Abbott; Donald C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Abbott; Donald C..The latest application filed is for "selective planishing method for making a semiconductor device".

Company Profile

0.72.68

Abbott; Donald C. - Chatley MA
Abbott; Donald C. - Norton MA
Abbott; Donald C. - Chartley MA
Abbott; Donald C - Norton MA US
Abbott; Donald C - Chartley MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Selective planishing method for making a semiconductor device Grant 10,438,816 - Abbott O	2019-10-08
Selective Planishing Method For Making A Semiconductor Device App 20180204739 - Abbott; Donald C.	2018-07-19
Selective planishing method for making a semiconductor device Grant 9,972,506 - Abbott May 15, 2	2018-05-15
Mask-Less Selective Plating of Leadframe App 20170051388 - Abbott; Donald C. ; et al.	2017-02-23
Semiconductor package having etched foil capacitor integrated into leadframe Grant 9,373,572 - Howard , et al. June 21, 2	2016-06-21
Semiconductor Package Having Etched Foil Capacitor Integrated Into Leadframe App 20160035655 - Howard; Gregory E. ; et al.	2016-02-04
Semiconductor package having etched foil capacitor integrated into leadframe Grant 9,165,873 - Howard , et al. October 20, 2	2015-10-20
Semiconductor package having etched foil capacitor integrated into leadframe Grant 9,142,496 - Howard , et al. September 22, 2	2015-09-22
Selective Planishing Method For Making A Semiconductor Device App 20150221526 - Abbott; Donald C.	2015-08-06
Copper leadframe finish for copper wire bonding Grant 9,059,185 - Abbott June 16, 2	2015-06-16
Selective leadframe planishing Grant 9,006,038 - Abbott April 14, 2	2015-04-14
Semiconductor device with selective planished leadframe Grant 8,963,300 - Abbott February 24, 2	2015-02-24
Copper Leadframe Finish for Copper Wire Bonding App 20150014829 - Abbott; Donald C.	2015-01-15
Integrated Circuit Package And Method Of Manufacture App 20140175626 - Abbott; Donald C. ; et al.	2014-06-26
System for No-Lead Integrated Circuit Packages Without Tape Frame App 20140138805 - Abbott; Donald C.	2014-05-22
Selective Leadframe Planishing App 20140048920 - Abbott; Donald C.	2014-02-20
Leadframe having selective planishing Grant 8,587,099 - Abbott November 19, 2	2013-11-19
Selective Leadframe Planishing App 20130298393 - Abbott; Donald C.	2013-11-14
Leadframe Having Selective Planishing App 20130292811 - Abbott; Donald C.	2013-11-07
Singulation and strip testing of no-lead integrated circuit packages without tape frame Grant 8,574,931 - Abbott November 5, 2	2013-11-05
Metal plugged substrates with no adhesive between metal and polyimide Grant 8,471,155 - Abbott , et al. June 25, 2	2013-06-25
Stacked IC Devices Comprising a Workpiece Solder Connected to the TSV App 20130099384 - Simmons-Matthews; Margaret R. ; et al.	2013-04-25
Integrated Circuit Package And Method App 20130082407 - Abbott; Donald C. ; et al.	2013-04-04
Mask-Less Selective Plating of Leadframes App 20130025745 - Abbott; Donald C. ; et al.	2013-01-31
Singulation and Strip Testing of No-Lead Integrated Circuit Packages Without Tape Frame App 20120252142 - Abbott; Donald C.	2012-10-04
Thermally improved semiconductor QFN/SON package Grant 8,242,614 - Abbott August 14, 2	2012-08-14
IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV Grant 8,227,295 - Simmons-Matthews , et al. July 24, 2	2012-07-24
Semiconductor package having buss-less substrate Grant 8,227,298 - Abbott July 24, 2	2012-07-24
Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds Grant 8,158,460 - Abbott April 17, 2	2012-04-17
Low cost lead-free preplated leadframe having improved adhesion and solderability Grant 8,138,026 - Abbott March 20, 2	2012-03-20
Metallic Leadframes Having Laser-Treated Surfaces for Improved Adhesion to Polymeric Compounds App 20120009739 - Abbott; Donald C.	2012-01-12
Metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds Grant 8,044,495 - Abbott October 25, 2	2011-10-25
