Alatorre; Roseann
Patent Applications and Registrations
Patent applications and USPTO patent grants for Alatorre; Roseann.The latest application filed is for "package-on-package assembly with wire bond vias".
- Alatorre; Roseann - San Jose CA
- Alatorre; Roseann - San Martin CA
| Patent | Date |
|---|---|
| Package-on-package Assembly With Wire Bond Vias App 20220165703 - Chau; Ellis ; et al. | 2022-05-26 |
| Package-on-package assembly with wire bond vias Grant 11,189,595 - Chau , et al. November 30, 2 | 2021-11-30 |
| Package-on-package Assembly With Wire Bond Vias App 20210035948 - Chau; Ellis ; et al. | 2021-02-04 |
| Package-on-package assembly with wire bond vias Grant 10,756,049 - Chau , et al. A | 2020-08-25 |
| Package-on-package Assembly With Wire Bond Vias App 20180026007 - Chau; Ellis ; et al. | 2018-01-25 |
| Package-on-package assembly with wire bond vias Grant 9,761,558 - Chau , et al. September 12, 2 | 2017-09-12 |
| Stiffened wires for offset BVA Grant 9,659,848 - Villavicencio , et al. May 23, 2 | 2017-05-23 |
| Stiffened Wires For Offset Bva App 20170141020 - Villavicencio; Grant ; et al. | 2017-05-18 |
| Method of forming a component having wire bonds and a stiffening layer Grant 9,601,454 - Zhao , et al. March 21, 2 | 2017-03-21 |
| Package-on-package assembly with wire bond vias Grant 9,252,122 - Chau , et al. February 2, 2 | 2016-02-02 |
| Microelectronic Package Having Wire Bond Vias And Stiffening Layer App 20150380375 - Zhao; Zhijun ; et al. | 2015-12-31 |
| Microelectronic package having wire bond vias and stiffening layer Grant 9,136,254 - Zhao , et al. September 15, 2 | 2015-09-15 |
| Package-on-package Assembly With Wire Bond Vias App 20150255424 - Chau; Ellis ; et al. | 2015-09-10 |
| Package-on-package assembly with wire bond vias Grant 9,105,483 - Chau , et al. August 11, 2 | 2015-08-11 |
| Package-on-package assembly with wire bond vias Grant 9,041,227 - Chau , et al. May 26, 2 | 2015-05-26 |
| Package-on-package assembly with wire bond vias Grant 8,836,136 - Chau , et al. September 16, 2 | 2014-09-16 |
| Microelectronic Package Having Wire Bond Vias And Stiffening Layer App 20140217619 - Zhao; Zhijun ; et al. | 2014-08-07 |
| Package-on-package Assembly With Wire Bond Vias App 20130328219 - Chau; Ellis ; et al. | 2013-12-12 |
| Package-on-package Assembly With Wire Bond Vias App 20130200533 - Chau; Ellis ; et al. | 2013-08-08 |
| Package-on-package Assembly With Wire Bond Vias App 20130093087 - Chau; Ellis ; et al. | 2013-04-18 |
| Package-on-package Assembly With Wire Bond Vias App 20130095610 - Chau; Ellis ; et al. | 2013-04-18 |
| Package-on-package Assembly With Wire Bond Vias App 20130093088 - Chau; Ellis ; et al. | 2013-04-18 |
| Package-on-package assembly with wire bond vias Grant 8,404,520 - Chau , et al. March 26, 2 | 2013-03-26 |
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