HSP

Taiyo Holdings Co., Ltd.

Application Filed: 2021-08-11
Trademark Application Details
Trademark Logo HSP

Mark For: HSP™ trademark registration is intended to cover the categories of chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; thermal interface materials for electronic components.

Status

2021-08-14 UTC
LIVE APPLICATION Awaiting Examination
The trademark application has been accepted by the Office (has met the minimum filing requirements) and has not yet been assigned to an examiner.


Website www.taiyo-hd.co.jp/jp whois domain owner info
Research OneLook Acronym Finder
Serial Number90877083
Mark Literal ElementsHSP
Mark Drawing Type4 - STANDARD CHARACTER MARK
Mark TypeTrademark
Current LocationNEW APPLICATION PROCESSING 2021-08-14
Basis1(b)
Class StatusACTIVE
Primary US Classes
  • 001: Raw or Partly Prepared Materials
  • 005: Adhesives
  • 006: Chemicals and Chemical Compositions
  • 010: Fertilizers
  • 026: Measuring and Scientific Appliances
  • 046: Foods and Ingredients of Foods
Primary International Class
  • 001 - Primary Class
  • (Chemicals) Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
Filed UseNo
Current UseNo
Intent To UseYes
Filed ITUYes
44D FiledNo
44E CurrentNo
66A CurrentNo
Current BasisNo
No BasisNo
Attorney NameKumiko Ide
Attorney Docket NumberTM210152US00

Timeline

2021-08-11Application Filed
2021-08-14Location: NEW APPLICATION PROCESSING
2021-08-14Status: Live/Pending
2021-08-14Status: New application will be assigned to an examining attorney approximately 3 months after filing date.
2021-08-14Transaction Date

Trademark Parties (Applicants & Owners)

Party: TAIYO HOLDINGS CO., LTD.
Address388 Ohkura, Ranzan-machi, Hiki-gun Saitama JAPAN 355-0222
Legal Entity TypeCorporation
Legal Entity StateJAPAN

Documents

ApplicationMULTI2021-08-11
DrawingJPEG2021-08-11

Attorney of Record

KUMIKO IDE
WESTERMAN, HATTORI, DANIELS & ADRIAN LLP
8500 LEESBURG PIKE SUITE 7500
TYSONS, VA 22182

Good, Services, and Codes

International Codes:1
U.S. Codes:001,005,006,010,026,046
International Codes:2
U.S. Codes:006,011,016
International Codes:17
U.S. Codes:001,005,012,013,035,050
Type CodeType
GS0011Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; thermal interface materials for electronic components

Trademark Filing History

DescriptionDateProceeding Number
NEW APPLICATION ENTERED IN TRAM2021-08-14

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