Aluminum leadframes for semiconductor QFN/SON devices Grant 8,039,317 - Abbott October 18, 2	2011-10-18
Systems and methods for post-circuitization assembly Grant 8,039,309 - Murtuza , et al. October 18, 2	2011-10-18
Semiconductor Package Having Buss-Less Substrate App 20110165732 - Abbott; Donald C.	2011-07-07
Metal Plugged Substrates with No Adhesive Between Metal and Polyimide App 20110147934 - Abbott; Donald C. ; et al.	2011-06-23
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication Grant 7,939,378 - Abbott , et al. May 10, 2	2011-05-10
Semiconductor package having buss-less substrate Grant 7,928,574 - Abbott April 19, 2	2011-04-19
Method of fabricating a semiconductor device Grant 7,918,018 - Abbott , et al. April 5, 2	2011-04-05
Low Cost Lead-Free Preplated Leadframe Having Improved Adhesion and Solderability App 20110076806 - Abbott; Donald C.	2011-03-31
Thermally Improved Semiconductor QFN/SON Package App 20110068443 - Abbott; Donald C.	2011-03-24
Low cost lead-free preplated leadframe having improved adhesion and solderability Grant 7,872,336 - Abbott January 18, 2	2011-01-18
Thermally improved semiconductor QFN/SON package Grant 7,863,103 - Abbott January 4, 2	2011-01-04
Metallic Leadframes Having Laser-Treated Surfaces for Improved Adhesion to Polymeric Compounds App 20100320579 - ABBOTT; Donald C	2010-12-23
Semiconductor device having substrate with differentially plated copper and selective solder Grant 7,851,928 - Gallegos , et al. December 14, 2	2010-12-14
Method for fabricating a leadframe Grant 7,788,800 - Abbott September 7, 2	2010-09-07
Ic Die Having Tsv And Wafer Level Underfill And Stacked Ic Devices Comprising A Workpiece Solder Connected To The Tsv App 20100096738 - Simmons-Matthews; Margaret R. ; et al.	2010-04-22
Thermally Improved Semiconductor Qfn/son Package App 20100096734 - ABBOTT; DONALD C.	2010-04-22
Aluminum Leadframes for Semiconductor QFN/SON Devices App 20100009500 - ABBOTT; Donald C.	2010-01-14
Semiconductor Device Having Substrate With Differentially Plated Copper And Selective Solder App 20090302463 - GALLEGOS; BERNARDO ; et al.	2009-12-10
Aluminum leadframes for semiconductor QFN/SON devices Grant 7,608,916 - Abbott October 27, 2	2009-10-27
Structure and method for bond pads of copper-metallized integrated circuits Grant 7,535,104 - Test , et al. May 19, 2	2009-05-19
Low cost lead-free preplated leadframe having improved adhesion and solderability Grant 7,507,605 - Abbott March 24, 2	2009-03-24
Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking Grant 7,504,716 - Abbott March 17, 2	2009-03-17
Semiconductor Package Having Buss-Less Substrate App 20090051036 - ABBOTT; DONALD C.	2009-02-26
Metal plugged substrates with no adhesive between metal and polyimide App 20080307644 - Abbott; Donald C. ; et al.	2008-12-18
Systems And Methods For Post-circuitization Assembly App 20080280394 - Murtuza; Masood ; et al.	2008-11-13
Copper-metallized Integrated Circuits Having Electroless Thick Copper Bond Pads App 20080274294 - Test; Howard R. ; et al.	2008-11-06
Low Cost Lead-free Preplated Leadframe Having Improved Adhesion And Solderability App 20080224290 - ABBOTT; DONALD C.	2008-09-18
Copper-metallized integrated circuits having electroless thick copper bond pads Grant 7,413,974 - Test , et al. August 19, 2	2008-08-19
Semiconductor assembly having substrate with electroplated contact pads Grant 7,411,303 - Abbott August 12, 2	2008-08-12
Low cost method to produce high volume lead frames Grant 7,368,807 - Abbott May 6, 2	2008-05-06
Semiconductor device having post-mold nickel/palladium/gold plated leads Grant 7,368,328 - Abbott , et al. May 6, 2	2008-05-06
Leadframes for Improved Moisture Reliability of Semiconductor Devices App 20080098594 - Abbott; Donald C.	2008-05-01
Semiconductor Package Having Improved Adhesion and Solderability App 20080012101 - Zuniga-Ortiz; Edgar R. ; et al.	2008-01-17
Leadframes for improved moisture reliability of semiconductor devices Grant 7,309,909 - Abbott December 18, 2	2007-12-18
