010004127 - Miyazaki, Chuichi ; et al.	2001-06-21
Semiconductor device and manufacturing method thereof App 20010002724 - Miyazaki, Chuichi ; et al.	2001-06-07
Semiconductor device and manufacturing method thereof App 20010002730 - Miyazaki, Chuichi ; et al.	2001-06-07
Semiconductor device and manufacturing method thereof App 20010003059 - Miyazaki, Chuichi ; et al.	2001-06-07
Semiconductor device and manufacturing method thereof App 20010003048 - Miyazaki, Chuichi ; et al.	2001-06-07
Semiconductor device and manufacturing method thereof App 20010002069 - Miyazaki, Chuichi ; et al.	2001-05-31
Semiconductor device and manufacturing method thereof App 20010002064 - Miyazaki, Chuichi ; et al.	2001-05-31
Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame Grant 6,114,192 - Tsunoda , et al. September 5, 2	2000-09-05
Laminate and multilayer printed circuit board Grant 6,114,005 - Nagai , et al. September 5, 2	2000-09-05
Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2	2000-06-27
Semiconductor device Grant 6,049,128 - Kitano , et al. April 11, 2	2000-04-11
Semiconductor device Grant 5,895,965 - Tanaka , et al. April 20, 1	1999-04-20
Semiconductor device Grant 5,714,405 - Tsubosaki , et al. February 3, 1	1998-02-03
Sealed stacked arrangement of semiconductor devices Grant 5,701,031 - Oguchi , et al. December 23, 1	1997-12-23
Laminate and multilayer printed circuit board Grant 5,677,045 - Nagai , et al. October 14, 1	1997-10-14
Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1	1997-03-18
Semiconductor device with lead structure within the planar area of the device Grant 5,583,375 - Tsubosaki , et al. December 10, 1	1996-12-10
Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1	1996-06-25
Packaged semiconductor device having stress absorbing film Grant 5,466,888 - Beng , et al. November 14, 1	1995-11-14
Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation Grant 5,442,233 - Anjoh , et al. August 15, 1	1995-08-15
Semiconductor leadframe and its production method and plastic encapsulated semiconductor device Grant 5,437,915 - Nishimura , et al. August 1, 1	1995-08-01
Packaged semiconductor device having stress absorbing film Grant 5,406,028 - Beng , et al. April 11, 1	1995-04-11
Method of uniformly encapsulating a semiconductor device in resin Grant 5,371,044 - Yoshida , et al. December 6, 1	1994-12-06
Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1	1994-10-25
Plastic encapsulated semiconductor device and lead frame Grant 5,357,139 - Yaguchi , et al. October 18, 1	1994-10-18
Multi-chip semiconductor package Grant 5,332,922 - Oguchi , et al. July 26, 1	1994-07-26
Plastic sealed type semiconductor apparatus Grant 5,299,092 - Yaguchi , et al. March 29, 1	1994-03-29
Semiconductor device with a plurality of face to face chips Grant 5,296,737 - Nishimura , et al. March 22, 1	1994-03-22
Plastic encapsulated semiconductor device Grant 5,256,903 - Obata , et al. October 26, 1	1993-10-26