Amador; Gonzalo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Amador; Gonzalo.The latest application filed is for "total release method for sample extraction in an energetic-beam instrument".

Company Profile

0.23.26

Amador; Gonzalo - Dallas TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for stem sample inspection in a charged particle beam instrument Grant RE46,350 - Zaykova-Feldman , et al. March 28, 2	2017-03-28
Total release method for sample extraction in an energetic-beam instrument Grant 9,349,573 - Kruger , et al. May 24, 2	2016-05-24
Total Release Method For Sample Extraction In An Energetic-beam Instrument App 20160035540 - Kruger; Rocky ; et al.	2016-02-04
Method for preparing specimens for atom probe analysis and specimen assemblies made thereby Grant 8,288,740 - Amador October 16, 2	2012-10-16
Method for stem sample inspection in a charged particle beam instrument Grant 8,247,768 - Zaykova-Feldman , et al. August 21, 2	2012-08-21
Variable-tilt specimen holder and method and for monitoring milling in a charged-particle instrument Grant 8,227,781 - Zaykova-Feldman , et al. July 24, 2	2012-07-24
Method for stem sample inspection in a charged particle beam instrument Grant 8,168,949 - Zaykova-Feldman , et al. May 1, 2	2012-05-01
Multiple magnification optical system with single objective lens Grant 8,054,558 - Marchman , et al. November 8, 2	2011-11-08
Apparatus For Stem Sample Inspection In A Charged Particle Beam Instrument App 20110204226 - Amador; Gonzalo	2011-08-25
Method of forming TEM sample holder Grant 7,935,937 - Moore , et al. May 3, 2	2011-05-03
Method For Stem Sample Inspection In A Charged Particle Beam Instrument App 20110031396 - Zaykova-Feldman; Lyudmila ; et al.	2011-02-10
Method For Stem Sample Inspection In A Charged Particle Beam Instrument App 20110031397 - Zaykova-Feldman; Lyudmila ; et al.	2011-02-10
Variable-tilt Tem Specimen Holder For Charged-particle Beam Instruments App 20110017922 - Amador; Gonzalo	2011-01-27
Method And Apparatus For The Monitoring Of Sample Milling In A Charged Particle Instrument App 20110017927 - Zaykova-Feldman; Lyudmila ; et al.	2011-01-27
Method for STEM sample inspection in a charged particle beam instrument Grant 7,834,315 - Zaykova-Feldman , et al. November 16, 2	2010-11-16
Multiple Magnification Optical System With Single Objective Lens App 20100202042 - Marchman; Herschel M. ; et al.	2010-08-12
Grid Holder For Stem Analysis In A Charged Particle Instrument App 20100025580 - Hammer; Matthew ; et al.	2010-02-04
Method and apparatus for transfer of samples in a controlled environment Grant 7,644,637 - Moore , et al. January 12, 2	2010-01-12
Method for Preparing Specimens for Atom Probe Analysis and Specimen Assemblies Made Thereby App 20090320624 - Amador; Gonzalo	2009-12-31
Method Of Forming Tem Sample Holder App 20090294690 - Moore; Thomas M. ; et al.	2009-12-03
Method And Apparatus For Transfer Of Samples In A Controlled Environment App 20090078060 - Moore; Thomas M. ; et al.	2009-03-26
Method For Stem Sample Inspection In A Charged Particle Beam Instrument App 20080258056 - Zaykova-Feldman; Lyudmila ; et al.	2008-10-23
Protective interleaf for stacked wafer shipping Grant 7,138,726 - Amador , et al. November 21, 2	2006-11-21
TEM sample holder and method of forming same App 20060219919 - Moore; Thomas M. ; et al.	2006-10-05
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads Grant 7,071,013 - Amador , et al. July 4, 2	2006-07-04
Protective interleaf for stacked wafer shipping App 20060073633 - Amador; Gonzalo ; et al.	2006-04-06
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads App 20050217574 - Amador, Gonzalo ; et al.	2005-10-06
Variable cross-section plated mushroom with stud for bumping Grant 6,940,167 - Amador , et al. September 6, 2	2005-09-06
Protective interleaf for stacked wafer shipping Grant 6,926,150 - Amador , et al. August 9, 2	2005-08-09
Wire bonding process for copper-metallized integrated circuits App 20050106851 - Test, Howard R. ; et al.	2005-05-19
Wire bonding process for copper-metallized integrated circuits Grant 6,800,555 - Test , et al. October 5, 2	2004-10-05
Variable cross-section plated mushroom with stud for bumping App 20040175879 - Amador, Gonzalo ; et al.	2004-09-09
Protective interleaf for stacked wafer shipping App 20040149623 - Amador, Gonzalo ; et al.	2004-08-05
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads App 20040118693 - Amador, Gonzalo ; et al.	2004-06-24
Variable cross-section plated mushroom with stud for bumping Grant 6,750,134 - Amador , et al. June 15, 2	2004-06-15
Wafer-level method for fine-pitch, high aspect ratio chip interconnect App 20040007779 - Arbuthnot, Diane ; et al.	2004-01-15
Variable cross-section plated mushroom with stud for bumping App 20030129823 - Amador, Gonzalo ; et al.	2003-07-10
Micromechanical device contact terminals free of particle generation App 20030107137 - Stierman, Roger J. ; et al.	2003-06-12
Structure and method for bond pads of copper-metallized integrated circuits App 20030071319 - Stierman, Roger J. ; et al.	2003-04-17
Wafer-scale assembly of chip-size packages Grant 6,432,744 - Amador , et al. August 13, 2	2002-08-13
Fixture and method for uniform electroless metal deposition on integrated circuit bond pads App 20010047944 - Amador, Gonzalo ; et al.	2001-12-06
Wire bonding process for copper-metallized integrated circuits App 20010035452 - Test, Howard R. ; et al.	2001-11-01
Structure and method for bond pads of copper-metallized integrated circuits App 20010033020 - Stierman, Roger J. ; et al.	2001-10-25
Method for the transfer of flux coated particles to a substrate Grant 6,303,407 - Hotchkiss , et al. October 16, 2	2001-10-16
Low stress method and apparatus of underfilling flip-chip electronic devices Grant 6,245,583 - Amador , et al. June 12, 2	2001-06-12
Rapid and selective heating method in integrated circuit package assembly by means of tungsten halogen light source Grant 6,234,374 - Hwang , et al. May 22, 2	2001-05-22
Automated multiple lead frame strip radiant die attach material curing apparatus Grant 6,069,342 - Amador , et al. May 30, 2	2000-05-30
Optical diebonding for semiconductor devices Grant 5,783,025 - Hwang , et al. July 21, 1	1998-07-21
Voice coil programmable wire tensioner Grant 5,114,066 - Amador , et al. May 19, 1	1992-05-19

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