Albermann; Guido
Patent Applications and Registrations
Patent applications and USPTO patent grants for Albermann; Guido.The latest application filed is for "method for forming a packaged semiconductor device".
- Albermann; Guido - Hamburg DE
| Patent | Date |
|---|---|
| Method For Forming A Packaged Semiconductor Device App 20210305095 - Moeller; Sascha ; et al. | 2021-09-30 |
| Technique For Handling Diced Wafers Of Integrated Circuits App 20210134647 - Kamphuis; Antonius Hendrikus Jozef ; et al. | 2021-05-06 |
| Integrated circuit saw bow break point Grant 10,896,878 - Kamphuis , et al. January 19, 2 | 2021-01-19 |
| Integrated Circuit Saw Bow Break Point App 20200402918 - Kamphuis; Antonius Hendrikus Jozef ; et al. | 2020-12-24 |
| Variable stealth laser dicing process Grant 10,347,534 - Lapke , et al. July 9, 2 | 2019-07-09 |
| Variable Stealth Laser Dicing Process App 20190080963 - LAPKE; Martin ; et al. | 2019-03-14 |
| Plasma dicing with blade saw patterned underside mask Grant 9,847,258 - Rohleder , et al. December 19, 2 | 2017-12-19 |
| Combination grinding after laser (GAL) and laser on-off function to increase die strength Grant 9,812,361 - Buenning , et al. November 7, 2 | 2017-11-07 |
| Plasma Dicing With Blade Saw Patterned Underside Mask App 20170092540 - Rohleder; Thomas ; et al. | 2017-03-30 |
| Plasma etching and stealth dicing laser process Grant 9,601,437 - Albermann , et al. March 21, 2 | 2017-03-21 |
| Wafer Material Removal App 20160172243 - Moeller; Sascha ; et al. | 2016-06-16 |
| Apparatus, device and method for wafer dicing Grant 9,349,645 - Lapke , et al. May 24, 2 | 2016-05-24 |
| Plasma Etching And Stealth Dicing Laser Process App 20160071770 - Albermann; Guido ; et al. | 2016-03-10 |
| Apparatus, Device And Method For Wafer Dicing App 20150104931 - Lapke; Martin ; et al. | 2015-04-16 |
| Combination Grinding After Laser (gal) And Laser On-off Function To Increase Die Strength App 20150069578 - BUENNING; Hartmut ; et al. | 2015-03-12 |
| Die preparation for wafer-level chip scale package (WLCSP) Grant 8,895,363 - Buenning , et al. November 25, 2 | 2014-11-25 |
| Die Preparation for Wafer-Level Chip Scale Package (WLCSP) App 20140264768 - Buenning; Hartmut ; et al. | 2014-09-18 |
| High die strength semiconductor wafer processing method and system Grant 8,809,166 - Buenning , et al. August 19, 2 | 2014-08-19 |
| High Die Strength Semiconductor Wafer Processing Method And System App 20140179083 - BUENNING; HARTMUT ; et al. | 2014-06-26 |
| Integrated circuits on a wafer and method for separating integrated circuits on a wafer Grant 8,415,769 - Scheucher , et al. April 9, 2 | 2013-04-09 |
| Integrated Circuits On A Wafer and Method For Separating Integrated Circuits On A Wafer App 20100270655 - Scheucher; Heimo ; et al. | 2010-10-28 |
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