PHIX

PhiX B.V.

Application Filed: 2021-12-10
Trademark Application Details
Trademark Logo PHIX

Mark For: PHIX™ trademark registration is intended to cover the categories of photonic chips; integrated circuits, including photonic integrated circuits, PIC's; semiconductor chips; data processing equipment and data carriers; microcontrollers; devices enabling the transfer of data; interfaces for connecting chips; lasers; electric and photonic wires for chips and integrated circuits; sensors, also in the form photonic chips; optical apparatus, devices and instruments; optical chips, circuits and semiconductors; fiber arrays and fibre optic cables; spot size converters, SSC's; parts and components of the aforementioned products.

Status

2021-12-15 UTC
LIVE APPLICATION Awaiting Examination
The trademark application has been accepted by the Office (has met the minimum filing requirements) and has not yet been assigned to an examiner.


Research OneLook Acronym Finder
Serial Number97165829
Mark Literal ElementsPHIX
Mark Drawing Type4 - STANDARD CHARACTER MARK
Mark TypeTrademark, Service Mark
Current LocationNEW APPLICATION PROCESSING 2021-12-14
Basis44(d)
Class StatusACTIVE
Primary US Classes
  • 021: Electrical Apparatus, Machines and Supplies
  • 023: Cutlery, Machinery, Tools and Parts Thereof
  • 026: Measuring and Scientific Appliances
  • 036: Musical Instruments and Supplies
  • 038: Prints and Publications
Primary International Class
  • 009 - Primary Class
  • (Electrical and scientific apparatus) Scientific, nautical, surveying, electric, photographic, cinematographic, optical, weighing, measuring, signaling, checking (supervision), lifesaving and teaching apparatus and instruments; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire-extinguishing apparatus.
Filed UseNo
Current UseNo
Intent To UseNo
Filed ITUNo
44D FiledYes
44E CurrentNo
66A CurrentNo
Current BasisNo
No BasisNo
Domestic RepresentativeScott D. Woldow
Attorney NameScott D. Woldow
Attorney Docket Number034970.003

Timeline

2021-12-10Application Filed
2021-12-14Location: NEW APPLICATION PROCESSING
2021-12-14Status: Live/Pending
2021-12-14Status: New application will be assigned to an examining attorney approximately 6 months after filing date.
2021-12-14Transaction Date

Trademark Parties (Applicants & Owners)

Party: PhiX B.V.
AddressDe Veldmaat 17 Enschede NETHERLANDS 7522-NM
Legal Entity TypeBesloten Vennootschap (b.v.)
Legal Entity StateNETHERLANDS

Documents

Application2021-12-10
Drawing2021-12-10

Attorney of Record

SCOTT D. WOLDOW
SMITH, GAMBRELL & RUSSELL, LLP
1055 THOMAS JEFFERSON ST, NW
SUITE 400
WASHINGTON, DC 20007

Good, Services, and Codes

International Codes:9
U.S. Codes:021,023,026,036,038
International Codes:40
U.S. Codes:100,103,106
International Codes:42
U.S. Codes:100,101
Type CodeType
GS0091Photonic chips; integrated circuits, including photonic integrated circuits, PIC's; semiconductor chips; data processing equipment and data carriers; microcontrollers; devices enabling the transfer of data; interfaces for connecting chips; lasers; electric and photonic wires for chips and integrated circuits; sensors, also in the form photonic chips; optical apparatus, devices and instruments; optical chips, circuits and semiconductors; fiber arrays and fibre optic cables; spot size converters, SSC's; parts and components of the aforementioned products
GS0401Custom assembly of photonic devices and its structural components in specific applications and modules; custom assembly services concerning photonic devices and instruments for and on behalf of third parties; custom photonic manufacturing services in the field of photonic components and devices, particularly integrated circuits, photonic integrated circuits; hybrid multi-chip assembly and integration, namely, custom hybrid multi-chip assembly and heterogenous integration subassembly of photonic chips and multi-chips for others; fiber placement and photonic wire bonding on products of others, namely, custom manufacture of photonics; custom manufacturing of fiber arrays; custom assembling of optical fiber arrays for photonic integrated circuits, PIC's; custom assembly services concerning semiconductors, photonic chips, integrated circuits, and photonic integrated circuits

Trademark Filing History

DescriptionDateProceeding Number
NEW APPLICATION ENTERED IN TRAM2021-12-14

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