Mark For: WELCO™ trademark registration is intended to cover the categories of
Research | OneLook Acronym Finder |
Serial Number | 97068631 |
Mark Literal Elements | WELCO |
Mark Drawing Type | 4 - STANDARD CHARACTER MARK |
Mark Type | Trademark |
Current Location | NEW APPLICATION PROCESSING 2021-10-14 |
Basis | 44(d) |
Class Status | ACTIVE |
Primary US Classes |
|
Primary International Class |
|
Filed Use | No |
Current Use | No |
Intent To Use | No |
Filed ITU | No |
44D Filed | Yes |
44E Current | No |
66A Current | No |
Current Basis | No |
No Basis | No |
Attorney Name | Nathaniel Kramer |
Attorney Docket Number | Bendele 806 |
2021-10-11 | Application Filed |
2021-10-14 | Location: NEW APPLICATION PROCESSING |
2021-10-14 | Status: Live/Pending |
2021-10-14 | Status: New application will be assigned to an examining attorney approximately 6 months after filing date. |
2021-10-14 | Transaction Date |
Party: | Heraeus Deutschland GmbH & Co. KG |
Address | Heraeusstr. 12-14 Hanau GERMANY 63450 |
Legal Entity Type | Gmbh & Co. Kg |
Legal Entity State | GERMANY |
Party: | Heraeus Deutschland GmbH & Co. KG |
Entity Statement | gmbh & co. kg |
Address | Heraeusstr. 12-14 Hanau DE 63450 |
Legal Entity Type | |
Legal Entity State | DE |
Application | MULTI | 2021-10-11 |
Drawing | JPEG | 2021-10-11 |
International Codes: | 1 |
U.S. Codes: | 001,005,006,010,026,046 |
International Codes: | 2 |
U.S. Codes: | 006,011,016 |
International Codes: | 6 |
U.S. Codes: | 002,012,013,014,023,025,050 |
International Codes: | 9 |
U.S. Codes: | 021,023,026,036,038 |
Type Code | Type |
---|---|
GS0011 | Agents for use in soldering in microelectronic industry; soldering pastes |
GS0091 | Lead-free solder, namely, tin comprising solder, for the microelectronics industry, in particular the microelectronics chip industry; all of the above-mentioned goods for use in chip production, namely, for use as soldering pastes comprising solder metal and/or its alloys and flux, conductive inks comprising solder metal and/or its alloys and flux for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches or line space from 100 nanometers to 200 micrometers; all the above-mentioned goods for use in chip production, namely, for use in the production of surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuit boards with pitches or line space from 100 nanometers up to 200 micrometers; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry or iron-containing components, or in the field of gas and water pipes; all aforementioned goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC) |
Description | Date | Proceeding Number |
---|---|---|
NEW APPLICATION ENTERED IN TRAM | 2021-10-14 |
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