THERMAGON

Mark For: THERMAGON™ trademark registration is intended to cover the category of conductive silicon packing for managing electro-magnetic interference. [all]

Status

2022-01-05 UTC
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LIVE APPLICATION Under Examination

Research	OneLook Acronym Finder
Serial Number	90340629
Mark Literal Elements	THERMAGON
Mark Drawing Type	4 - STANDARD CHARACTER MARK
Mark Type	TRADEMARK
Register	PRINCIPAL
Current Location	TMO LAW OFFICE 130 - EXAMINING ATTORNEY ASSIGNED 2021-10-25
Basis	1(b)
Class Status	ACTIVE
Primary US Classes	021: Electrical Apparatus, Machines and Supplies 023: Cutlery, Machinery, Tools and Parts Thereof 026: Measuring and Scientific Appliances 036: Musical Instruments and Supplies 038: Prints and Publications
Primary International Class	009 - Primary Class (Electrical and scientific apparatus) Scientific, nautical, surveying, electric, photographic, cinematographic, optical, weighing, measuring, signaling, checking (supervision), lifesaving and teaching apparatus and instruments; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire-extinguishing apparatus.
Filed Use	No
Current Use	No
Intent To Use	Yes
Filed ITU	Yes
44D Filed	No
44E Current	No
66A Current	No
Current Basis	No
No Basis	No
Attorney Name	Joseph E. Walsh, Jr.
Attorney Docket Number	9062F-200517

Timeline

IC 009. US 021 023 026 036 038. G & S: Conductive silicon packing for managing electro-magnetic interference
IC 017. US 001 005 012 013 035 050. G & S: Thermally conductive thermoplastics, namely, semi-processed thermoplastics in molded, extruded and sheet form; Microwave absorbers, namely, pastes, pads, gels, and molded / extruded shapes, comprised of foams, elastomers, and polymers loaded with magnetic particles; Conducting and protective interlayer conductive materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Conductive contacts, namely, fabric over foam contacts, foil over foam contacts, spring contacts, and surface mount device contacts, for providing an electrical connection between two surfaces in electronic devices; Insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Conductive foam, namely, sheets, pads, strips, and die-cut shapes, for use in conducting heat and electricity; Conductive tape for electromagnetic radiation shielding in electronic products; Decorative electromagnetic interference (EMI) shielding metals, namely, conductive metal sheets having a decorative finish thereon, for EMI shielding in electronics; structural EMI shielding metals, namely, in the form of metal board level shields; EMI shielding wire mesh and knitted wire, namely, in the form of gaskets; Electromagnetic interference (EMI) shielding products, namely, EMI shielding contacts, EMI spring contacts, EMI shielding user interface shields and EMI combination shields, EMI board level shielding and customer designed EMI shielding; Electromagnetic interference shielding gaskets, namely, fabric over foam gaskets, foil over film gaskets, and fingerstocks; conductive elastomers, namely, synthetic elastomers in the form of pads, or as molded, die cut or extruded shapes, for use as components in electronics; Form-in-place non-metal gaskets for electronic devices; Vent panels, namely, metal plated rigid structures that provide EMI shielding and permit air flow to electronic components; Thermal interface materials and phase change thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermally conductive PCB (printed circuit board) materials, namely, films and sheets made out of resins for use in manufacturing electronic circuit boards; Thermally conductive thermoplastics, namely, semi-processed thermoplastics in molded, extruded, and sheet form; Conductive plastics and elastomers, namely, putties, greases, pads, and sheets for use in the management of electromagnetic radiation and heat in electronic devices; absorbing plastics and elastomers for use in absorbing electromagnetic radiation in electronic devices