Akiyama; Yukiharu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Akiyama; Yukiharu.The latest application filed is for "electronic component, module, module assembling method, module identification method and module environment setting method".
Company Profile
0.25.27
- Akiyama; Yukiharu - Tokyo N/A JP
- Akiyama; Yukiharu - Kodaira JP
- Akiyama; Yukiharu - Fukuyama JP
- Akiyama; Yukiharu - Kodaira-shi JP
- Akiyama, Yukiharu - Fukuyama-shi JP
- Akiyama; Yukiharu - Koganei JP
- AKIYAMA, YUKIHARU - KOGANEI-SHI JP
- Akiyama; Yukiharu - Tenri JP
Patent Activity
| Patent | Date |
|---|---|
| Manufacturing method for semiconductor device, semiconductor device and semiconductor chip Grant 8,552,545 - Tanida , et al. October 8, 2 | 2013-10-08 |
| Manufacturing method for semiconductor device Grant 8,404,586 - Tanida , et al. March 26, 2 | 2013-03-26 |
| Semiconductor device and manufacturing method thereof Grant 7,420,284 - Miyazaki , et al. September 2, 2 | 2008-09-02 |
| Semiconductor memory device and manufacturing method thereof Grant 7,256,085 - Hata , et al. August 14, 2 | 2007-08-14 |
| Electronic component, module, module assembling method, module identification method and module environment setting method App 20070096332 - Satoh; Tomotoshi ; et al. | 2007-05-03 |
| Manufacturing method for semiconductor device, semiconductor device and semiconductor chip App 20070080457 - Tanida; Kazumasa ; et al. | 2007-04-12 |
| Semiconductor device and manufacturing method thereof App 20060261494 - Miyazaki; Chuichi ; et al. | 2006-11-23 |
| Multi-compartment pressure sensor housing apparatus Grant 7,104,136 - Akiyama , et al. September 12, 2 | 2006-09-12 |
| Semiconductor device and manufacturing method thereof Grant 7,091,620 - Miyazaki , et al. August 15, 2 | 2006-08-15 |
| Pressure sensor apparatus App 20050268723 - Akiyama, Yukiharu ; et al. | 2005-12-08 |
| Manufacturing method for semiconductor device, semiconductor device and semiconductor chip App 20050230804 - Tanida, Kazumasa ; et al. | 2005-10-20 |
| Semiconductor device and manufacturing metthod thereof App 20050212142 - Miyazaki, Chuichi ; et al. | 2005-09-29 |
| Semiconductor device and manufacturing method thereof App 20050200019 - Miyazaki, Chuichi ; et al. | 2005-09-15 |
| Semiconductor memory device and manufacturing method thereof App 20050199946 - Hata, Kazuhiro ; et al. | 2005-09-15 |
| Semiconductor device and manufacturing method thereof App 20040061220 - Miyazaki, Chuichi ; et al. | 2004-04-01 |
| Semiconductor device and manufacturing method thereof Grant 6,670,215 - Miyazaki , et al. December 30, 2 | 2003-12-30 |
| Method of manufacturing a ball grid array type semiconductor package Grant 6,664,135 - Miyazaki , et al. December 16, 2 | 2003-12-16 |
| Semiconductor device and its manufacturing method App 20030207557 - Akiyama, Yukiharu ; et al. | 2003-11-06 |
| Semiconductor device and manufacturing method thereof Grant 6,642,083 - Miyazaki , et al. November 4, 2 | 2003-11-04 |
| Semiconductor device and its manufacturing method Grant 6,639,323 - Akiyama , et al. October 28, 2 | 2003-10-28 |
| Semiconductor device and manufacturing method thereof Grant 6,521,981 - Miyazaki , et al. February 18, 2 | 2003-02-18 |
| Semiconductor device with elastic structure and wiring Grant 6,515,371 - Akiyama , et al. February 4, 2 | 2003-02-04 |
| Semiconductor device and manufacturing method thereof Grant 6,472,727 - Miyazaki , et al. October 29, 2 | 2002-10-29 |
| Semiconductor device and manufacturing method thereof App 20020070461 - Miyazaki, Chuichi ; et al. | 2002-06-13 |
| Semiconductor device and manufacturing method thereof App 20020066181 - Miyazaki, Chuichi ; et al. | 2002-06-06 |
| Semiconductor device and manufacturing method thereof App 20020068380 - Miyazaki, Chuichi ; et al. | 2002-06-06 |
| Semiconductor device and manufacturing method thereof App 20020064901 - Miyazaki, Chuichi ; et al. | 2002-05-30 |
| Semiconductor device and its manufacturing method App 20020050636 - Akiyama, Yukiharu ; et al. | 2002-05-02 |
| Semiconductor device and its manufacturing method App 20020047215 - Akiyama, Yukiharu ; et al. | 2002-04-25 |
| Semiconductor device and manufacturing method thereof Grant 6,355,975 - Miyazaki , et al. March 12, 2 | 2002-03-12 |
| Semiconductor device and manufacturing method thereof Grant 6,355,500 - Miyazaki , et al. March 12, 2 | 2002-03-12 |
| Semiconductor Device And Manufacturing Method Thereof App 20010035575 - MIYAZAKI, CHUICHI ; et al. | 2001-11-01 |
| Semiconductor device and manufacturing method thereof App 20010008304 - Miyazaki, Chuichi ; et al. | 2001-07-19 |
| Semiconductor device and manufacturing method thereof App 20010007781 - Miyazaki, Chuichi ; et al. | 2001-07-12 |
| Semiconductor device and manufacturing method thereof App 20010005055 - Miyazaki, Chuichi ; et al. | 2001-06-28 |
| Semiconductor device and manufacturing method thereof App 20010004127 - Miyazaki, Chuichi ; et al. | 2001-06-21 |
| Semiconductor device and manufacturing method thereof App 20010003059 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010003048 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010002724 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010002730 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010002069 - Miyazaki, Chuichi ; et al. | 2001-05-31 |
| Semiconductor device and manufacturing method thereof App 20010002064 - Miyazaki, Chuichi ; et al. | 2001-05-31 |
| Method for manufacturing semiconductor memory device Grant 6,066,531 - Akiyama , et al. May 23, 2 | 2000-05-23 |
| Method for manufacturing a semiconductor device having a triple-well structure Grant 5,943,595 - Akiyama , et al. August 24, 1 | 1999-08-24 |
| Ultrasonic bonding method and ultrasonic bonding apparatus Grant 5,884,835 - Kajiwara , et al. March 23, 1 | 1999-03-23 |
| Method for forming field oxide film Grant 5,880,008 - Akiyama , et al. March 9, 1 | 1999-03-09 |
| Electrically erasable PROM (E.sup.2 PROM) with thin film peripheral transistor Grant 5,493,139 - Akiyama , et al. February 20, 1 | 1996-02-20 |
| Method and apparatus for wire bond Grant 5,176,310 - Akiyama , et al. January 5, 1 | 1993-01-05 |
| Method and apparatus for wire bonding Grant 5,110,032 - Akiyama , et al. May 5, 1 | 1992-05-05 |
| Method and apparatus for wire bonding Grant 5,037,023 - Akiyama , et al. August 6, 1 | 1991-08-06 |
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