The Institute of Electrical and Electronics Engineers, Incorporated
Application Filed: 2023-04-19
Trademark Application Details
The mark consists of EPS in a cirle stylized with the letters IEEE ELECTRONICS PACKAGING SOCIETY.
Mark For: EPS IEEE ELECTRONICS PACKAGING SOCIETY™ trademark registration is intended to cover the categories of educational services, namely, arranging and conducting conferences and symposia in the fields of electrical and electronics engineering, all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components; addressing signal and power delivery, material aspects, thermal and structural design and reliability, and distribution of training material in connection therewith.
Status
2023-04-22 UTC
LIVE APPLICATION Awaiting Examination
The trademark application has been accepted by the Office (has met the minimum filing requirements) and has not yet been assigned to an examiner.
Circles comprised of animals; Circles comprised of geometric figures; Circles comprised of humans; Circles comprised of letters or numerals; Circles comprised of plants; Circles comprised of punctuation; Letters, numerals, punctuation, geometric figures, objects, humans, plants or animals comprising a circle
ANTA CISSÃ-GREEN 3 PARK AVENUE NEW YORK, NY 10016
Good, Services, and Codes
International Codes:
41
U.S. Codes:
100,101,107
Type Code
Type
GS0411
Educational services, namely, arranging and conducting conferences and symposia in the fields of electrical and electronics engineering, all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components; addressing signal and power delivery, material aspects, thermal and structural design and reliability, and distribution of training material in connection therewith
GS0411
Educational services, namely, arranging and conducting conferences and symposia in the fields of electrical and electronics engineering, all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components, and addressing signal and power delivery, material aspects, thermal and structural design and reliability, and distribution of training material in connection therewith
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