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Patent applications and USPTO patent grants for Abas; Emmanuel Chua.The latest application filed is for "non-permeable substrate carrier for electroplating".
Patent | Date |
---|---|
Non-permeable substrate carrier for electroplating Grant 11,280,019 - Abas , et al. March 22, 2 | 2022-03-22 |
Bowing semiconductor wafers Grant 10,720,351 - Abas | 2020-07-21 |
Gripper for semiconductor devices Grant 10,566,230 - Abas , et al. Feb | 2020-02-18 |
Semiconductor wafer carriers Grant 10,553,466 - Abas , et al. Fe | 2020-02-04 |
Non-permeable Substrate Carrier For Electroplating App 20190301046 - ABAS; Emmanuel Chua ;   et al. | 2019-10-03 |
Bowing Semiconductor Wafers App 20180374730 - Abas; Emmanuel Chua | 2018-12-27 |
Semiconductor Wafer Carriers App 20180337080 - Abas; Emmanuel Chua ;   et al. | 2018-11-22 |
Bowing semiconductor wafers Grant 10,068,787 - Abas September 4, 2 | 2018-09-04 |
Semiconductor wafer carriers Grant 10,020,213 - Abas , et al. July 10, 2 | 2018-07-10 |
Bowing Semiconductor Wafers App 20180190525 - Abas; Emmanuel Chua | 2018-07-05 |
Semiconductor Wafer Carriers App 20180190524 - Abas; Emmanuel Chua ;   et al. | 2018-07-05 |
Gripper For Semiconductor Devices App 20170287766 - Abas; Emmanuel Chua ;   et al. | 2017-10-05 |
Maintainable substrate carrier for electroplating Grant RE46,088 - Chen , et al. August 2, 2 | 2016-08-02 |
Non-permeable Substrate Carrier For Electroplating App 20160108541 - ABAS; Emmanuel Chua ;   et al. | 2016-04-21 |
Non-permeable substrate carrier for electroplating Grant 9,222,193 - Abas , et al. December 29, 2 | 2015-12-29 |
Non-permeable Substrate Carrier For Electroplating App 20140034488 - ABAS; Emmanuel Chua ;   et al. | 2014-02-06 |
Non-permeable substrate carrier for electroplating Grant 8,317,987 - Abas , et al. November 27, 2 | 2012-11-27 |
Maintainable substrate carrier for electroplating Grant 8,221,601 - Chen , et al. July 17, 2 | 2012-07-17 |
Maintainable substrate carrier for electroplating App 20120073976 - CHEN; Chen-An ;   et al. | 2012-03-29 |
Non-Permeable Substrate Carrier For Electroplating App 20120073974 - ABAS; Emmanuel Chua ;   et al. | 2012-03-29 |
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