Semiconductor Device Having Post-Mold Nickel/Palladium/Gold Plated Leads App 20070269932 - Abbott; Donald C. ; et al.	2007-11-22
Palladium-Spot Leadframes for High Adhesion Semiconductor Devices and Method of Fabrication App 20070243665 - Abbott; Donald C. ; et al.	2007-10-18
Semiconductor device having post-mold nickel/palladium/gold plated leads Grant 7,268,415 - Abbott , et al. September 11, 2	2007-09-11
Aluminum leadframes for semiconductor QFN/SON devices App 20070176267 - Abbott; Donald C.	2007-08-02
Structure and Method for Bond Pads of Copper-Metallized Integrated Circuits App 20070176301 - Test; Howard R. ; et al.	2007-08-02
Low Cost Method to Produce High Volume Lead Frames App 20070164405 - Abbott; Donald C.	2007-07-19
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication Grant 7,245,006 - Abbott , et al. July 17, 2	2007-07-17
Semiconductor Assembly Having Substrate with Electroplated Contact Pads App 20070111516 - Abbott; Donald C.	2007-05-17
Structure and method for bond pads of copper-metallized integrated circuits Grant 7,217,656 - Test , et al. May 15, 2	2007-05-15
Leadframes for improved moisture reliability of semiconductor devices App 20070090497 - Abbott; Donald C.	2007-04-26
Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking App 20070090524 - Abbott; Donald C.	2007-04-26
Low cost method to produce high volume lead frames Grant 7,192,809 - Abbott March 20, 2	2007-03-20
Semiconductor assembly having substrate with electroplated contact pads Grant 7,179,738 - Abbott February 20, 2	2007-02-20
Copper-metallized integrated circuits having electroless thick copper bond pads App 20070031697 - Test; Haward R. ; et al.	2007-02-08
Gold spot plated leadframes for semiconductor devices and method of fabrication Grant 7,148,085 - Abbott , et al. December 12, 2	2006-12-12
Structure and method for bond pads of copper-metallized integrated circuits App 20060267203 - Test; Howard R. ; et al.	2006-11-30
Low cost method to produce high volume lead frames App 20060189037 - Abbott; Donald C.	2006-08-24
Low cost lead-free preplated leadframe having improved adhesion and solderability App 20060145311 - Abbott; Donald C.	2006-07-06
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin Grant 7,064,008 - Abbott , et al. June 20, 2	2006-06-20
Semiconductor package having improved adhesion and solderability App 20060125062 - Zuniga-Ortiz; Edgar R. ; et al.	2006-06-15
Semiconductor device having post-mold nickel/palladium/gold plated leads App 20060097363 - Abbott; Donald C. ; et al.	2006-05-11
Method for fabricating preplated nickel/palladium and tin leadframes Grant 6,995,042 - Abbott February 7, 2	2006-02-07
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication App 20060001132 - Abbott; Donald C. ; et al.	2006-01-05
Semiconductor assembly having substrate with electroplated contact pads App 20050280112 - Abbott, Donald C.	2005-12-22
Leadframes for high adhesion semiconductor devices and method of fabrication Grant 6,953,986 - Abbott , et al. October 11, 2	2005-10-11
Method of fabricating flexible circuits for integrated circuit interconnections Grant 6,915,566 - Abbott , et al. July 12, 2	2005-07-12
Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor Grant 6,849,806 - Abbott , et al. February 1, 2	2005-02-01
Preplating of semiconductor small outline no-lead leadframes Grant 6,838,757 - Abbott , et al. January 4, 2	2005-01-04
Semiconductor device with double nickel-plated leadframe Grant 6,828,660 - Abbott December 7, 2	2004-12-07
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin App 20040183165 - Abbott, Donald C. ; et al.	2004-09-23
Preplated leadframe without precious metal App 20040183166 - Abbott, Donald C.	2004-09-23
Method for fabricating preplated nickel/palladium and tin leadframes App 20040155321 - Abbott, Donald C.	2004-08-12
Semiconductor device with double nickel-plated leadframe App 20040140539 - Abbott, Donald C.	2004-07-22
