Mark For: PULSUS™ trademark registration is intended to cover the categories of
Research | OneLook Acronym Finder |
Serial Number | 97721066 |
Mark Literal Elements | PULSUS |
Mark Drawing Type | 4 - STANDARD CHARACTER MARK |
Mark Type | TRADEMARK |
Register | PRINCIPAL |
Current Location | TMEG LAW OFFICE 103 - EXAMINING ATTORNEY ASSIGNED 2023-01-24 |
Basis | 1(b) |
Class Status | ACTIVE |
Primary US Classes |
|
Primary International Class |
|
Filed Use | No |
Current Use | No |
Intent To Use | Yes |
Filed ITU | Yes |
44D Filed | No |
44E Current | No |
66A Current | No |
Current Basis | No |
No Basis | No |
Attorney Name | Duy Thai |
2022-12-16 | Application Filed |
2022-12-20 | Location: NEW APPLICATION PROCESSING |
2022-12-20 | Status: Live/Pending |
2022-12-20 | Transaction Date |
2023-01-24 | Location: TMEG LAW OFFICE 103 - EXAMINING ATTORNEY ASSIGNED |
2023-04-14 | Status: Applicant's response to a non-final Office action has been entered. The application is being returned to the examining attorney |
Party: | Lam Research Corporation |
Address | 4650 Cushing Parkway Fremont, CALIFORNIA UNITED STATES 94538 |
Legal Entity Type | Corporation |
Legal Entity State | DELAWARE |
Application | 2022-12-16 | |
Drawing | 2022-12-16 | |
Non-Final Action | 2023-01-24 | |
Change Address or Representation Form | 2023-04-13 | |
Response to Office Action | 2023-04-13 | |
Amendment and Mail Process Complete | 2023-04-15 |
IC 007. US 013 019 021 023 024 031 034 035. G & S: Semiconductor manufacturing machines; Semiconductor substrates manufacturing machines; Semiconductor wafer processing equipment; Semiconductor wafer processing machines; Semiconductor manufacturing machines featuring pulsed laser deposition; Semiconductor substrates manufacturing machines featuring pulsed laser deposition; Semiconductor wafer processing equipment featuring pulsed laser deposition; Semiconductor wafer processing machines featuring pulsed laser deposition; replacement parts and fittings for all of the aforementioned goods
International Codes: | 7 |
U.S. Codes: | 013,019,021,023,024,031,034,035 |
Type Code | Type |
---|---|
GS0071 | Semiconductor manufacturing machines; Semiconductor substrates manufacturing machines; Semiconductor wafer processing equipment; Semiconductor wafer processing machines; Semiconductor manufacturing machines featuring pulsed laser deposition; Semiconductor substrates manufacturing machines featuring pulsed laser deposition; Semiconductor wafer processing equipment featuring pulsed laser deposition; Semiconductor wafer processing machines featuring pulsed laser deposition; Deposition chamber featuring pulsed laser deposition; Vacuum chamber featuring pulsed laser deposition and structural parts therefor; replacement parts and fittings for all of the aforementioned goods |
GS0071 | Semiconductor manufacturing machines; Semiconductor substrates manufacturing machines; Semiconductor wafer processing equipment; Semiconductor wafer processing machines; Semiconductor manufacturing machines featuring pulsed laser deposition; Semiconductor substrates manufacturing machines featuring pulsed laser deposition; Semiconductor wafer processing equipment featuring pulsed laser deposition; Semiconductor wafer processing machines featuring pulsed laser deposition; replacement parts and fittings for all of the aforementioned goods |
Description | Date | Proceeding Number |
---|---|---|
TEAS/EMAIL CORRESPONDENCE ENTERED | 2023-04-14 | 88889 |
TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED | 2023-04-13 | |
TEAS RESPONSE TO OFFICE ACTION RECEIVED | 2023-04-13 | |
TEAS CHANGE OF CORRESPONDENCE RECEIVED | 2023-04-13 | |
CORRESPONDENCE RECEIVED IN LAW OFFICE | 2023-04-13 | 88889 |
ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED | 2023-04-13 | |
NOTIFICATION OF NON-FINAL ACTION E-MAILED | 2023-01-24 | |
NON-FINAL ACTION WRITTEN | 2023-01-24 | 83190 |
NON-FINAL ACTION E-MAILED | 2023-01-24 | |
ASSIGNED TO EXAMINER | 2023-01-23 | 83190 |
NEW APPLICATION OFFICE SUPPLIED DATA ENTERED | 2023-01-13 | |
NEW APPLICATION ENTERED IN TRAM | 2022-12-20 | |
NEW APPLICATION ENTERED | 2022-12-20 |
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