ECAPTURE

eYs3D Microelectronics, Co.

Application Filed: 2021-10-06
Trademark Application Details
Trademark Logo ECAPTURE

Mark For: ECAPTURE™ trademark registration is intended to cover the categories of computer software in the field of collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition, and VR (Virtual Reality) , AR (Augmented Reality) and MR(Mixed Reality); Electronic hardware and software for use in collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Electronic security apparatus and surveillance apparatus; Software and electronic hardware utilizing eye and gesture tracking technology; Algorithm software programs for collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Semiconductor chip sets for use in enabling image signal processing; Integrated circuits and integrated circuit cores for use in image signal processing; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Chipsets; Semiconductor chip sets; Microchips (computer hardware); Silicon chips; Semiconductor chips; Multiprocessor chips; Computer chips; integrated circuits; IC; micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer hardware; computer components; computer circuits; Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Electric and electronic circuits; Wafers for integrated circuits; Integrated circuit cards and components; Integrated circuit module; Semiconductors; Semiconductor devices; Semiconductor wafers; chip sets, and modules for 3D sensing, 3D sensor fusion and 3D perception.

Status

2021-10-10 UTC
LIVE APPLICATION Awaiting Examination
The trademark application has been accepted by the Office (has met the minimum filing requirements) and has not yet been assigned to an examiner.


Research OneLook Acronym Finder
Serial Number97062724
Mark Literal ElementsECAPTURE
Mark Drawing Type4 - STANDARD CHARACTER MARK
Mark TypeTrademark
Current LocationNEW APPLICATION PROCESSING 2021-10-09
Basis1(b)
Class StatusACTIVE
Primary US Classes
  • 021: Electrical Apparatus, Machines and Supplies
  • 023: Cutlery, Machinery, Tools and Parts Thereof
  • 026: Measuring and Scientific Appliances
  • 036: Musical Instruments and Supplies
  • 038: Prints and Publications
Primary International Class
  • 009 - Primary Class
  • (Electrical and scientific apparatus) Scientific, nautical, surveying, electric, photographic, cinematographic, optical, weighing, measuring, signaling, checking (supervision), lifesaving and teaching apparatus and instruments; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire-extinguishing apparatus.
Filed UseNo
Current UseNo
Intent To UseYes
Filed ITUYes
44D FiledNo
44E CurrentNo
66A CurrentNo
Current BasisNo
No BasisNo
Attorney NamePaulo A. de Almeida

Timeline

2021-10-06Application Filed
2021-10-09Location: NEW APPLICATION PROCESSING
2021-10-09Status: Live/Pending
2021-10-09Status: New application will be assigned to an examining attorney approximately 6 months after filing date.
2021-10-09Transaction Date

Trademark Parties (Applicants & Owners)

Party: eYs3D Microelectronics, Co.
Address2F., No. 22, LN. 35, JIHU Rd. NEIHU Dist. Taipei City TAIWAN 114
Legal Entity TypeCorporation
Legal Entity StateTAIWAN

Documents

ApplicationMULTI2021-10-06
DrawingJPEG2021-10-06

Attorney of Record

PAULO A. DE ALMEIDA
PATEL & ALMEIDA, P. C.
16830 VENTURA BLVD., SUITE 360
ENCINO, CA 91436

Good, Services, and Codes

International Codes:9
U.S. Codes:021,023,026,036,038
Type CodeType
GS0091Computer software in the field of collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition, and VR (Virtual Reality) , AR (Augmented Reality) and MR(Mixed Reality); Electronic hardware and software for use in collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Electronic security apparatus and surveillance apparatus; Software and electronic hardware utilizing eye and gesture tracking technology; Algorithm software programs for collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Semiconductor chip sets for use in enabling image signal processing; Integrated circuits and integrated circuit cores for use in image signal processing; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Chipsets; Semiconductor chip sets; Microchips (computer hardware); Silicon chips; Semiconductor chips; Multiprocessor chips; Computer chips; integrated circuits; IC; micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer hardware; computer components; computer circuits; Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Electric and electronic circuits; Wafers for integrated circuits; Integrated circuit cards and components; Integrated circuit module; Semiconductors; Semiconductor devices; Semiconductor wafers; chip sets, and modules for 3D sensing, 3D sensor fusion and 3D perception

Trademark Filing History

DescriptionDateProceeding Number
NEW APPLICATION ENTERED IN TRAM2021-10-09

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