loadpatents
name:-0.022042036056519
name:-0.01625394821167
name:-0.0047280788421631
AHN; Seok Hwan Patent Filings

AHN; Seok Hwan

Patent Applications and Registrations

Patent applications and USPTO patent grants for AHN; Seok Hwan.The latest application filed is for "inductor and method of manufacturing the same".

Company Profile
4.14.19
  • AHN; Seok Hwan - Suwon-si KR
  • Ahn; Seok-Hwan - Yongin-si KR
  • Ahn; Seok-Hwan - Seongnam-si KR
  • Ahn; Seok Hwan - Gyunggi-do N/A KR
  • Ahn; Seok Hwan - Daegu KR
  • Ahn; Seok Hwan - Kyunggi-Do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Inductor And Method Of Manufacturing The Same
App 20200365313 - JANG; Jong Yoon ;   et al.
2020-11-19
Method of manufacturing an inductor
Grant 10,763,031 - Jang , et al. Sep
2020-09-01
Coil electronic component
Grant 10,650,958 - Jo , et al.
2020-05-12
Multilayered substrate and method for manufacturing the same
Grant 10,455,708 - Ahn , et al. Oc
2019-10-22
Printed circuit board with inner layer and outer layers and method of manufacturing the same
Grant 10,356,916 - Kim , et al. July 16, 2
2019-07-16
Embedded board and method of manufacturing the same
Grant 10,098,232 - Lee , et al. October 9, 2
2018-10-09
Printed circuit board and method of manufacturing the same
Grant 10,045,436 - Cho , et al. August 7, 2
2018-08-07
Multi-layered Substrate And Method Of Manufacturing The Same
App 20180070458 - AHN; Seok-Hwan ;   et al.
2018-03-08
Inductor And Method Of Manufacturing The Same
App 20180061555 - JANG; Jong Yoon ;   et al.
2018-03-01
Multilayered substrate and method of manufacturing the same
Grant 9,832,866 - Ahn , et al. November 28, 2
2017-11-28
Coil Electronic Component
App 20170301453 - JO; Dae Hui ;   et al.
2017-10-19
Printed circuit board and manufacturing method thereof
Grant 9,706,644 - Kim , et al. July 11, 2
2017-07-11
Printed Circuit Board And Manufacturing Method Thereof
App 20170055345 - KIM; Sung-Han ;   et al.
2017-02-23
Printed Circuit Board And Method Of Manufacturing The Same
App 20160381791 - KIM; Han ;   et al.
2016-12-29
Multilayered Substrate And Method Of Manufacturing The Same
App 20160381794 - AHN; Seok-Hwan ;   et al.
2016-12-29
Embedded Board And Method Of Manufacturing The Same
App 20160219709 - LEE; Joon-Sung ;   et al.
2016-07-28
Printed Circuit Board And Method Of Manufacturing The Same
App 20150129293 - CHO; Suk Hyeon ;   et al.
2015-05-14
Printed circuit board having plating pattern buried in via
Grant 8,604,345 - Ahn , et al. December 10, 2
2013-12-10
Printed circuit board manufacturing system and manufacturing method thereof
Grant 8,535,547 - Cho , et al. September 17, 2
2013-09-17
Method of manufacturing a printed circuit board
Grant 8,215,011 - Ahn , et al. July 10, 2
2012-07-10
Printed Circuit Board Having Plating Pattern Buried In Via
App 20120111609 - AHN; Seok Hwan ;   et al.
2012-05-10
Ultrasonic Aroma Humidifier Capable Of Facilitating Cleaning
App 20110156288 - Ahn; Seok Hwan
2011-06-30
Printed circuit board manufacturing system
App 20110138616 - Cho; Chung-Woo ;   et al.
2011-06-16
Printed Circuit Board And Method Of Manufacturing The Same
App 20100270067 - CHOI; Jin-Won ;   et al.
2010-10-28
Wafer packaging method
Grant 7,736,952 - Cho , et al. June 15, 2
2010-06-15
Printed circuit board having plating pattern buried in via and method of manufacturing the same
App 20100139960 - Ahn; Seok Hwan ;   et al.
2010-06-10
Method for manufacturing package on package with cavity
App 20100006446 - Kim; Chi-Seong ;   et al.
2010-01-14
Wafer packaging method
App 20090087950 - Cho; Soon-Jin ;   et al.
2009-04-02
Printed circuit board manufacturing system and manufacturing method thereof
App 20090026169 - Cho; Chung-Woo ;   et al.
2009-01-29
Printed circuit board having inner via hole and manufacturing method thereof
App 20070199735 - Kim; Chi-Seong ;   et al.
2007-08-30
Parallel multilayer printed circuit board having interlayer conductivity due to via ports and method of fabricating same
App 20060121255 - Nam; Chang Hyun ;   et al.
2006-06-08

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