AKATSU; Takeshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for AKATSU; Takeshi.The latest application filed is for "biomolecule recovering device and method, and biomolecule analyzing device and method".

Company Profile

1.21.30

AKATSU; Takeshi - Tokyo JP
Akatsu; Takeshi - St. Nazaire les Eymes FR
Akatsu; Takeshi - Saint Nazaire les Eymes FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Biomolecule Recovering Device And Method, And Biomolecule Analyzing Device And Method App 20220143613 - ONOSE; Ryuichi ; et al.	2022-05-12
Devices, Systems And Methods For Nucleic Acid Sequencing App 20190071720 - Nordman; Eric S. ; et al.	2019-03-07
Method Of Fabricating A Release Substrate App 20110233733 - Rayssac; Olivier ; et al.	2011-09-29
Method of fabricating a release substrate Grant 8,012,289 - Rayssac , et al. September 6, 2	2011-09-06
Method for fabricating a semiconductor on insulator wafer Grant 7,776,716 - Deguet , et al. August 17, 2	2010-08-17
Method Of Recycling An Epitaxied Donor Wafer App 20100167500 - Chhaimi; Nabil ; et al.	2010-07-01
Method Of Recycling An Epitaxied Donor Wafer App 20090325362 - Chhaimi; Nabil ; et al.	2009-12-31
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof Grant 7,602,046 - Ghyselen , et al. October 13, 2	2009-10-13
Method Of Fabricating A Release Substrate App 20090179299 - RAYSSAC; Olivier ; et al.	2009-07-16
Method of fabricating a release substrate Grant 7,544,265 - Rayssac, legal representative , et al. June 9, 2	2009-06-09
Multi-gate FET with multi-layer channel Grant 7,476,930 - Allibert , et al. January 13, 2	2009-01-13
Atomic implantation and thermal treatment of a semiconductor layer Grant 7,449,394 - Akatsu , et al. November 11, 2	2008-11-11
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom Grant 7,378,729 - Ghyselen , et al. May 27, 2	2008-05-27
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof Grant 7,375,008 - Ghyselen , et al. May 20, 2	2008-05-20
Thin layer transfer method utilizing co-implantation to reduce blister formation and to surface roughness Grant 7,326,628 - Ben Mohamed , et al. February 5, 2	2008-02-05
Method of layer transfer comprising sequential implantations of atomic species Grant 7,323,398 - Akatsu January 29, 2	2008-01-29
Method For Fabricating A Semiconductor On Insulator Wafer App 20070284660 - Deguet; Chrystel ; et al.	2007-12-13
Multi-gate Fet With Multi-layer Channel App 20070257301 - Allibert; Frederic ; et al.	2007-11-08
Methods for thermally treating a semiconductor layer Grant 7,285,495 - Daval , et al. October 23, 2	2007-10-23
Thermal treatment of a semiconductor layer Grant 7,282,449 - Daval , et al. October 16, 2	2007-10-16
Methods for forming a semiconductor structure Grant 7,276,428 - Daval , et al. October 2, 2	2007-10-02
Method for implanting atomic species through an uneven surface of a semiconductor layer Grant 7,265,435 - Ghyselen , et al. September 4, 2	2007-09-04
Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer Grant 7,256,075 - Ghyselen , et al. August 14, 2	2007-08-14
Method of fabrication of a substrate for an epitaxial growth Grant 7,232,488 - Akatsu , et al. June 19, 2	2007-06-19
Method of fabricating a release substrate App 20070077729 - Rayssac; Olivier ; et al.	2007-04-05
Thermal treament of a semiconductor layer App 20060141748 - Daval; Nicolas ; et al.	2006-06-29
Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means Grant 7,033,905 - Ghyselen , et al. April 25, 2	2006-04-25
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom App 20060076578 - Ghyselen; Bruno ; et al.	2006-04-13
Method for implanting atomic species through an uneven surface of a semiconductor layer Grant 7,018,913 - Ghyselen , et al. March 28, 2	2006-03-28
Method of layer transfer comprising sequential implantations of atomic species App 20060063353 - Akatsu; Takeshi	2006-03-23
Thin layer transfer method utilizing co-implantation to reduce blister formation and to surface roughness App 20060060943 - Ben Mohamed; Nadia ; et al.	2006-03-23
Method for implanting atomic species through an uneven surface of a semiconductor layer App 20060051944 - Ghyselen; Bruno ; et al.	2006-03-09
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom Grant 7,008,857 - Ghyselen , et al. March 7, 2	2006-03-07
Wafer with a relaxed useful layer and method of forming the wafer Grant 7,001,826 - Akatsu , et al. February 21, 2	2006-02-21
Compliant substrate for a heteroepitaxial structure and method for making same App 20060030087 - Akatsu; Takeshi	2006-02-09
Thermal treatment of a semiconductor layer App 20060014363 - Daval; Nicolas ; et al.	2006-01-19
Method for manufacturing a multilayer semiconductor structure that includes an irregular layer Grant 6,982,210 - Ghyselen , et al. January 3, 2	2006-01-03
Atomic implantation and thermal treatment of a semiconductor layer App 20050245049 - Akatsu, Takeshi ; et al.	2005-11-03
Methods for thermally treating a semiconductor layer App 20050196936 - Daval, Nicolas ; et al.	2005-09-08
Methods for forming a semiconductor structure App 20050196937 - Daval, Nicolas ; et al.	2005-09-08
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof App 20050189323 - Ghyselen, Bruno ; et al.	2005-09-01
Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer App 20050167002 - Ghyselen, Bruno ; et al.	2005-08-04
Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer App 20050170611 - Ghyselen, Bruno ; et al.	2005-08-04
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof App 20050150447 - Ghyselen, Bruno ; et al.	2005-07-14
Method of fabrication of a substrate for an epitaxial growth App 20050066886 - Akatsu, Takeshi ; et al.	2005-03-31
Method for manufacturing a multilayer semiconductor structure that includes an irregular layer App 20050009296 - Ghyselen, Bruno ; et al.	2005-01-13
Method for implanting atomic species through an uneven surface of a semiconductor layer App 20050009348 - Ghyselen, Bruno ; et al.	2005-01-13
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom App 20040152284 - Ghyselen, Bruno ; et al.	2004-08-05
Compliant substrate for a heteroepitaxial structure and method for making same App 20040140479 - Akatsu, Takeshi	2004-07-22
Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means App 20040110378 - Ghyselen, Bruno ; et al.	2004-06-10
Wafer with a relaxed useful layer and method of forming the wafer App 20040067622 - Akatsu, Takeshi ; et al.	2004-04-08

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