Gold spot plated leadframes for semiconductor devices and method of fabrication App 20040113241 - Abbott, Donald C. ; et al.	2004-06-17
Fine pitch lead frame Grant 6,724,070 - Fritzsche , et al. April 20, 2	2004-04-20
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin Grant 6,713,852 - Abbott , et al. March 30, 2	2004-03-30
Method for fabricating preplated nickel/palladium and tin leadframes Grant 6,706,561 - Abbott March 16, 2	2004-03-16
Integrated circuit with bonding layer over active circuitry Grant 6,683,380 - Efland , et al. January 27, 2	2004-01-27
Preplated stamped small outline no-lead leadframes having etched profiles App 20030178707 - Abbott, Donald C.	2003-09-25
Method for fabricating preplated nickel/palladium and tin leadframes App 20030153129 - Abbott, Donald C.	2003-08-14
Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin App 20030146497 - Abbott, Donald C. ; et al.	2003-08-07
Pre-finished leadframe for semiconductor devices and method fo fabrication App 20030137032 - Abbott, Donald C.	2003-07-24
Thin tin preplated semiconductor leadframes Grant 6,583,500 - Abbott , et al. June 24, 2	2003-06-24
Electrical apparatus having resistance to atmospheric effects and method of manufacture therefor App 20030094689 - Abbott, Donald C. ; et al.	2003-05-22
Pre-finished leadframe for semiconductor devices and method of fabrication Grant 6,545,342 - Abbott April 8, 2	2003-04-08
Semiconductor leadframes plated with lead-free solder and minimum palladium Grant 6,545,344 - Abbott April 8, 2	2003-04-08
Integrated circuit with bonding layer over active circuitry App 20030036256 - Efland, Taylor R. ; et al.	2003-02-20
Semiconductor Circuit Assembly Having A Plated Leadframe Including Gold Selectively Covering Areas To Be Soldered App 20030011048 - Abbott, Donald C. ; et al.	2003-01-16
Fine pitch lead frame lead and method App 20020153597 - Fritzsche, Robert M. ; et al.	2002-10-24
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication App 20020070434 - Abbott, Donald C. ; et al.	2002-06-13
Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication Grant 6,376,901 - Abbott April 23, 2	2002-04-23
Flex circuit substrate for an integrated circuit package Grant 6,365,974 - Abbott , et al. April 2, 2	2002-04-02
Preplating of semiconductor small outline no-lead leadframes App 20020003292 - Abbott, Donald C. ; et al.	2002-01-10
Composite connection structure and method of manufacturing Grant 6,337,445 - Abbott , et al. January 8, 2	2002-01-08
Semiconductor leadframes plated with lead-free solder and minimum palladium App 20010054750 - Abbott, Donald C.	2001-12-27
Double sided flexible circuit for integrated circuit packages and method of manufacture App 20010047880 - Abbott, Donald C. ; et al.	2001-12-06
Leadframes with selective palladium plating Grant 6,194,777 - Abbott , et al. February 27, 2	2001-02-27
Integrated circuit with bonding layer over active circuitry Grant 6,144,100 - Shen , et al. November 7, 2	2000-11-07
Method to manufacture ball grid arrays with excellent solder ball adhesion for semiconductor packaging and the array Grant 6,080,494 - Abbott June 27, 2	2000-06-27
Column grid array for semiconductor packaging and method Grant 5,989,935 - Abbott November 23, 1	1999-11-23
Silver spot/palladium plate lead frame finish Grant 5,710,456 - Abbott , et al. January 20, 1	1998-01-20
Lead frame structure for IC devices with strengthened encapsulation adhesion Grant 5,633,528 - Abbott , et al. May 27, 1	1997-05-27
Silver spot/palladium plate lead frame finish Grant 5,561,320 - Abbott , et al. October 1, 1	1996-10-01
Silver spot/palladium plate lead frame finish Grant 5,384,155 - Abbott , et al. January 24, 1	1995-01-24
Semiconductor lead frame lead stabilization Grant 5,352,633 - Abbott October 4, 1	1994-10-04
Stabilizer/spacer for semiconductor device lead frames Grant 5,268,331 - Abbott December 7, 1	1993-12-07
Method of making a thin film solar cell Grant 5,264,376 - Abbott , et al. November 23, 1	1993-11-23