WELCO

Heraeus Deutschland GmbH & Co. KG

Application Filed: 2021-10-11
Trademark Application Details
Trademark Logo WELCO

Mark For: WELCO™ trademark registration is intended to cover the categories of agents for use in soldering in microelectronic industry; soldering pastes.

Status

2021-10-14 UTC
LIVE APPLICATION Awaiting Examination
The trademark application has been accepted by the Office (has met the minimum filing requirements) and has not yet been assigned to an examiner.


Research OneLook Acronym Finder
Serial Number97068631
Mark Literal ElementsWELCO
Mark Drawing Type4 - STANDARD CHARACTER MARK
Mark TypeTrademark
Current LocationNEW APPLICATION PROCESSING 2021-10-14
Basis44(d)
Class StatusACTIVE
Primary US Classes
  • 001: Raw or Partly Prepared Materials
  • 005: Adhesives
  • 006: Chemicals and Chemical Compositions
  • 010: Fertilizers
  • 026: Measuring and Scientific Appliances
  • 046: Foods and Ingredients of Foods
Primary International Class
  • 001 - Primary Class
  • (Chemicals) Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
Filed UseNo
Current UseNo
Intent To UseNo
Filed ITUNo
44D FiledYes
44E CurrentNo
66A CurrentNo
Current BasisNo
No BasisNo
Attorney NameNathaniel Kramer
Attorney Docket NumberBendele 806

Timeline

2021-10-11Application Filed
2021-10-14Location: NEW APPLICATION PROCESSING
2021-10-14Status: Live/Pending
2021-10-14Status: New application will be assigned to an examining attorney approximately 6 months after filing date.
2021-10-14Transaction Date

Trademark Parties (Applicants & Owners)

Party: Heraeus Deutschland GmbH & Co. KG
AddressHeraeusstr. 12-14 Hanau GERMANY 63450
Legal Entity TypeGmbh & Co. Kg
Legal Entity StateGERMANY
Party: Heraeus Deutschland GmbH & Co. KG
Entity Statementgmbh & co. kg
AddressHeraeusstr. 12-14 Hanau DE 63450
Legal Entity Type
Legal Entity State DE

*multiple parties listed, check assignment documents for ownership information

Documents

ApplicationMULTI2021-10-11
DrawingJPEG2021-10-11

Attorney of Record

NATHANIEL KRAMER
KIRSCHSTEIN ISRAEL SCHIFFMILLER & PIERON
425 FIFTH AVENUE
FIFTH FLOOR
NEW YORK, NY 10016

Good, Services, and Codes

International Codes:1
U.S. Codes:001,005,006,010,026,046
International Codes:2
U.S. Codes:006,011,016
International Codes:6
U.S. Codes:002,012,013,014,023,025,050
International Codes:9
U.S. Codes:021,023,026,036,038
Type CodeType
GS0011Agents for use in soldering in microelectronic industry; soldering pastes
GS0091Lead-free solder, namely, tin comprising solder, for the microelectronics industry, in particular the microelectronics chip industry; all of the above-mentioned goods for use in chip production, namely, for use as soldering pastes comprising solder metal and/or its alloys and flux, conductive inks comprising solder metal and/or its alloys and flux for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches or line space from 100 nanometers to 200 micrometers; all the above-mentioned goods for use in chip production, namely, for use in the production of surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuit boards with pitches or line space from 100 nanometers up to 200 micrometers; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry or iron-containing components, or in the field of gas and water pipes; all aforementioned goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC)

Trademark Filing History

DescriptionDateProceeding Number
NEW APPLICATION ENTERED IN TRAM2021-10-14

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