Mark For: SNOWFLAKE™ trademark registration is intended to cover the categories of
Research | OneLook Acronym Finder |
Serial Number | 90041791 |
Mark Literal Elements | SNOWFLAKE |
Mark Drawing Type | 4 - STANDARD CHARACTER MARK |
Mark Type | Trademark, Service Mark |
Current Location | NEW APPLICATION PROCESSING 2020-07-11 |
Basis | 1(b) |
Class Status | ACTIVE |
Primary US Classes |
|
Primary International Class |
|
Filed Use | No |
Current Use | No |
Intent To Use | Yes |
Filed ITU | Yes |
44D Filed | No |
44E Current | No |
66A Current | No |
Current Basis | No |
No Basis | No |
Attorney Name | Adam D. Mandell |
Attorney Docket Number | UNI-0014-T |
2020-07-08 | Application Filed |
2020-07-11 | Location: NEW APPLICATION PROCESSING |
2020-07-11 | Status: Live/Pending |
2020-07-11 | Status: New application will be assigned to an examining attorney approximately 3 months after filing date. |
2020-07-11 | Transaction Date |
Party: | AAC Technologies Holdings Inc. |
Address | PO Box 2681 Cricket Sq. Hutchins Dr. Grand Cayman CAYMAN ISLANDS 1-1111 |
Legal Entity Type | Corporation |
Legal Entity State | CAYMAN ISLANDS |
Application | MULTI | 2020-07-08 |
Drawing | JPEG | 2020-07-08 |
International Codes: | 9 |
U.S. Codes: | 021,023,026,036,038 |
International Codes: | 42 |
U.S. Codes: | 100,101 |
Type Code | Type |
---|---|
GS0091 | cabinets for loudspeakers; acoustic diaphragms; speaker microphones; microphones; sound transmitting apparatus; horns for loudspeakers; digital sound processors; headsets for telephones; headsets for use with computers; headsets for remote communication; acoustic conduits; acoustic couplers; audio interfaces; audio speakers for automobiles; wireless headset for smartphones; headsets for mobile telephones; audio equipment for vehicles; computer peripheral devices; recorded computer operating programs; recorded computer programs, for haptic feedback of mobile phones, tablet computers, and computing devices; electronic chips for the manufacture of integrated circuits; integrated circuits, integrated circuit chips, and integrated circuit modules for digital video compression and decompression; sensors, for sound producing and sound transmitting apparatus; optical sensors; electric sensors |
Description | Date | Proceeding Number |
---|---|---|
NEW APPLICATION ENTERED IN TRAM | 2020-07-11 |
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