Mark For: LASC™ trademark registration is intended to cover the categories of
Research |
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Serial Number | 97521849 |
Mark Literal Elements | LASC |
Mark Drawing Type | 4 - STANDARD CHARACTER MARK |
Mark Type | Service Mark |
Current Location | NEW APPLICATION PROCESSING 2022-07-30 |
Basis | 1(b) 44(d) |
Class Status | ACTIVE |
Primary US Classes |
|
Primary International Class |
|
Filed Use | No |
Current Use | No |
Intent To Use | Yes |
Filed ITU | Yes |
44D Filed | Yes |
44E Current | No |
66A Current | No |
Current Basis | No |
No Basis | No |
Attorney Name | Joe McKinney Muncy |
Attorney Docket Number | 5958/0175TUS |
2022-07-27 | Application Filed |
2022-07-30 | Location: NEW APPLICATION PROCESSING |
2022-07-30 | Status: Live/Pending |
2022-07-30 | Status: New application will be assigned to an examining attorney approximately 6 months after filing date. |
2022-07-30 | Transaction Date |
Party: | ![]() |
Address | 11F., No.18, Rixing 1st St., Zhubei City, Hsinchu County TAIWAN 302058 |
Legal Entity Type | Limited Company (ltd.) |
Legal Entity State | TAIWAN |
![]() | 2022-07-27 | |
![]() | 2022-07-27 |
International Codes: | 40 |
U.S. Codes: | 100,103,106 |
Type Code | Type |
---|---|
GS0401 | Crystal wafer etching treatment; Integrated circuit etching treatment; Semiconductor sealing processing; Wafer Foundry; Custom manufacture of semiconductors for others; Manufacture and assembly of automotive semiconductors according to customer's specifications and instructions; Manufacturing and assembling services for automotive wafers according to customer's specifications and instructions; Services of manufacturing and assembling semiconductors and integrated circuits according to customer specifications; Manufacturing silicon wafers and integrated circuits according to customer instructions; Assembly services of silicon wafers and integrated circuits; Polishing services for silicon wafers and semiconductors; Assembling integrated circuits, photomasks and electronic or computer chips for others; Foundry services of semiconductors and integrated circuits; Semiconductor and integrated circuit packaging processing; Foundry semiconductor chip cutting and packaging processing services; Wafer etching and dicing processing; Etching processing; Cutting or forming of integrated circuits; Manufacturing and processing of integrated circuits |
GS0401 | Crystal wafer etching treatment; Integrated circuit etching treatment; Semiconductor sealing processing; Wafer Foundry; Custom manufacture of semiconductors for others; Manufacture and assembly of automotive semiconductors according to customer's specifications and instructions; Manufacturing and assembling services for automotive wafers according to customer's specifications and instructions; Services of manufacturing and assembling semiconductors and integrated circuits according to customer specifications; Manufacturing silicon wafers and integrated circuits according to customer instructions; Assembly services of silicon wafers and integrated circuits; Polishing services for silicon wafers and semiconductors; Assembling integrated circuits, photomasks and electronic or computer chips for others; Foundry services of semiconductors and integrated circuits; Semiconductor and integrated circuit packaging processing; Foundry semiconductor chip cutting and packaging processing services; Wafer etching and dicing processing; Etching processing; Cutting or forming of integrated circuits; Manufacturing and processing of integrated circuits |
Description | Date | Proceeding Number |
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NEW APPLICATION ENTERED IN TRAM | 2022-07-30 |
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