Agraharam; Sairam

Patent Applications and Registrations

Patent applications and USPTO patent grants for Agraharam; Sairam.The latest application filed is for "microelectronic assemblies including bridges".

Company Profile

10.39.63

Agraharam; Sairam - Chandler AZ US
Agraharam; Sairam - Phoenix AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microelectronic Assemblies Including Bridges App 20220270976 - Sun; Xiaoxuan ; et al.	2022-08-25
Multi-chip Packaging App 20220231007 - SANKMAN; Robert L. ; et al.	2022-07-21
Microelectronic Structures Including Bridges App 20220199480 - Karhade; Omkar G. ; et al.	2022-06-23
Novel Lga Architecture For Improving Reliability Performance Of Metal Defined Pads App 20220199503 - DUBEY; Manish ; et al.	2022-06-23
Multi-chip packaging Grant 11,348,911 - Sankman , et al. May 31, 2	2022-05-31
Multi-chip Packaging App 20220157803 - SANKMAN; Robert L. ; et al.	2022-05-19
Singulation Of Microelectronic Components With Direct Bonding Interfaces App 20220102305 - Krishnatreya; Bhaskar Jyoti ; et al.	2022-03-31
Microelectronic Structures Including Bridges App 20210391273 - Dubey; Manish ; et al.	2021-12-16
Warpage Control For Microelectronics Packages App 20210391281 - LI; ERIC J. ; et al.	2021-12-16
Microelectronic Structures Including Bridges App 20210391295 - Karhade; Omkar G. ; et al.	2021-12-16
Open Cavity Bridge Power Delivery Architectures And Processes App 20210305133 - KARHADE; Omkar ; et al.	2021-09-30
Open Cavity Bridge Co-planar Placement Architectures And Processes App 20210305132 - KARHADE; Omkar ; et al.	2021-09-30
Warpage control for microelectronics packages Grant 11,114,388 - Li , et al. September 7, 2	2021-09-07
Metal-free Frame Design For Silicon Bridges For Semiconductor Packages App 20210125942 - KIM; Dae-Woo ; et al.	2021-04-29
Wafer Level Passive Heat Spreader Interposer To Enable Improved Thermal Solution For Stacked Dies In Multi-chips Package And Warpage Control App 20210057381 - BRUN; Xavier F. ; et al.	2021-02-25
Metal-free frame design for silicon bridges for semiconductor packages Grant 10,916,514 - Kim , et al. February 9, 2	2021-02-09
Multi-chip Packaging App 20200395352 - Sankman; Robert L. ; et al.	2020-12-17
Multi-chip packaging Grant 10,700,051 - Sankman , et al.	2020-06-30
Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging Grant 10,607,909 - Muthur Srinath , et al.	2020-03-31
Metal-free Frame Design For Silicon Bridges For Semiconductor Packages App 20200013734 - KIM; Dae-Woo ; et al.	2020-01-09
Multi-chip Packaging App 20190371778 - Sankman; Robert L. ; et al.	2019-12-05
Metal-free frame design for silicon bridges for semiconductor packages Grant 10,461,047 - Kim , et al. Oc	2019-10-29
Non-rectangular Electronic Device Components App 20190304931 - Malatkar; Pramod ; et al.	2019-10-03
Warpage Control For Microelectronics Packages App 20190259713 - LI; ERIC J. ; et al.	2019-08-22
Warpage control for microelectronics packages Grant 10,256,198 - Li , et al.	2019-04-09
Systems, Methods, And Apparatuses For Implementing A Thermal Solution For 3d Packaging App 20190043772 - MUTHUR SRINATH; Purushotham Kaushik ; et al.	2019-02-07
Interconnect structures with polymer core Grant 10,128,225 - Razdan , et al. November 13, 2	2018-11-13
Non-rectangular electronic device components Grant 10,090,259 - Malatkar , et al. October 2, 2	2018-10-02
Warpage Control For Microelectronics Packages App 20180277492 - LI; ERIC J. ; et al.	2018-09-27
Metal-free Frame Design For Silicon Bridges For Semiconductor Packages App 20180226364 - KIM; Dae-Woo ; et al.	2018-08-09
Interconnect Structures With Polymer Core App 20170229438 - Razdan; Sandeep ; et al.	2017-08-10
Non-Rectangular Electronic Device Components App 20170186705 - Malatkar; Pramod ; et al.	2017-06-29
Interconnect structures with polymer core Grant 9,613,934 - Razdan , et al. April 4, 2	2017-04-04
Electronic package with narrow-factor via including finish layer Grant 9,603,247 - Swaminathan , et al. March 21, 2	2017-03-21
Flexible computing fabric Grant 9,526,285 - Aleksov , et al. December 27, 2	2016-12-27
3D integrated circuit package with window interposer Grant 9,391,013 - Mallik , et al. July 12, 2	2016-07-12
Wearable Imaging Sensor With Wireless Remote Communications App 20160183604 - Pillarisetty; Ravi ; et al.	2016-06-30
Wearable imaging sensor for communications Grant 9,374,509 - Pillarisetty , et al. June 21, 2	2016-06-21
Integrated circuit package with spatially varied solder resist opening dimension Grant 9,312,237 - Zheng , et al. April 12, 2	2016-04-12
Electronic Package With Narrow-factor Via Including Finish Layer App 20160044786 - Swaminathan; Rajasekaran ; et al.	2016-02-11
3d Integrated Circuit Package With Window Interposer App 20150332994 - MALLIK; Debendra ; et al.	2015-11-19
3D integrated circuit package with window interposer Grant 9,129,958 - Mallik , et al. September 8, 2	2015-09-08
Interconnect Structures With Polymer Core App 20150162313 - Razdan; Sandeep ; et al.	2015-06-11
Method to increase I/O density and reduce layer counts in BBUL packages Grant 9,041,207 - Raorane , et al. May 26, 2	2015-05-26
Integrated Circuit Package With Spatially Varied Solder Resist Opening Dimension App 20150108204 - Zheng; Tieyu ; et al.	2015-04-23
Interconnect structures with polymer core Grant 8,987,918 - Razdan , et al. March 24, 2	2015-03-24
Solution to deal with die warpage during 3D die-to-die stacking Grant 8,970,051 - Shi , et al. March 3, 2	2015-03-03
Integrated circuit package with spatially varied solder resist opening dimension Grant 8,952,532 - Zheng , et al. February 10, 2	2015-02-10
Passivation layer for flexible display Grant 8,941,128 - Pillarisetty , et al. January 27, 2	2015-01-27
Solution To Deal With Die Warpage During 3d Die-to-die Stacking App 20150001740 - SHI; Hualiang ; et al.	2015-01-01
Method To Increase I/o Density And Reduce Layer Counts In Bbul Packages App 20150001730 - RAORANE; Digvijay A. ; et al.	2015-01-01
Die Connections Using Different Underfill Types For Different Regions App 20150001736 - Shi; Hualiang ; et al.	2015-01-01
Integrated Circuit Package With Spatially Varied Solder Resist Opening Dimension App 20140332956 - ZHENG; Tieyu ; et al.	2014-11-13
Interconnect Structures With Polymer Core App 20140264910 - Razdan; Sandeep ; et al.	2014-09-18
Magnetic Contacts For Electronics Applications App 20140205851 - MAHAJAN; Ravindranath V. ; et al.	2014-07-24
3d Integrated Circuit Package With Window Interposer App 20140191419 - Mallik; Debendra ; et al.	2014-07-10
Flexible Computing Fabric App 20140165269 - ALEKSOV; ALEKSANDAR ; et al.	2014-06-19
Wearable Imaging Sensor For Communications App 20140168355 - Pillarisetty; Ravi ; et al.	2014-06-19
Enhancing shock resistance in semiconductor packages Grant 7,718,904 - Manepalli , et al. May 18, 2	2010-05-18
Methods of forming stepped bumps and structures formed thereby Grant 7,659,192 - Yeohi , et al. February 9, 2	2010-02-09
C4 joint reliability Grant 7,656,035 - Agraharam , et al. February 2, 2	2010-02-02
Integrated circuit devices including compliant material under bond pads and methods of fabrication Grant 7,535,114 - Agraharam , et al. May 19, 2	2009-05-19
C4 Joint Reliability App 20090115057 - Agraharam; Sairam ; et al.	2009-05-07
C4 joint reliability Grant 7,517,787 - Agraharam , et al. April 14, 2	2009-04-14
Packaged Integrated Circuit And Method Of Forming Thereof App 20090065931 - Rangaraj; Sudarshan V. ; et al.	2009-03-12
Interconnect Joint App 20090020869 - Xue; Qing ; et al.	2009-01-22
Integrated circuit packages with reduced stress on die and associated methods Grant 7,465,651 - Agraharam , et al. December 16, 2	2008-12-16
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 7,432,532 - Chrysler , et al. October 7, 2	2008-10-07
Methods Of Forming Stepped Bumps And Structures Formed Thereby App 20080157392 - Yeohi; Andrew ; et al.	2008-07-03
Methods of forming stepped bumps and structures formed thereby App 20080157356 - Yeohi; Andrew ; et al.	2008-07-03
Integrated circuit devices including compliant material under bond pads and methods of fabrication App 20070132086 - Agraharam; Sairam ; et al.	2007-06-14
Enhancing shock resistance in semiconductor packages App 20070111375 - Manepalli; Rahul N. ; et al.	2007-05-17
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 7,170,098 - Chrysler , et al. January 30, 2	2007-01-30
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20060270135 - Chrysler; Gregory M. ; et al.	2006-11-30
C4 joint reliability App 20060214292 - Agraharam; Sairam ; et al.	2006-09-28
Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systems Grant 6,989,586 - Agraharam , et al. January 24, 2	2006-01-24
Integrated circuit packages with reduced stress on die and associated methods App 20050266613 - Agraharam, Sairam ; et al.	2005-12-01
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 6,921,706 - Chrysler , et al. July 26, 2	2005-07-26
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20050130362 - Chrysler, Gregory M. ; et al.	2005-06-16
Integrated circuit package with reduced stress on die and associated methods App 20040188813 - Agraharam, Sairam ; et al.	2004-09-30
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20040157386 - Chrysler, Gregory M. ; et al.	2004-08-12
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Grant 6,770,966 - Chrysler , et al. August 3, 2	2004-08-03
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat App 20030025198 - Chrysler, Gregory M. ; et al.	2003-02-06